Patents-Review.com
ClassID:

83954 ⎘

B81C1/00301 - CPC Classification

Classification description:

Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems; Processes for packaging MEMS devices Connecting electric signal lines from the MEMS device with external electrical signal lines, e.g. through vias

Recent Application in this class:
#1
20260091974
2026-04-02

WAFER LEVEL PACKAGE FOR DEVICE

 #2
20260036454
2026-02-05

PACKAGING FOR A SENSOR AND METHODS OF MANUFACTURING THEREOF

 #3
20250353735
2025-11-20

MEMS STRUCTURE WITH REDUCED PEELING AND METHODS FORMING THE SAME

 #4
20250326632
2025-10-23

SEMICONDUCTOR DEVICES AND RELATED METHODS

 #5
20250320116
2025-10-16

Stacked-die MEMS resonator

 #6
20250320115
2025-10-16

MEMS DEVICES SINGULATED BY PLASMA ETCH

 #7
20250153999
2025-05-15

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

 #8
20250145454
2025-05-08

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

 #9
20250136436
2025-05-01

MEMS SWITCH WITH PLANAR THROUGH GLASS VIAS (TGV)

 #10
20250019229
2025-01-16

STACKED-DIE MEMS RESONATOR

 #11
20240327206
2024-10-03

METHODS FOR FABRICATION OF MEMS DEVICE

 #12
20240327203
2024-10-03

METHOD FOR MANUFACTURING A MEMS TRANSDUCER DEVICE WITH THIN MEMBRANE, AND MEMS TRANSDUCER DEVICE

 #13
20240327200
2024-10-03

LOCKING MECHANISMS FOR PRECISION OFFSET/DEPLOYMENT OF MEMS STRUCTURES

 #14
20240317580
2024-09-26

MEMS DEVICE AND MANUFACTURING METHOD OF MEMS DEVICE

 #15
20240317578
2024-09-26

MEMS DEVICE AND MANUFACTURING METHOD OF MEMS DEVICE

 #16
20240272004
2024-08-15

PROCESS FLOW FOR THIN CONTACTLESS THERMAL SENSORS

 #17
20240199411
2024-06-20

VERTICALLY STACKED MEMS DEVICES AND CONTROLLER DEVICE

 #18
20240190700
2024-06-13

Semiconductor device and method of manufacturing semiconductor device

 #19
20240140782
2024-05-02

Semiconductor device and method for forming the same

 #20
20240116753
2024-04-11

METHOD FOR SEALING A MEMS DEVICE AND A SEALED MEMS DEVICE

 #21
20240116752
2024-04-11

PACKAGED CAVITY STRUCTURE AND MANUFACTURING METHOD THEREOF

 #22
20240044846
2024-02-08

MICROFABRICATED ULTRASONIC TRANSDUCERS AND RELATED APPARATUS AND METHODS

 #23
20240034619
2024-02-01

MEMS Structure with Reduced Peeling and Methods Forming the Same

 #24
20240002218
2024-01-04

MICROMECHANICAL STRUCTURE WITH BONDED COVER

 #25
20230417614
2023-12-28

MEMS PRESSURE SENSOR

 #26
20230399225
2023-12-14

Semiconductor device and method for forming the same

 #27
20230391611
2023-12-07

MEMS resonator system

 #28
20230319971
2023-10-05

METHODS OF MANUFACTURING PLASMA GENERATING CELLS FOR A PLASMA SOURCE

 #29
20230314197
2023-10-05

PACKAGING FOR A SENSOR AND METHODS OF MANUFACTURING THEREOF

 #30
20230314193
2023-10-05

PACKAGING FOR A SENSOR AND METHODS OF MANUFACTURING THEREOF

 #31
20230313376
2023-10-05

PACKAGING FOR A SENSOR AND METHODS OF MANUFACTURING THEREOF

 #32
20230308076
2023-09-28

Methods and devices for microelectromechanical resonators

 #33
20230207412
2023-06-29

TECHNIQUES TO ENABLE A FLIP CHIP UNDERFILL EXCLUSION ZONE

 #34
20230163103
2023-05-25

STACKED DIE PACKAGE AND METHODS OF FORMING THE SAME

 #35
20230060728
2023-03-02

SOC PMUT suitable for high-density system integration, array chip, and manufacturing method thereof

