83957 ⎘
Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems; Processes for packaging MEMS devices for reducing stress inside of the package structure
LOW STRESS FLIPCHIP MEMS PACKAGE
#2Embedded Digital Sensor Structure
#3METHODS AND APPARATUS FOR ELECTRONIC DEVICE PACKAGING
#4MEMS DEVICE BUILT USING THE BEOL METAL LAYERS OF A SOLID STATE SEMICONDUCTOR PROCESS
#5HIGH RELIABILITY SENSOR
#6MEMS DIES EMBEDDED IN GLASS CORES
#7LENS AND EYEWEAR
#8STRESS ISOLATION PROCESS
#9Sensor devices with gas-permeable cover and associated production methods
#10MEMS device built using the BEOL metal layers of a solid state semiconductor process
#11Method of manufacturing a sensor device and moulding support structure
#12METHOD FOR MANUFACTURING A DETECTION DEVICE COMPRISING A PERIPHERAL WALL MADE OF A MINERAL MATERIAL
#13METHODS AND APPARATUS FOR ELECTRONIC DEVICE PACKAGING
#14MEMS stress reduction structure embedded into package
#15Stress isolated device package and method of manufacture
#16Low-stress packaging structure for MEMS acceleration sensor chip
#17MEMS device having decreased contact resistance
#18Mems device having a rugged package and fabrication process thereof
#19MEMS device with dummy-area utilization for pressure enhancement
#20Reducing delamination in sensor package
#21Polyamic acid composition for packaging electronic components, and method for packaging electronic components using same
#22POLYAMIC ACID COMPOSITION FOR PACKAGING ELECTRONIC COMPONENTS, AND METHOD FOR PACKAGING ELECTRONIC COMPONENTS USING SAME
#23Stress-isolated MEMS device comprising substrate having cavity and method of manufacture
#24Micromechanical sensor device having an ASIC chip integrated into a capping unit and corresponding manufacturing method
#25Sensor devices with gas-permeable cover and associated production methods
#26Support structure for MEMS device with particle filter
#27MEMS package, MEMS microphone and method of manufacturing the MEMS package
#28MEMS device built using the BEOL metal layers of a solid state semiconductor process
#29Semiconductor package structures and methods of manufacturing the same
#30Mems device built using the BEOL metal layers of a solid state semiconductor process
#31Particle filter for MEMS device
#32Semiconductor device packages and methods of manufacturing the same
#33Fabrication method for a MEMS device
#34Support structure for MEMS device with particle filter
#35Particle filter for MEMS device
#36Semiconductor package with flexible interconnect
#37Semiconductor package structure and method for manufacturing the same
#38Surface micromechanical element and method for manufacturing the same
#39MEMS vibrator and MEMS oscillator
#40MEMS device and method for manufacturing mems device
#41Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip
#42Method of manufacturing a sensor device and moulding support structure
#43Method for producing a micromechanical component with an exposed pressure sensor device and micromechanical component
#44Method for manufacturing micromechanical diaphragm sensors
#45MEMS device with dummy-area utilization for pressure enhancement
#46Process for fabricating a device for detecting electromagnetic radiation having an improved encapsulation structure
#47MEMS DEVICE HAVING A RUGGED PACKAGE AND FABRICATION PROCESS THEREOF
#48Carrier substrate for stress sensitive device and method of manufacture
#49Method for manufacturing a MEMS unit for a micromechanical pressure sensor
#50Micro-electro-mechanical device and manufacturing process thereof
#51Micromechanical pressure sensor and method for producing said micromechanical pressure sensor
#52MEMS package and method of manufacturing the same
#53Stressed decoupled micro-electro-mechanical system sensor
#54MEMS device stress-reducing structure
#55Sensor
#56Microphone and pressure sensor package and method of producing the microphone and pressure sensor package
#57Method for producing a stress-decoupled micromechanical pressure sensor
#58Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip
#59Method for manufacturing a micromechanical sensor
#60Electronic sensors with sensor die in package structure cavity
#61Wafer level packaging for MEMS device
#62Surface micromechanical element and method for manufacturing the same
#63Method for closing off a micromechanical device by laser melting, and micromechanical device having a laser melt closure
#64Multi-layer, stress-isolation platform for a MEMS die
