Semiconductor device and method of manufacturing

Method and structure of MEMS WLCSP fabrication

Semiconductor device with through molding vias

MEMS devices and methods of forming same

MEMS electrical contact systems and methods

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Mechanisms for forming micro-electro mechanical device

Capacitive micromachined ultrasonic transducer and method of fabricating the same

Low-profile stacked-die MEMS resonator system

MEMS device with integrated temperature stabilization

Sensor device packages and related fabrication methods

Substrate plate for MEMS devices

Hermetic conductive feedthroughs for a semiconductor wafer

MEMS package structure and manufacturing method thereof

PACKAGE-ON-PACKAGE SEMICONDUCTOR SENSOR DEVICE

MEMS device

Method and apparatus for fabricating electrostatic capacitance-type acceleration sensor and electrostatic capacitance-type acceleration sensor

Packaged microphone with multiple mounting orientations

Wafer encapsulated microelectromechanical structure

METHOD FOR MANUFACTURING ACOUSTIC WAVE DEVICE

Stacked die package for MEMS resonator system

Method of packaging integrated circuits and a molded package

Encapsulation structure including a mechanically reinforced cap and with a getter effect

Integrated circuit package and method

MEMS-CMOS integrated devices, and methods of integration at wafer level

Pre-mold for a microphone assembly and method of producing the same

PRESSURE SENSOR AND METHOD OF PACKAGING SAME

Gas turbine engine and electrical system

Wafer-level packaging of integrated devices, and manufacturing method thereof

Internal electrical contact for enclosed MEMS devices

Fabricating polysilicon MOS devices and passive ESD devices

Microelectromechanical device and a method of manufacturing

Microelectromechanical system devices having through substrate vias and methods for the fabrication thereof

Systems and methods for a pressure sensor having a two layer die structure

Stacked assembly of a MEMS integrated device having a reduced thickness

Internal electrical contact for enclosed MEMS devices

Stackable microelectronic package structures

Out-of-plane spacer defined electrode

Manufacturing methods for micro-electromechanical system device having electrical insulating structure

Packaging system and process for inertial sensor modules using moving-gate transducers

Wafer-level package and method for production thereof

MEMS devices

Method for manufacturing package structure with micro-electromechanical element

Packaging to reduce stress on microelectromechanical systems

MICROMECHANICAL COMPONENT AND METHOD FOR MANUFACTURING A MICROMECHANICAL COMPONENT

Capacitive sensors and methods for forming the same

Sealed packaging for microelectromechanical systems

Eutectic bonding of thin chips on a carrier substrate

Sensor comprising a multi-layered ceramic substrate and method for its production

Support structure for TSV in MEMS structure

Stackable microelectronic package structures

MEMS devices and methods of forming same

Semiconductor package and fabrication method thereof

Methods for forming MEMS devices

Thin back glass interconnect

Microelectro mechanical system encapsulation scheme

Low-temperature wafer level processing for MEMS devices

Method for producing an electrical feedthrough in a substrate, and a substrate having an electrical feedthrough

METHOD FOR PRODUCING A CAPPING WAFER FOR A SENSOR

Method for fabricating package structure having MEMS elements

Packaged device

BONDED DOUBLE SUBSTRATE APPROACH TO SOLVE LASER DRILLING PROBLEMS

Package having MEMS element and fabrication method thereof

Module comprising a semiconductor chip

Method of making a semiconductor device having a functional capping

Out-of-plane spacer defined electrode

Region-divided substrate, semiconductor device having region-divided substrate, and method for manufacturing the same

Through substrate structure, device package having the same, and methods for manufacturing the same

MEMS device with integral packaging

Micro-electromechanical system device having electrical insulating structure and manufacturing methods

WAFER LEVEL PACKAGING PROCESS FOR MEMS DEVICES

Laminated transferable interconnect for microelectronic package

Interconnection system on a plane adjacent to a solid-state device structure

Semi-conductor sensor fabrication

Integration manufacturing process for MEMS device

Package structure with micro-electromechanical element and manufacturing method thereof