 #36
20230051438
2023-02-16

Methods and devices for microelectromechanical resonators

 #37
20230050181
2023-02-16

Wafer level package for device

 #38
20230034707
2023-02-02

PACKAGING STRUCTURES AND PACKAGING METHODS FOR ULTRASOUND-ON-CHIP DEVICES

 #39
20230002217
2023-01-05

SEMICONDUCTOR DEVICES AND RELATED METHODS

 #40
20220356059
2022-11-10

Stacked-die MEMS resonator

 #41
20220348454
2022-11-03

INTER-POLY CONNECTION FOR PARASITIC CAPACITOR AND DIE SIZE IMPROVEMENT

 #42
20220315413
2022-10-06

Sensing device and method for manufacturing sensing device

 #43
20220298008
2022-09-22

Semiconductor device and method of manufacturing semiconductor device

 #44
20220289560
2022-09-15

Semiconductor device and method of forming microelectromechanical systems (MEMS) package

 #45
20220250902
2022-08-11

Device for supporting MEMS and/or ASIC components

 #46
20220219970
2022-07-14

Chip package

 #47
20220178773
2022-06-09

PRESSURE SENSOR AND PACKAGING METHOD THEREOF

 #48
20220172506
2022-06-02

Integrated piezoelectric microelectromechanical ultrasound transducer (PMUT) on integrated circuit (IC) for fingerprint sensing

 #49
20220127138
2022-04-28

Electrical interconnection structure, electronic apparatus and manufacturing methods for the same

 #50
20220112077
2022-04-14

MEMS ENCAPSULATION STRUCTURE AND MANUFACTURING METHOD THEREOF

 #51
20220112076
2022-04-14

MEMS PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME

 #52
20220063988
2022-03-03

MEMS PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREFOR

 #53
20220063987
2022-03-03

MEMS PACKAGING STRUCTURE AND FABRICATION METHOD THEREFOR

 #54
20210371273
2021-12-02

RESONANCE DEVICE AND RESONANCE DEVICE MANUFACTURING METHOD

 #55
20210329386
2021-10-21

Sound producing package structure and method for packaging sound producing package structure

 #56
20210309512
2021-10-07

Method for manufacturing a MEMS sensor

 #57
20210300749
2021-09-30

Microelectromechanical system (MEMS) sensor packages and methods for producing microelectromechanical system sensor packages having a plurality of MEMS sensor chips

 #58
20210300748
2021-09-30

MEMS transducing apparatus and method of fabricating the same

 #59
20210261405
2021-08-26

Preparation method of bionic adhesive material with tip-expanded microstructural array

 #60
20210261404
2021-08-26

Electrical contacting and method for producing an electrical contacting

 #61
20210221678
2021-07-22

Microelectromechanical structure with bonded cover

 #62
20210183808
2021-06-17

Sensor systems and methods for providing sensor systems

 #63
20210179421
2021-06-17

Stacked-die MEMS resonator

 #64
20210156756
2021-05-27

MEMS pressure sensor

 #65
20210139317
2021-05-13

Electronic device and method for manufacturing an electronic device

 #66
20210130163
2021-05-06

SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME

 #67
20210087054
2021-03-25

Semiconductor component and method for producing same

 #68
20210061652
2021-03-04

Fabrication method for a MEMS device

 #69
20210061643
2021-03-04

Semiconductor sensor and method of manufacturing the same

 #70
20210032098
2021-02-04

Semiconductor package with flexible interconnect

 #71
20210032096
2021-02-04

Chip package and manufacturing method thereof

 #72
20210009406
2021-01-14

Semiconductor devices and related methods

 #73
20200407218
2020-12-31

Methods and devices for microelectromechanical resonators

 #74
20200400620
2020-12-24

Microfabricated ultrasonic transducers and related apparatus and methods

 #75
20200399119
2020-12-24

Semiconductor device and method of manufacturing semiconductor device

 #76
20200399117
2020-12-24

Semiconductor device and method of forming microelectromechanical systems (MEMS) package