#65Methods for fabricating an apparatus having a hermetic seal
#66Electronic sensors with sensor die in package structure cavity
#67Microelectromechanical sensor device with reduced stress-sensitivity and corresponding manufacturing process
#68Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip
#69Method for forming a microelectromechanical device
#70SEMICONDUCTOR DEVICE INCLUDING A MEMS DIE
#71Micro-electro-mechanical device and manufacturing process thereof
#72Microelectromechanical device and method for forming a microelectromechanical device
#73Microelectromechanical system and a method of manufacturing a microelectromechanical system
#74Structure and method for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip
#75Laser beam deflection for targeted energy deposition
#76Targeted control of the absorption behavior during laser resealing
#77LASER RESEAL INCLUDING STRESS COMPENSATION LAYER
#78Micro-electro-mechanical device having two buried cavities and manufacturing process thereof
#79Structures for reducing and avoiding stresses on the seal bottom side during laser reseal
#80Structures and process for preventing a projection of the laser resealing structure beyond the wafer surface
#81Structures for reducing and preventing stress and tensions during processing of silicon with the aid of melting by a laser
#82Encapsulated device of semiconductor material with reduced sensitivity to thermo-mechanical stresses
#83Microelectromechanical sensor device with reduced stress-sensitivity and corresponding manufacturing process
#84Manufacturing method of electronic device, electronic device, electronic apparatus, and moving body
#85Mechanically isolated MEMS device
#86Strain Reduction and Sensing on Package Substrates
#87Pressure sensor and packaging method thereof
#88Stress relief MEMS structure and package
#89Housing with a damping element for a micromechanical sensor element
#90Method of stress relief in anti-reflective coated cap wafers for wafer level packaged infrared focal plane arrays
#91CHIP SCALE PACKAGE
#92Hermetic-sealing package member, production method therefor, and hermetically-sealed package production method using this hermetic-sealing package member
#93Microelectromechanical systems (MEMS) stopper structure for stiction improvement
#94Micromechanical sensor device and corresponding manufacturing method
#95Package for semiconductor devices sensitive to mechanical and thermo-mechanical stresses, such as MEMS pressure sensors
#96Method and apparatus of making MEMS packages
#97Microintegrated encapsulated MEMS sensor with mechanical decoupling and manufacturing process thereof
#98Stress isolation for MEMS device
#99Method for fabricating electronic device package
#100MEMS device structure and methods of forming same
#101Methods for fabricating apparatus having a hermetic seal
#102Fabrication of tungsten MEMS structures
#103Semiconductor arrangement with stress release and thermal insulation
#104Semiconductor arrangement with stress release configuration
#105Sensor and method for manufacturing a sensor
#106MEMS device with polymer layer, system of a MEMS device with a polymer layer, method of making a MEMS device with a polymer layer
#107Method for manufacturing a die assembly having a small thickness and die assembly relating thereto
#108Pressure sensor package with integrated sealing
#109Apparatus and method for reduced strain on MEMS devices
#110Vertical mount package and wafer level packaging therefor
#111Electrical component and method of manufacturing the same
#112Electronic device and its manufacturing method
#113Method of stress relief in anti-reflective coated cap wafers for wafer level packaged infrared focal plane arrays
#114MEMS device structure and methods of forming same
#115Vertical mount package and wafer level packaging therefor
#116Semiconductor integrated device assembly process
#117MEMS chip package and method for manufacturing an MEMS chip package
#118Device and method for producing a device
#119Electronic device package and fabrication method thereof
#120SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING THE SAME
#121Method for chemical sensor fabrication and related sensor
#122Embedded digital sensor structure
#123MEMS assembly substrates including a bond layer
#124Damping mechanism for micro-electro-mechanical systems (MEMS) structures, including tilting mirror devices used in optical components
#125Thin MEMS die
#126Configurable micro-electro-mechanical systems (MEMS) transfer switch and methods