MEMS COMPONENT COMPRISING A MEMS ELEMENT HAVING A CAVITY AND COMPRISING AN ASIC COMPONENT

SEGMENTED GETTER OPENINGS FOR MICROMACHINED ULTRASOUND TRANSDUCERDEVICES

High-Vacuum Micro-Vacuum Cells

Transducer

DEVICE ENCAPSULATION USING PHYSICAL VAPOR DEPOSITION

Processing Methods for Wafer-Level Encapsulated MEMS Devices with Stable Cavity Pressure Over Temperature

ENCAPSULATED MEMS DEVICES

OVERMOULDED PRESSURE SENSOR WITH ENCAPSULATING GEL AND METAL COVER ON SUBSTRATE

PROCESS FOR MANUFACTURING A COMBINED MICROELECTROMECHANICAL DEVICE WITH A REDUCED CROSS-TALK AND CORRESPONDING COMBINED MICROELECTROMECHANICAL DEVICE

METHOD FOR MANUFACTURING A PACKAGING STRUCTURE

OUTGASSING MATERIAL COATED CAVITY FOR A MICRO-ELECTRO MECHANICAL SYSTEM DEVICE AND METHODS FOR FORMING THE SAME

MICRO-ELECTRO-MECHANICAL DEVICE HAVING CONTACT PADS THAT ARE PROTECTED AGAINST HUMIDITY AND MANUFACTURING PROCESS THEREOF

MICRO-ELECTRO-MECHANICAL SYSTEM PACKAGE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MAKING

RESONANCE DEVICE AND RESONANCE DEVICE MANUFACTURING METHOD

OUTGASSING MATERIAL COATED CAVITY FOR A MICRO-ELECTRO MECHANICAL SYSTEM DEVICE AND METHODS FOR FORMING THE SAME

PROCESS FLOW FOR THIN CONTACTLESS THERMAL SENSORS

METHOD FOR PRODUCING A MICROMECHANICAL DEVICE COMPRISING A CAVITY HAVING A MELT SEAL

EMBEDDED PERMEABLE POLYSILICON LAYER IN MEMS DEVICE FOR MULTIPLE CAVITY PRESSURE CONTROL

MICROMECHANICAL ENVIRONMENTAL BARRIER DEVICE

ELECTRONIC DEVICE, ELECTRONIC DEVICE MANUFACTURING APPARATUS, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

Systems of Getters for Microelectronics and Methods for Production Thereof

PIEZOELECTRIC MICROELECTROMECHANICAL RESONATOR DEVICE AND CORRESPONDING MANUFACTURING PROCESS

METHOD OF ATTACHING FILM

Outgassing material coated cavity for a micro-electro mechanical system device and methods for forming the same

3D DOME WAFER-LEVEL PACKAGE FOR OPTICAL MEMS MIRROR WITH REDUCED FOOTPRINT

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD FOR THE SAME

INERTIAL SENSOR, METHOD FOR MANUFACTURING INERTIAL SENSOR, AND INERTIAL MEASUREMENT UNIT

Micro-electromechanical system and method for producing same

Waterproof MEMS Pressure Sensor Package With A Metal Lid And An Embedded ePTFE Filter And Process Of Making

PROTECTIVE BONDLINE CONTROL STRUCTURE

METHOD FOR MANUFACTURING A CAPACITIVE PRESSURE SENSOR AND CAPACITIVE PRESSURE SENSOR

Wafer level package for device

Systems and methods for providing getters in microelectromechanical systems

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD FOR THE SAME

BARRIER STRUCTURE WITHIN A MICROELECTRONIC ENCLOSURE

Enclosures for Microphone Assemblies Including a Fluoropolymer Insulating Layer

Hermetically sealed housing with a semiconductor component and method for manufacturing thereof

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

Detachable MEMS package top cover

Electronic device and corresponding method

Hermetic housing comprising a getter, optoelectronic component or MEMS device incorporating such a hermetic housing and associated production method