 #77
20200388585
2020-12-10

Chip packages and methods for forming the same

 #78
20200385261
2020-12-10

Manufacturing of integrated circuit resonator

 #79
20200353268
2020-11-12

Packaging structure and packaging method for retinal prosthesis implanted chip

 #80
20200335462
2020-10-22

Chip packages and methods for forming the same

 #81
20200294878
2020-09-17

Integrated packaging devices and methods with backside interconnections

 #82
20200283292
2020-09-10

MEMS structure including a cap with a via

 #83
20200250393
2020-08-06

Integrated piezoelectric microelectromechanical ultrasound transducer (PMUT) on integrated circuit (IC) for fingerprint sensing

 #84
20200239299
2020-07-30

PACKAGING STRUCTURES AND PACKAGING METHODS FOR ULTRASOUND-ON-CHIP DEVICES

 #85
20200232860
2020-07-23

MEMS pressure sensor

 #86
20200231431
2020-07-23

Semiconductor manufacturing method and structure thereof

 #87
20200180948
2020-06-11

Method of manufacturing semiconductor device and semiconductor device

 #88
20200156933
2020-05-21

Method for producing packaged MEMS assemblies at the wafer level, and packaged MEMS assembly

 #89
20200152697
2020-05-14

Piezoelectric micromachined ultrasonic transducers and methods for fabricating thereof

 #90
20200136527
2020-04-30

MEMS actuation systems and methods

 #91
20200131030
2020-04-30

Shielded semiconductor device and lead frame therefor

 #92
20200131028
2020-04-30

CMOS-MEMS integration with through-chip via process

 #93
20200131027
2020-04-30

3D stack configuration for 6-axis motion sensor

 #94
20200131026
2020-04-30

Sensor device with flip-chip die and interposer

 #95
20200115220
2020-04-16

Wafer-level fan-out package with enhanced performance

 #96
20200079646
2020-03-12

Encapsulated microelectromechanical structure

 #97
20200062633
2020-02-27

Hermetic conductive feedthroughs for a semiconductor wafer

 #98
20200062588
2020-02-27

MEMS devices and methods of forming same

 #99
20200062587
2020-02-27

Semiconductor arrangement and formation thereof

 #100
20200062585
2020-02-27

Sensor packages

 #101
20190382258
2019-12-19

CMOS-MEMS integrated device without standoff in MEMS

 #102
20190375627
2019-12-12

Wafer level package for a mems sensor device and corresponding manufacturing process

 #103
20190368958
2019-12-05

Overmolded lead frame assembly for pressure sensing applications

 #104
20190359481
2019-11-28

MEMS assembly and method for producing a MEMS assembly

 #105
20190315620
2019-10-17

Method for forming micro-electro-mechanical system (MEMS) structure

 #106
20190300362
2019-10-03

Deposition of protective material at wafer level in front end for early stage particle and moisture protection

 #107
20190292043
2019-09-26

Package structure for micromechanical resonator

 #108
20190292042
2019-09-26

Integrating diverse sensors in a single semiconductor device

 #109
20190284044
2019-09-19

Semiconductor device and manufacture thereof

 #110
20190253791
2019-08-15

Top port multi-part surface mount silicon condenser microphone

 #111
20190225488
2019-07-25

Methods and devices for microelectromechanical resonators

 #112
20190210869
2019-07-11

Complementary metal oxide semiconductor (CMOS) ultrasonic transducers and methods for forming the same

