B81C1/00777 - CPC Classification Index

ClassID:

84006 ⎘

B81C1/00777 - CPC Classification

Classification description:

Manufacture or treatment of devices or systems in or on a substrate Preserve existing structures from alteration, e.g. temporary protection during manufacturing

Sub-classes:

B81C1/00785 » {Avoid chemical alteration, e.g. contamination, oxidation or unwanted etching } 6
B81C1/00817 » {Avoid thermal destruction} 9
B81C1/00825 » {Protect against mechanical threats, e.g. against shocks, or residues } 80
B81C1/00833 » {Methods for preserving structures not provided for in groups to } 22

Recent Application in this class:

20150325492

2015-11-12

Semiconductor package with coated side walls and method of manufacture

20140342487

2014-11-20

Process for encapsulating a microelectronic device comprising injection of noble gas through a material permeable to this noble gas

20140248730

2014-09-04

MEMS device and method of formation thereof

20130037891

2013-02-14

Method of fabricating a semiconductor device having recessed bonding site

20120129291

2012-05-24

Method for producing a micromechanical component