Method to form a rough crystalline surface

Outgassing material coated cavity for a micro-electro mechanical system device and methods for forming the same

MEMS HERMETIC SEAL APPARATUS AND METHODS

SEMICONDUCTOR DEVICE PACKAGE CONTAINING A MEMS DEVICE AND METHOD FOR MANUFACTURING THE SAME

Outgassing material coated cavity for a micro-electro mechanical system device and methods for forming the same

Micromechanical device with perforated membrane

MEMs using outgassing material to adjust the pressure level in a cavity

Piezoelectric microelectromechanical resonator device and corresponding manufacturing process

Capping plate for panel scale packaging of MEMS products

Composite media protection for pressure sensor

SEGMENTED GETTER OPENINGS FOR MICROMACHINED ULTRASOUND TRANSDUCER DEVICES

Resonance device and method for producing resonance device

Micromechanical sensor device with improved liquid tightness protection

Apparatus having a bondline structure and a diffusion barrier with a deformable aperture

Selective gettering through phase segregation and temperature dependent storage and release structure for lubricant

Getter technology for micromachined ultrasonic transducer cavities

CMOS-MEMS structure and method of forming the same

High efficiency getter design in vacuum MEMS device

Method for producing a microelectromechanical component and wafer system

CMOS-MEMS integrated device without standoff in MEMS

Systems and methods for providing getters in microelectromechanical systems

Apparatus having a cavity structure and method for producing same

Method and apparatus for the monolithic encapsulation of a micro-scale inertial navigation sensor suite

Deposition of protective material at wafer level in front end for early stage particle and moisture protection

Process for encapsulation of a microelectronic device by easily manipulated thin or ultrathin substrates

Pressure sensor

Deposition of protective material at wafer level in front end for early stage particle and moisture protection

Hermetically sealed housing with a semiconductor component and method for manufacturing thereof

Pressure sensor generating a transduced signal with reduced ambient temperature dependence, and manufacturing method thereof

Sensor element having laser-activated getter material

CMOS-MEMS structure and method of forming the same

MEMS component having two different internal pressures

Systems and methods for providing getters in microelectromechanical systems

Apparatus having a cavity structure and method for producing same

Micro-device having a plurality of mobile elements arranged in a plurality of embedded cavities

Method for manufacturing a device comprising a hermetically sealed vacuum housing and getter

Integrated particle filter for MEMS device

Pressure sensor

Micro three-dimensional shell resonator gyroscope

Gasses for increasing yield and reliability of MEMS devices

Hermetically sealed MEMS device and its fabrication

Micro-mechanical component

Use of a reactive, or reducing gas as a method to increase contact lifetime in micro contact MEMS switch devices

Anti-getter: expandable polymer microspheres for MEMS devices

Cavity type pressure sensor device

Integrated package containing MEMS acoustic sensor and pressure sensor

Getter electrode to improve vacuum level in a microelectromechanical systems (MEMS) device

Methods for fabricating electronic devices including substantially hermetically sealed cavities and getter films

Electro-optic device, electronic apparatus, and method of manufacturing electro-optic device

Integrated circuit package with sensor and method of making

Microelectromechanical systems (MEMS) devices at different pressures

Use of a reactive, or reducing gas as a method to increase contact lifetime in micro contact mems switch devices

Selective nitride outgassing process for MEMS cavity pressure control

Method for manufacturing a micromechanical component

Membrane transducer structures and methods of manufacturing same using thin-film encapsulation

CMOS-MEMS integrated device including multiple cavities at different controlled pressures and methods of manufacture

Method of making a closed cavity comprising a flap protecting the cavity when it is closed

Getter device for a micromechanical component

LASER RESEAL HAVING SPECIAL DIAPHRAGM STRUCTURE

Hermetically sealed MEMS device and its fabrication

Method for manufacturing a device comprising a hermetically sealed vacuum housing and getter

Semiconductor sensing structure

Method of forming a protective coating for a packaged semiconductor device

Cavity pressure modification using local heating with a laser

MEMS DEVICE, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Mechanisms for forming micro-electro mechanical system device