 #113
20190172805
2019-06-06

Chip packages and methods for forming the same

 #114
20190161347
2019-05-30

Method for manufacturing a micromechanical sensor

 #115
20190161345
2019-05-30

Deposition of protective material at wafer level in front end for early stage particle and moisture protection

 #116
20190161341
2019-05-30

Systems and methods for temperature sensor access in die stacks

 #117
20190152774
2019-05-23

MEMS SENSOR AND METHOD FOR MANUFACTURING SAME

 #118
20190144269
2019-05-16

Wafer level encapsulation for MEMS device

 #119
20190135618
2019-05-09

Method for manufacturing planar thin packages

 #120
20190127215
2019-05-02

Semiconductor apparatus having flexible connecting members and method for manufacturing the same

 #121
20190112185
2019-04-18

REDUCING VIBRATION OF A MEMS INSTALLATION ON A PRINTED CIRCUIT BOARD

 #122
20190106322
2019-04-11

LOW COST, LOW PROFILE, CERAMIC BUTTON SENSOR PACKAGING

 #123
20190106321
2019-04-11

Semiconductor component and method for producing same

 #124
20190103357
2019-04-04

METHODS OF FORMING PACKAGE ON PACKAGE ASSEMBLIES WITH REDUCED Z HEIGHT AND STRUCTURES FORMED THEREBY

 #125
20190101461
2019-04-04

Low cost overmolded leadframe force sensor with multiple mounting positions

 #126
20190092630
2019-03-28

Method for self-aligning solder-attached mems die to a mounting surface

 #127
20190092629
2019-03-28

Method For Self-Aligning Solder-Attached Mems Die To A Mounting Surface

 #128
20190084826
2019-03-21

Through silicon interposer wafer and method of manufacturing the same

 #129
20190077654
2019-03-14

Flush-mount micromachined transducers

 #130
20190074240
2019-03-07

Inorganic wafer having through-holes attached to semiconductor wafer

 #131
20190055121
2019-02-21

Encapsulated microelectromechanical structure

 #132
20190055118
2019-02-21

MEMS device package and method for manufacturing the same

 #133
20190047851
2019-02-14

MEMS devices and methods of forming same

 #134
20190047845
2019-02-14

Semiconductor device and method of forming microelectromechanical systems (MEMS) package

 #135
20190008479
2019-01-10

Method for producing MEMS transducer, MEMS transducer, ultrasound probe, and ultrasound diagnostic apparatus

 #136
20190002275
2019-01-03

Micro-electro-mechanical system (MEMS) structure including isolation ring at sidewalls of semiconductor via and method for forming the same

 #137
20180370790
2018-12-27

Inter-poly connection for parasitic capacitor and die size improvement

 #138
20180364201
2018-12-20

Microfabricated ultrasonic transducers and related apparatus and methods

 #139
20180346319
2018-12-06

Manufacturing method of semiconductor structure including heater

 #140
20180327258
2018-11-15

Method for producing packaged MEMS assemblies at the wafer level, and packaged MEMS assembly

 #141
20180327254
2018-11-15

MEMS pressure sensor and microphone devices having through-vias and methods of forming same

 #142
20180312395
2018-11-01

MEMS element, sealing structure, electronic device, electronic apparatus, and vehicle

 #143
20180297834
2018-10-18

MEMS package

 #144
20180290882
2018-10-11

SEMICONDUCTOR PACKAGES AND METHODS FOR FABRICATING SEMICONDUCTOR PACKAGES

 #145
20180265352
2018-09-20

Semiconductor device and manufacture thereof

 #146
20180261571
2018-09-13

Stackable microelectronic package structures

 #147
20180249242
2018-08-30

Top port multi-part surface mount MEMS microphone

 #148
20180222746
2018-08-09

Electronic systems with through-substrate interconnects and MEMS device

 #149
20180222745
2018-08-09

METHOD AND SYSTEM FOR MEMS DEVICES WITH DUAL DAMASCENE FORMED ELECTRODES

 #150
20180208458
2018-07-26

METHOD FOR MANUFACTURING A MICROELECTRONIC MEDIA SENSOR ASSEMBLY, AND MICROELECTRONIC MEDIA SENSOR ASSEMBLY

 #151
20180201501
2018-07-19

Capacitive micromachined ultrasonic transducer and method of fabricating the same

