84012 ⎘
Manufacture or treatment of devices or systems in or on a substrate; Preserve existing structures from alteration, e.g. temporary protection during manufacturing Protect against mechanical threats, e.g. against shocks, or residues
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
#2MICRO-ELECTROMECHANICAL SYSTEMS (MEMS) AND METHODS OF FABRICATING THE SAME
#3BOTTOM PACKAGE EXPOSED DIE MEMS PRESSURE SENSOR INTEGRATED CIRCUIT PACKAGE DESIGN
#4MICROMECHANICAL ARM ARRAY FOR MEMS ACTUATORS
#5MICROELECTROMECHANICAL SYSTEMS DEVICE AND METHOD FOR FORMING THE SAME
#6SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING THE SAME
#7MEMS ACOUSTIC ELEMENT
#8SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
#9MANUFACTURING METHOD OF MEMS DEVICE
#10METHOD OF MANUFACTURING MIRROR DEVICE
#11MICROELECTROMECHANICAL MEMBRANE TRANSDUCER WITH ACTIVE DAMPER
#12Semiconductor structure including scribe line structures and method for fabricating the same
#13METHODS AND SYSTEMS FOR FABRICATION OF ULTRASOUND TRANSDUCER DEVICES
#14SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
#15BOTTOM PACKAGE EXPOSED DIE MEMS PRESSURE SENSOR INTEGRATED CIRCUIT PACKAGE DESIGN
#16Semiconductor structure and manufacturing method thereof
#17Method for producing damper structures on a micromechanical wafer
#18Protective member forming apparatus
#19Microelectromechanical membrane transducer with active damper
#20Support structure for MEMS device with particle filter
#21Freezing a sacrificial material in forming a semiconductor
#22Support structure for MEMS device with particle filter
#23Semiconductor structure including scribe line structures and method for fabricating the same
#24Ultrasonic MEMS acoustic transducer with reduced stress sensitivity and manufacturing process thereof
#25Bottom package exposed die MEMS pressure sensor integrated circuit package design
#26MEMS device and method of manufacturing a MEMS device
#27Freezing a sacrificial material in forming a semiconductor
#28Thermal airflow sensor
#29Semiconductor structures provided within a cavity and related design structures
#30REDUCING VIBRATION OF A MEMS INSTALLATION ON A PRINTED CIRCUIT BOARD
#31Method for manufacturing gas detector by MEMS process
#32Method for packaging at least one semiconductor component and semiconductor device
#33Semiconductor structures provided within a cavity and related design structures
#34Thermal airflow sensor
#35MEMS device and method of manufacturing a MEMS device
#36Method and apparatus for using universal cavity wafer in wafer level packaging
#37Method of strain gauge fabrication using a transfer substrate
#38MEMS devices having tethering structures
#39Bottom package exposed die MEMS pressure sensor integrated circuit package design
#40Protective coating on trench features of a wafer and method of fabrication thereof
#41Method and system for CMOS based MEMS bump stop contact damage prevention
#42Removal of a reinforcement ring from a wafer
#43Selective patterning of titanium encapsulation layers
#44Semiconductor structure and method for fabricating the same
#45Semiconductor device and method of manufacturing the same
#46Dry scribing methods, devices and systems
#47Selective patterning of an integrated fluxgate device
#48Thermal airflow sensor
#49Semiconductor structure and manufacturing method thereof
#50Manufacturing method of MEMS chip
#51Anodic oxide film structure cutting method and unit anodic oxide film structure
#52Method and apparatus for using universal cavity wafer in wafer level packaging
#53Chip structure
#54MEMS device and method of manufacturing a MEMS device
#55Method for applying a structured coating to a component
#56Thin Film Encapsulation of Electrodes
#57Semiconductor element and methods for manufacturing the same
#58Integrated MEMS device
#59Method and apparatus for a seal ring structure
#60Hermetically sealed package having stress reducing layer
#61MEMS capping method
#62Sensor protective coating
#63MEMS STRUCTURE AND METHOD OF MANUFACTURING THE SAME
#64Method of protecting microelectro mechanical system device
#65MEMS capping method
#66Method and system for CMOS based MEMS bump stop contact damage prevention
#67Method for manufacturing an integrated MEMS device
#68Semiconductor structures provided within a cavity and related design structures
#69Sensor protective coating
#70Microelectromechanical device with protection for bonding
#71MICROMECHANICAL COMPONENT AND METHOD FOR MANUFACTURING A MICROMECHANICAL COMPONENT
#72COMPONENT INCLUDING MEANS FOR REDUCING ASSEMBLY-RELATED MECHANICAL STRESSES AND METHODS FOR MANUFACTURING SAME
#73Fabrication method for a chip package
#74MEMS device and method of manufacturing a MEMS device
#75Semiconductor structures provided within a cavity and related design structures
#76MEMS shock cushion spring systems and methods
#77Treatment liquid for inhibiting pattern collapse in microstructures, and microstructure manufacturing method using said treatment liquid
#78Microelectro mechanical system encapsulation scheme
#79Semiconductor device
#80Method to prevent metal pad damage in wafer level package
#81Chip package and fabrication method thereof
#82Method for manufacturing micro movable element
#83Method of making microminiature moving device
#84Microminiature moving device
#85Method of making microminiature moving device
#86Microminiature moving device and method of making the same
#87Dry scribing methods, devices and systems
#88MEMS structure and manufacturing method thereof