Apparatus and Method For Protecting a Micro-Electro-Mechanical System

Pressure sensor generating a transduced signal with reduced ambient temperature dependence, and manufacturing method thereof

Methods and structures for thin-film encapsulation and co-integration of same with microelectronic devices and microelectromechanical systems (MEMS)

Trapped sacrificial structures and methods of manufacturing same using thin-film encapsulation

Electronic devices including substantially hermetically sealed cavities and getter films with Kelvin measurement arrangement for evaluating the getter films and methods for fabricating the same

Integrated circuit package with sensor and method of making

Pressure sensor

Electromechanical device including a suspended structure and method of fabricating the same

Sealed Infrared Imagers and Sensors

Getter, MEMS device and method of forming the same

SYSTEMS AND METHODS FOR FORMING MEMS ASSEMBLIES INCORPORATING GETTERS

Multi-level getter structure and encapsulation structure comprising such a multi-level getter structure

Method for hermetically sealing with reduced stress

DISPLAY INCLUDING SENSORS

MEMS device having a getter

Package structure including a cavity coupled to an injection gas channel composed of a permeable material

Environmental sensor structure

MEMS device with getter layer

Method of improving getter efficiency by increasing superficial area

MEMS Chip and Manufacturing Method Thereof

Microelectrochemical systems (MEMS) device having a seal layer arranged over or lining a hole in fluid communication with a cavity of the MEMS device

Microelectromechanical systems device package and method for producing the microelectromechanical systems device package

Semiconductor device and method of manufacturing the same

Trapped sacrificial structures and methods of manufacturing same using thin-film encapsulation

Pressure sensor with geter embedded in membrane

Microelectromechanical component and manufacturing method for microelectromechanical components

Membrane transducer structures and methods of manufacturing same using thin-film encapsulation

Methods and structures for thin-film encapsulation and co-integration of same with microelectronic devices and microelectromechanical systems (MEMS)

MEMS package structure and method for fabricating the same

Micromechanical component and method for manufacturing same

Component including two semiconductor elements, between which at least two hermetically sealed cavities are formed and method for establishing a corresponding bonding connection between two semiconductor elements

Component including two semiconductor elements between which at least two hermetically tightly sealed cavities having different internal pressures are formed and method for manufacturing such a component

ELECTRONIC COMPONENT AND MANUFACTURING METHOD OF THE SAME

MEMS device and method of forming the same

MEMS device having a getter structure and method of forming the same

Hermetic encapsulation for microelectromechanical systems (MEMS) devices

Semiconductor arrangement with thermal insulation configuration

MEMS DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor die with high pressure cavity

Method of limiting capillary action of gel material during assembly of pressure sensor

Integrated heater for gettering or outgassing activation

MEMS device with sealed cavity and method for fabricating same

Encapsulation structure comprising trenches partially filled with getter material

Devices including, methods using, and compositions of reflowable getters

MEMS devices, packaged MEMS devices, and methods of manufacture thereof

Structures and formation methods of micro-electro mechanical system device

Layer arrangement and a wafer level package comprising the layer arrangement

Micromechanical sensor device with a getter in an enclosed cavity

Method of fabricating MEMS devices having a plurality of cavities

Method of improving getter efficiency by increasing superficial area

Sealed MEMS devices with multiple chamber pressures

Side vented pressure sensor device

Cup-like getter scheme

Encapsulation structure including a mechanically reinforced cap and with a getter effect

Thin film capping

Process for encapsulating a microelectronic device comprising injection of noble gas through a material permeable to this noble gas

MEMS sensor packaging and method thereof

Method of encapsulating a micro-device by anodic bonding

Implantation of gaseous chemicals into cavities formed in intermediate dielectrics layers for subsequent thermal diffusion release

SOI wafer, manufacturing method therefor, and MEMS device

Micromechanical component

Method of encapsulating a microelectronic device

MEMS devices, packaged MEMS devices, and methods of manufacture thereof

Integrated getter area for wafer level encapsulated microelectromechanical systems