 #152
20180186628
2018-07-05

Complementary metal oxide semiconductor (CMOS) ultrasonic transducers and methods for forming the same

 #153
20180180829
2018-06-28

MICROFABRICATED OPTICAL APPARATUS WITH FLEXIBLE ELECTRICAL CONNECTOR

 #154
20180166850
2018-06-14

Microfabricated optical apparatus with grounded metal layer

 #155
20180155187
2018-06-07

Sensing device including a MEMS sensor and an adjustable amplifier

 #156
20180155186
2018-06-07

Low-profile stacked-die MEMS resonator system

 #157
20180148329
2018-05-31

Integrated circuit comprising multi-layer micromechanical structures with improved mass and reliability by using modified vias and method for forming the same

 #158
20180148322
2018-05-31

Semiconductor package with a through port for sensor applications

 #159
20180148317
2018-05-31

Semiconductor structure and method of manufacturing the same

 #160
20180141803
2018-05-24

MEMS component having low-resistance wiring and method for manufacturing it

 #161
20180138102
2018-05-17

Integrated packaging devices and methods with backside interconnections

 #162
20180127269
2018-05-10

Method for self-aligning solder-attached MEMS die to a mounting surface

 #163
20180123557
2018-05-03

Filter including bulk acoustic wave resonator

 #164
20180107854
2018-04-19

Integrated piezoelectric microelectromechanical ultrasound transducer (PMUT) on integrated circuit (IC) for fingerprint sensing

 #165
20180093882
2018-04-05

MEMS device, liquid ejecting head, liquid ejecting apparatus, method for manufacturing MEMS device

 #166
20180086627
2018-03-29

Integrating MEMS structures with interconnects and vias

 #167
20180086626
2018-03-29

Method of manufacturing a sensor

 #168
20180079641
2018-03-22

MEMS device, liquid ejecting head, and liquid ejecting apparatus

 #169
20180072565
2018-03-15

MEMS actuation systems and methods

 #170
20180072561
2018-03-15

MEMS actuation systems and methods

 #171
20180057354
2018-03-01

Semiconductor sensor and method of manufacturing the same

 #172
20180044176
2018-02-15

Encapsulated microelectromechanical structure

 #173
20180044170
2018-02-15

Wafer level package for a MEMS sensor device and corresponding manufacturing process

 #174
20180029881
2018-02-01

Vacuum sealed MEMS and CMOS package

 #175
20180029877
2018-02-01

Packages and methods of packaging sensors

 #176
20180022602
2018-01-25

Semiconductor arrangement and formation thereof

 #177
20180017449
2018-01-18

Low cost overmolded leadframe force sensor with multiple mounting positions

 #178
20180016135
2018-01-18

Two different conductive bump stops on CMOS-MEMS bonded structure

 #179
20180005969
2018-01-04

Side ported MEMS sensor device package and method of manufacturing thereof

 #180
20180005922
2018-01-04

Inorganic wafer having through-holes attached to semiconductor wafer

 #181
20180003678
2018-01-04

Microfabricated ultrasonic transducers and related apparatus and methods

 #182
20180002163
2018-01-04

3D MEMS device with hermetic cavity

 #183
20170355593
2017-12-14

Method and system for MEMS devices with dual damascene formed electrodes

 #184
20170352639
2017-12-07

METHOD FOR PROTECTING BOND PADS FROM CORROSION

 #185
20170329098
2017-11-16

MEMS electrical contact systems and methods

 #186
20170327370
2017-11-16

ALUMINUM NITRIDE (AlN) DEVICES WITH INFRARED ABSORPTION STRUCTURAL LAYER

 #187
20170315099
2017-11-02

Microfabricated ultrasonic transducers and related apparatus and methods

 #188
20170297903
2017-10-19

Semiconductor device and method of forming microelectromechanical systems (MEMS) package

