B81C1/00277 - CPC Classification Index

ClassID:

83951 ⎘

B81C1/00277 - CPC Classification

Classification description:

Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems; Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS

Sub-classes:

B81C1/00285 » {using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters} 225
B81C1/00293 » {maintaining a controlled atmosphere with processes not provided for in } 244

Recent Application in this class:

20250368501

2025-12-04

BARRIER STRUCTURE WITHIN A MICROELECTRONIC ENCLOSURE

20250026630

2025-01-23

INERTIAL SENSOR AND METHOD FOR FORMING THE SAME

20240002218

2024-01-04

MICROMECHANICAL STRUCTURE WITH BONDED COVER

20230382718

2023-11-30

METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE

20230294978

2023-09-21

STRUCTURE FOR MICROELECTROMECHANICAL SYSTEMS (MEMS) DEVICES TO CONTROL PRESSURE AT HIGH TEMPERATURE

20220411260

2022-12-29

Semiconductor structure and method for manufacturing thereof

20220315414

2022-10-06

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

20220089434

2022-03-24

Structure for microelectromechanical systems (MEMS) devices to control pressure at high temperature

20210221678

2021-07-22

Microelectromechanical structure with bonded cover

#10

20210188627

2021-06-24

Particle filter for MEMS device

#11

20210087055

2021-03-25

Structure for microelectromechanical systems (MEMS) devices to control pressure at high temperature

#12

20200079646

2020-03-12

Encapsulated microelectromechanical structure

#13

20190055121

2019-02-21

Encapsulated microelectromechanical structure

#14

20180312397

2018-11-01

Method for manufacturing a micromechanical inertial sensor

#15

20180299589

2018-10-18

Method for protecting a MEMS unit against infrared investigations and MEMS unit

#16

20180044176

2018-02-15

Encapsulated microelectromechanical structure

#17

20170334714

2017-11-23

Integrated package containing MEMS acoustic sensor and pressure sensor

#18

20170283246

2017-10-05

Transducer package with integrated sealing

#19

20170197821

2017-07-13

Method for forming a micro-electro mechanical system (MEMS) including bonding a MEMS substrate to a CMOS substrate via a blocking layer

#20

20170190570

2017-07-06

Methods for mounting a MEMS sensor for in-stream measurements

#21

20170158495

2017-06-08

LASER RESEAL INCLUDING DIFFERENT CAP MATERIALS

#22

20170129772

2017-05-11

Semiconductor structure and method for fabricating the same

#23

20170113919

2017-04-27

Structures for reducing and preventing stress and tensions during processing of silicon with the aid of melting by a laser

#24

20170101310

2017-04-13

Encapsulated microelectromechanical structure

#25

20160304338

2016-10-20

Method for packaging a microelectronic device in a hermetically sealed cavity and managing the atmosphere of the cavity with a dedicated hole

#26

20160176705

2016-06-23

SYSTEMS AND METHODS FOR FORMING MEMS ASSEMBLIES INCORPORATING GETTERS

#27

20160167950

2016-06-16

Encapsulated microelectromechanical structure

#28

20160122183

2016-05-05

Lid and method for sealing a non-magnetic package

#29

20160096723

2016-04-07

MEMS die and methods with multiple-pressure sealing

#30

20150232330

2015-08-20

Micromechanical component having hermetic through-contacting, and method for producing a micromechanical component having a hermetic through-contacting

#31

20150104895

2015-04-16

Method of fabricating MEMS devices having a plurality of cavities

#32

20150084139

2015-03-26

Device, system and method for providing MEMS structures of a semiconductor package

#33

20150041928

2015-02-12

Wafer encapsulated microelectromechanical structure

#34

20140231934

2014-08-21

Electrical component and method of manufacturing the same

#35

20140008738

2014-01-09

MEMS die and methods with multiple-pressure sealing

#36

20120013020

2012-01-19

MEMS Device Comprising a Hermetically Sealed Cavity and Devices Obtained Thereof

#37