Simplified copper-copper bonding

Surface mount silicon condenser microphone package

Method for Producing an Electrical Circuit and Electrical Circuit

Package structure

Wafer level package having a pressure sensor and fabrication method thereof

Component having a through-contact

Stacked die package for MEMS resonator system

Microelectromechanical device including an encapsulation layer of which a portion is removed to expose a substantially planar surface having a portion that is disposed outside and above a chamber and including a field region on which integrated circuits are formed, and methods for fabricating same

Surface mount silicon condenser microphone package

Integration manufacturing process for MEMS device

Semiconductor package and method of manufacturing the same

Method and apparatus for packaging circuit devices

Double-side mountable MEMS package

Low temperature wafer level processing for MEMS devices

Method for producing a capping wafer for a sensor

Encapsulation module method for production and use thereof

Electronic device package and method for forming the same

Packaged device and producing method thereof

Electronic device package and fabrication method thereof

Semiconductor device and method of making the same

Packaging for piezoelectric resonator

CONNECTING MICROSIZED DEVICES USING ABLATIVE FILMS

CONNECTING MICROSIZED DEVICES USING ABLATIVE FILMS

Wafer level packaged MEMS integrated circuit

Functional element package and fabrication method therefor

Method of fabricating packaged-device

MEMS package that includes MEMS device wafer bonded to cap wafer and exposed array pads

SYSTEMS AND METHODS FOR VERTICAL STACKED SEMICONDUCTOR DEVICES

Silicon Wafer Having Through-Wafer Vias With A Predetermined Geometric Shape

Approach to high temperature wafer processing

Method and apparatus for packaging circuit devices

Double-side mountable MEMS package

Process for sealing and connecting parts of electromechanical, fluid and optical microsystems and device obtained thereby

Fabrication of Compact Semiconductor Packages

Capacitive sensor and manufacturing method therefor

Hermetic chamber with electrical feedthroughs

Method of manufacturing substrate

Integration manufacturing process for MEMS device

Wafer level chip size package for MEMS devices and method for fabricating the same

Physical sensor and method of process

Semiconductor device

Silicon wafer having through-wafer vias

Electronic component package and method of manufacturing the same, and electronic component device

Wafer level device package with sealing line having electroconductive pattern and method of packaging the same

MEMS device with integral packaging

Connecting microsized devices using ablative films

Microelectromechanical device including an encapsulation layer of which a portion is removed to expose a substantially planar surface having a portion that is disposed outside and above a chamber and including a field region on which integrated circuits are formed and methods for fabricating same

Module comprising a semiconductor chip

PACKAGE AND METHOD FOR MAKING THE SAME

Microelectromechanical devices and fabrication methods

Electronic component and method for manufacturing the same

Substrate contact for a MEMS device

Method for manufacturing electronic component, and electronic component

Silicon Wafer Having Through-Wafer Vias With A Predetermined Geometric Shape

Flip-chip assembly of protected micromechanical devices

Cap Wafer for Wafer Bonded Packaging and Method for Manufacturing the Same

Method for fabricating a wafer level package having through wafer vias for external package connectivity

Structure and method of making sealed capped chips

Structure and method of making lidded chips

Firm, insulating and electrically conducting connection of processed semiconductor wafers

Methods of fabrication of wafer-level vacuum packaged devices

Method of fabricating a semiconductor chip package

Wafer level capped sensor

Structure and method of making lidded chips

Structure and method of making lidded chips

Stacked die package for MEMS resonator system

Method for fabricating MEMS device package that includes grinding MEMS device wafer to expose array pads corresponding to a cap wafer

APPARATUS AND METHOD FOR PROTECTIVE COVERING OF MICROELECTROMECHANICAL SYSTEM (MEMS) DEVICES

Method and apparatus for microjoining dissimilar materials

Methods and apparatus having an integrated circuit attached to fused silica

Silicon condenser microphone and manufacturing method

Silicon condenser microphone and manufacturing method

Wafer encapsulated microelectromechanical structure and method of manufacturing same

Wafer encapsulated microelectromechanical structure and method of manufacturing same

Wafer encapsulated microelectromechanical structure and method of manufacturing same

