ClassID:

83970

B81C1/00428 - CPC Classification

Classification description:

Manufacture or treatment of devices or systems in or on a substrate; Etch mask forming Etch mask forming processes not provided for in groups  - 

Recent Application in this class:
#1
20230136105
2023-05-04

VERTICAL MECHANICAL STOPS TO PREVENT LARGE OUT-OF-PLANE DISPLACEMENTS OF A MICRO-MIRROR AND METHODS OF MANUFACTURE

#2
20220350134
2022-11-03

PROCESS FOR MANUFACTURING A MICROELECTROMECHANICAL MIRROR DEVICE AND MICROELECTROMECHANICAL MIRROR DEVICE

#3
20220259038
2022-08-18

HIGH-VOLUME MILLIMETER SCALE MANUFACTURING

#4
20210331915
2021-10-28

Segmented pedestal for mounting device on chip

#5
20200369515
2020-11-26

Segmented pedestal for mounting device on chip

#6
20200198291
2020-06-25

Superhydrophobic and superoleophobic nanosurfaces

#7
20200131033
2020-04-30

Actuator layer patterning with topography

#8
20190256353
2019-08-22

High-volume millimeter scale manufacturing

#9
20190016591
2019-01-17

Manufacturing method for semiconductor structure

#10
20180297321
2018-10-18

Superhydrophobic and superoleophobic nanosurfaces

#11
20180065843
2018-03-08

Substrate treatment method, computer storage medium and substrate treatment system

#12
20170313869
2017-11-02

Block copolymer

#13
20170306139
2017-10-26

Block copolymer

#14
20170306074
2017-10-26

Block copolymer

#15
20170247492
2017-08-31

Block copolymer

#16
20170226261
2017-08-10

Block copolymer

#17
20170226260
2017-08-10

Block copolymer

#18
20170226258
2017-08-10

Block copolymer

#19
20170226235
2017-08-10

Block copolymer

#20
20170219922
2017-08-03

Method of manufacturing patterned substrate

#21
20170210938
2017-07-27

Method of manufacturing patterned substrate

#22
20170207116
2017-07-20

Exposure activated chemically amplified directed self-assembly (DSA) for back end of line (BEOL) pattern cutting and plugging

#23
20170080460
2017-03-23

CMUT device and manufacturing method

#24
20170058071
2017-03-02

Block copolymer

#25
20170008992
2017-01-12

Block copolymer

#26
20160333221
2016-11-17

PROCESS THAT ENABLES THE CREATION OF NANOMETRIC STRUCTURES BY SELF-ASSEMBLY OF BLOCK COPOLYMERS

#27
20160311960
2016-10-27

Block copolymer

#28
20160311959
2016-10-27

Block copolymer

#29
20160311958
2016-10-27

Block copolymer

#30
20160304656
2016-10-20

Block copolymer

#31
20160304655
2016-10-20

Block copolymer

#32
20160304654
2016-10-20

Block copolymer

#33
20160304653
2016-10-20

Monomer and block copolymer

#34
20160280835
2016-09-29

Block copolymer

#35
20160280832
2016-09-29

Block copolymer

#36
20160096233
2016-04-07

Laser micro/nano processing system and method

#37
20160023238
2016-01-28

Direct current superposition curing for resist reflow temperature enhancement

#38
20150255298
2015-09-10

Sequential infiltration synthesis for advanced lithography

#39
20150191348
2015-07-09

Method of forming MEMS device

#40
20140116980
2014-05-01

Method for providing a template for a self-assemblable polymer for use in device lithography

#41
20140011013
2014-01-09

Superhydrophobic and superoleophobic nanosurfaces

#42
20130244439
2013-09-19

Removable templates for directed self assembly

#43
20130183833
2013-07-18

Laser micro/nano processing system and method

#44
20120241411
2012-09-27

Sequential infiltration synthesis for advanced lithography

#45
20100143828
2010-06-10

Method of mask forming and method of three-dimensional microfabrication

#46
20060249873
2006-11-09

Methods for forming openings in a substrate and apparatuses with these openings and methods for creating assemblies with openings