SOI wafer, manufacturing method therefor, and MEMS device

Process for making a structure with hermetically closed cavity under controlled atmosphere

Method for the production of a substrate comprising embedded layers of getter material

Structure for hermetic encapsulation of a device and an electronic component

METHOD AND APPARATUS FOR APPLICATION OF ANTI-STICTION COATING

Devices including, methods using, and compositions of reflowable getters

Process for encapsulating a micro-device by attaching a cap and depositing getter through the cap

Structure for encapsulating an electronic device

RELEASE ACTIVATED THIN FILM GETTER

THIN FILM DESICCANT AND METHOD OF FABRICATION

Deposition/bonding chamber for encapsulated microdevices and method of use

Sealed cavity and method for producing such a sealed cavity

Inductive getter activation for high vacuum packaging

Method and device for packaging a substrate

Devices including, methods using, and compositions of reflowable getters

Devices including, methods using, and compositions of reflowable getters

Manufacturing method of combined sensor

Integrated getter area for wafer level encapsulated microelectromechanical systems

Treatment method of a getter material and encapsulation method of such getter material

Optimization of desiccant usage in a MEMS package

Display device with desiccant

Micromechanical housing comprising at least two cavities having different internal pressure and/or different gas compositions and method for the production thereof

Reduced stiction and mechanical memory in MEMS devices

Method of encapsulating a microelectronic device by a getter material

Getter formed by laser-treatment and methods of making same

Vacuum package and manufacturing process thereof

Method and device for packaging a substrate

Etching/bonding chamber for encapsulated devices and method of use

Gettering material for encapsulated microdevices and method of manufacture

Hermetic packaging and method of manufacture and use therefore

Process for manufacturing micromechanical devices containing a getter material and devices so manufactured

System and method for direct bonding of substrates

Method for low-temperature sealing of a cavity under vacuum or under controlled atmosphere

Thin film getter protection

Airtight package comprising a pressure adjustment unit

Process for the formation of miniaturized getter deposits and getter deposits so obtained

Wafer-level packaging of micro devices

Support device with discrete getter material microelectronic devices

Encapsulated microcomponent equipped with at least one getter

Devices including, methods using, and compositions of reflowable getters

Support with integrated deposit of gas absorbing material for manufacturing microelectronic microoptoelectronic or micromechanical devices

Method for sealing and backside releasing of microelectromechanical systems

Packaging a MEMS device using a frame

MEMS devices and processes for packaging such devices

Encapsulation in a hermetic cavity of a microelectronic composite, particularly of a MEMS

Support with integrated deposit of gas absorbing material for manufacturing microelectronic, microoptoelectronic or micromechanical devices

Wafer level packaging to lidded chips

MEMS device packaging methods

Electronic component packaging

System and method for transferring structured material to a substrate

Preparation of getter surfaces using caustic chemicals

System and method for direct-bonding of substrates

Microelectronic device

Integrated getter area for wafer level encapsulated microelectromechanical systems

Method of fabricating a vacuum sealed microdevice package with getters

System and method for display device with activated desiccant

Method and device for packaging a substrate

System and method for transferring structured material to a substrate

Vacuum sealed microdevice packaging with getters

Methods for hermetic sealing of post media-filled MEMS package

System and methods for hermetic sealing of post media-filled MEMS package

Integrated getter area for wafer level encapsulated microelectromechanical systems

Process for manufacturing microelectronic, microoptoelectronic or micromechanical devices

Wafer structure with discrete gettering material

Device having a getter structure and a photomask

System and method of fabricating micro cavities

MEMS with small-molecule barricade

MEMS with small-molecule barricade

MEMS with small-molecule barricade

High efficiency getter design in vacuum MEMS device

MEMS with small-molecule barricade

Formation method of MEMS device structure with cavities

Semiconductor device and package and manufacturing method thereof

Method and apparatus for the monolithic encapsulation of a micro-scale inertial navigation sensor suite