Wafer encapsulated microelectromechanical structure and method of manufacturing same

Wafer encapsulated microelectromechanical structure and method of manufacturing same

Wafer encapsulated microelectromechanical structure and method of manufacturing same

Wafer encapsulated microelectromechanical structure and method of manufacturing same

Wafer encapsulated microelectromechanical structure and method of manufacturing same

Wafer encapsulated microelectromechanical structure and method of manufacturing same

Wafer encapsulated microelectromechanical structure and method of manufacturing same

Stacked mounting structure

Wafer level packaging cap and fabrication method thereof

Sequential fabrication of vertical conductive interconnects in capped chips

Structure and method of making capped chip having discrete article assembled into vertical interconnect

Wafer level packaging process

Structure and self-locating method of making capped chips

Structure and method of making capped chips having vertical interconnects

Back-face and edge interconnects for lidded package

Micromechanical component having an anodically bonded cap and a manufacturing method

Method of forming a device package having edge interconnect pad

Wafer level packaging cap and fabrication method thereof

MEMS device trench plating process and apparatus for through hole vias

Approach to high temperature wafer processing

Chip packages with covers

Semiconductor device

Electronic parts packaging structure and method of manufacturing the same

Semiconductor chip package

Method of making MEMS wafers

Method for containing a device and a corresponding device

Interconnection device including one or more embedded vias and method of producing the same

Cap for semiconductor device package, and manufacturing method thereof

Method of making a substrate contact for a capped MEMS at the package level

Silicon wafer having through-wafer vias

Method of wafer-level packaging using low-aspect ratio through-wafer holes

Electronic component and method for its production

Bevel dicing semiconductor components

Method for fabricating a wafer level package having through wafer vias for external package connectivity and related structure

Structure and process for packaging RF MEMS and other devices

Method of fabricating a package for a micro component

Method of manufacturing a wiring board

Method of manufacturing a hermetic chamber with electrical feedthroughs

Wafer level packaging cap and fabrication method thereof

Hermetic chamber with electrical feedthroughs

Interconnection of through-wafer vias using bridge structures

Process for producing microelectromechanical components and a housed microelectromechanical component

Microelectromechanical systems, and devices having thin film encapsulated mechanical structures

Fabrication method of packaging substrate and packaging method using the packaging substrate

Semiconductor package using flip-chip mounting technique

Apparatus and method of wafer level package

Integration manufacturing process for MEMS device

Compliant interconnect and method of formation

Semiconductor package and packaging method using flip-chip bonding technology

Wafer level capped sensor

Method of forming an assembly to house one or more micro components

Conductive bond for through-wafer interconnect

MEMS device with integral packaging

Microelectromechanical systems having trench isolated contacts, and methods for fabricating same

Hermetically sealed silicon micro-machined electromechanical system (MEMS) device having diffused conductors

Wafer-level package and its manufacturing method

Structure and method of making capped chips having vertical interconnects

Back-face and edge interconnects for lidded package

Structure and method of making capped chips using sacrificial layer

Structure and self-locating method of making capped chips

Structure and method of making sealed capped chips

Structure and method of making capped chips including vertical interconnects having stud bumps engaged to surfaces of said caps

Process for producing microelectromechanical components and a housed microelectromechanical component

Method of manufacturing a microphone

Method of packaging RF MEMS

Packaging of microfluidic devices and microfluidic integrated systems and method of fabrication

Miniaturized vacuum package and methods of making same

Multi-pressure MEMS package

Semiconductor device including a MEMS die and a conductive layer

Semiconductor structure and manufacturing method thereof

Integrated MEMS pressure sensor and MEMS inertial sensor

MEMS packaging techniques

Molded cavity substrate MEMS package fabrication method and structure

MEMS device connected to a substrate by flexible support structures

Method for manufacturing a microelectromechanical systems (MEMS) device with different electrical potentials and an etch stop

Methods of manufacture of top port surface mount MEMS microphones

Methods of manufacture of bottom port multi-part surface mount MEMS microphones

Methods of manufacture of top port surface mount MEMS microphones

Semiconductor device

MEMS package