 #189
20170283254
2017-10-05

Complementary metal oxide semiconductor (CMOS) ultrasonic transducers and methods for forming the same

 #190
20170283250
2017-10-05

Multi-pressure MEMS package

 #191
20170275158
2017-09-28

Integration of AIN ultrasonic transducer on a CMOS substrate using fusion bonding process

 #192
20170264997
2017-09-14

Top port multi-part surface mount silicon condenser microphone

 #193
20170233248
2017-08-17

MICRO SENSOR AND MANUFACTURING METHOD THEREOF

 #194
20170217767
2017-08-03

THROUGH SUBSTRATE VIAS USING SOLDER BUMPS

 #195
20170197821
2017-07-13

Method for forming a micro-electro mechanical system (MEMS) including bonding a MEMS substrate to a CMOS substrate via a blocking layer

 #196
20170187311
2017-06-29

Gas turbine engine and electrical system

 #197
20170129771
2017-05-11

Semiconductor structure and manufacturing method thereof

 #198
20170126323
2017-05-04

MICROFABRICATED OPTICAL APPARATUS

 #199
20170121171
2017-05-04

Electronic device having a bonding wire connected to a terminal at an alloyed portion

 #200
20170107097
2017-04-20

Inter-poly connection for parasitic capacitor and die size improvement

 #201
20170101310
2017-04-13

Encapsulated microelectromechanical structure

 #202
20170081178
2017-03-23

SEMICONDUCTOR DEVICE PACKAGE WITH SEAL STRUCTURE

 #203
20170081175
2017-03-23

Electronic sensor device including a flip-chip mounted semiconductor chip and a substrate with an opening

 #204
20170081174
2017-03-23

Integrating diverse sensors in a single semiconductor device

 #205
20170066647
2017-03-09

MEMS devices and methods of forming same

 #206
20170057808
2017-03-02

MEMS CHIP PACKAGE AND METHOD FOR MANUFACTURING THE SAME

 #207
20170044004
2017-02-16

Micro-electro-mechanical system and manufacturing method thereof

 #208
20170036308
2017-02-09

Thermally decomposable polymer compositions for forming microelectronic assemblies

 #209
20170030788
2017-02-02

MEMS PRESSURE SENSOR

 #210
20170029271
2017-02-02

Complementary metal oxide semiconductor (CMOS) ultrasonic transducers and methods for forming the same

 #211
20170029269
2017-02-02

Stacked-die MEMS resonator system

 #212
20170022054
2017-01-26

Aluminum nitride (AlN) devices with infrared absorption structural layer

 #213
20170001861
2017-01-05

Method of increasing MEMS enclosure pressure using outgassing material

 #214
20170001859
2017-01-05

MEMS pressure sensor and microphone devices having through-vias and methods of forming same

 #215
20170001858
2017-01-05

Electronic systems with through-substrate interconnects and MEMS device

 #216
20160363609
2016-12-15

Method of forming capacitive MEMS sensor devices

 #217
20160362297
2016-12-15

Method for producing a micro-electromechanical component and a micro-electromechanical component

 #218
20160362296
2016-12-15

CMOS-MEMS integrated device including a contact layer and methods of manufacture

 #219
20160347609
2016-12-01

MEMS packages and methods of manufacture thereof

 #220
20160325984
2016-11-10

CHIP SCALE PACKAGE

 #221
20160322325
2016-11-03

Coupling of side surface contacts to a circuit platform

 #222
20160304339
2016-10-20

Production process for device

 #223
20160297675
2016-10-13

SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING DEVICE

 #224
20160297673
2016-10-13

Device with vertically integrated sensors and method of fabrication

 #225
20160290970
2016-10-06

Microfabricated ultrasonic transducers and related apparatus and methods

 #226
20160290969
2016-10-06

Microfabricated ultrasonic transducers and related apparatus and methods

 #227
20160280539
2016-09-29

Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chips

 #228
20160280538
2016-09-29

Microfabricated ultrasonic transducers and related apparatus and methods

 #229
20160272488
2016-09-22

THROUGH ELECTRODE AND METHOD FOR PRODUCING MULTILAYER SUBSTRATE USING THROUGH ELECTRODE

 #230
20160243588
2016-08-25

METHOD FOR MANUFACTURING CAPACITIVE MICROMACHINED ULTRASONIC TRANSDUCER AND APPARATUS CONFIGURED TO OBTAIN SUBJECT INFORMATION USING THE CAPACITIVE MICROMACHINED ULTRASONIC TRANSDUCER

 #231
20160241951
2016-08-18

Top port multi-part surface mount silicon condenser microphone

 #232
20160229686
2016-08-11

Gyro MEMS sensor package

 #233
20160221824
2016-08-04

Method of wafer-level hermetic packaging with vertical feedthroughs

 #234
20160221038
2016-08-04

Capacitive micromachined ultrasonic transducer (CMUT) forming

 #235
20160214857
2016-07-28

Semiconductor device and method of forming MEMS package

 #236
20160207760
2016-07-21

Complementary metal oxide semiconductor (CMOS) ultrasonic transducers and methods for forming the same

 #237
20160207758
2016-07-21

Thin capping for MEMS devices

 #238
20160194198
2016-07-07

Semiconductor structures and fabrication method thereof

 #239
20160185593
2016-06-30

Wafer level package for a MEMS sensor device and corresponding manufacturing process

 #240
20160185592
2016-06-30

Method of selectively removing an anti-stiction layer on a eutectic bonding area

 #241
20160167958
2016-06-16

Through-wafer interconnects for MEMS double-sided fabrication process (TWIDS)

 #242
20160167951
2016-06-16

Low stress compact device packages

 #243
20160167950
2016-06-16

Encapsulated microelectromechanical structure

 #244
20160145094
2016-05-26

MICRO-ELELCTRO-MECHANICAL SYSTEM DEVICE AND METHOD FOR FABRICATING THE SAME

 #245
20160138921
2016-05-19

Manufacturing method of inertial sensor and inertial sensor

 #246
20160137491
2016-05-19

Micro-electromechanical apparatus with multiple chambers and method for manufacturing the same

 #247
20160134974
2016-05-12

Lead frame-based chip carrier used in the fabrication of MEMS transducer packages

 #248
20160126926
2016-05-05

Method of forming a resonator

 #249
20160107881
2016-04-21

Microelectromechanical system device with internal direct electric coupling

 #250
20160096724
2016-04-07

Stress isolation for MEMS device

 #251
20160093531
2016-03-31

Method for forming through substrate vias with tethers

 #252
20160093530
2016-03-31

METHOD FOR FORMING THROUGH SUBSTRATE VIAS

 #253
20160090294
2016-03-31

Package arrangement, a package, and a method of manufacturing a package arrangement

 #254
20160084865
2016-03-24

INTEGRATED ROTATION RATE AND ACCELERATION SENSOR AND METHOD FOR MANUFACTURING AN INTEGRATED ROTATION RATE AND ACCELERATION SENSOR

 #255
20160075552
2016-03-17

Component which can be produced at wafer level and method of production

 #256
20160075550
2016-03-17

MEMS ELEMENT AND MANUFACTURING METHOD OF THE SAME

 #257
20160052782
2016-02-25

Method for fabricating electronic device package

 #258
20160052779
2016-02-25

MEMS microphone packaging method

 #259
20160046485
2016-02-18

Systems and methods for improving MEMS gyroscope start time

 #260
20160039663
2016-02-11

Chip package and method of manufacturing the same

 #261
20160031703
2016-02-04

Method for manufacturing a microelectromechanical systems (MEMS) device with different electrical potentials and an etch stop

 #262
20160023888
2016-01-28

Methods and structures for thin-film encapsulation and co-integration of same with microelectronic devices and microelectromechanical systems (MEMS)

 #263
20160006414
2016-01-07

Methods and devices for microelectromechanical resonators

 #264
20160002027
2016-01-07

Semiconductor device with through molding vias and method of making the same

 #265
20160002026
2016-01-07

Methods and devices for microelectromechanical pressure sensors

 #266
20150360935
2015-12-17

Vertically hybridly integrated assembly having an interposer for stress-decoupling of a MEMS structure, and method for its manufacture

 #267
20150360934
2015-12-17

Microelectromechanical system and method for manufacturing a microelectromechanical system

 #268
20150353348
2015-12-10

Glass wafer assembly

 #269
20150344299
2015-12-03

Fabrication method of wafer level package having a pressure sensor

 #270
20150344297
2015-12-03

Capacitive sensors and methods for forming the same

 #271
20150344296
2015-12-03

Encapsulated component comprising a MEMS component and method for the production thereof

 #272
20150336792
2015-11-26

Internal electrical contact for enclosed MEMS devices

 #273
20150329351
2015-11-19

Vacuum sealed MEMS and CMOS package

 #274
20150323657
2015-11-12

Production method for ultrasonic probe, ultrasonic probe, and ultrasonic diagnosis device

 #275
20150321902
2015-11-12

Support structure for TSV in MEMS structure

 #276
20150315015
2015-11-05

Stacked semiconductor device and method of forming the same related cases

 #277
20150307344
2015-10-29

Sensor apparatus and method for producing a sensor apparatus

 #278
20150299509
2015-10-22

Thermally decomposable polymer compositions for forming microelectronic assemblies

 #279
20150298969
2015-10-22

Method of protecting microelectro mechanical system device

 #280
20150294926
2015-10-15

Module comprising a semiconductor chip

 #281
20150291415
2015-10-15

Hermetic encapsulation for microelectromechanical systems (MEMS) devices

 #282
20150274515
2015-10-01

Microelectronic packages having axially-partitioned hermetic cavities and methods for the fabrication thereof

 #283
20150274506
2015-10-01

MEMS acoustic transducer with silicon nitride backplate and silicon sacrificial layer

 #284
20150266719
2015-09-24

MEMS device and method of manufacturing the same

 #285
20150259195
2015-09-17

Mirco-electro-mechanical system module and manufacturing method thereof

 #286
20150259194
2015-09-17

Semiconductor device and method of forming microelectromechanical systems (MEMS) package

 #287
20150259193
2015-09-17

MEMS device and method of manufacturing the same

 #288
20150255372
2015-09-10

Through-silicon via (TSV)-based devices and associated techniques and configurations

 #289
20150251895
2015-09-10

Stacked semiconductor structure and method of forming the same

 #290
20150239732
2015-08-27

Semiconductor arrangement and formation thereof

 #291
20150232325
2015-08-20

MICRO ELECTRO MECHANICAL SYSTEMS PACKAGE AND MANUFACTURING METHOD THEREOF

 #292
20150225229
2015-08-13

Microelectromechanical system devices having through substrate vias and methods for the fabrication thereof

 #293
20150203347
2015-07-23

Semiconductor structure and method forming the same

 #294
20150200188
2015-07-16

Semiconductor package, semiconductor device and method of forming the same

 #295
20150200183
2015-07-16

Stackable microelectronic package structures

 #296
20150191345
2015-07-09

3D MEMS device and method of manufacturing

 #297
20150191344
2015-07-09

Methods of forming semiconductor structures including MEMS devices and integrated circuits on opposing sides of substrates, and related structures and devices

 #298
20150187730
2015-07-02

Stackable microelectronic package structures

 #299
20150183637
2015-07-02

Compact electronic package with MEMS IC and related methods

 #300
20150175407
2015-06-25

Micro electromechanical system sensor and method of forming the same