ClassID:

84013

B81C1/00833 - CPC Classification

Classification description:

Manufacture or treatment of devices or systems in or on a substrate; Preserve existing structures from alteration, e.g. temporary protection during manufacturing Methods for preserving structures not provided for in groups  - 

Recent Application in this class:
#1
20240190702
2024-06-13

SEMICONDUCTOR COMPONENT AND METHOD FOR MANUFACTURING A SEMICONDUCTOR COMPONENT

#2
20220289564
2022-09-15

Device for protecting FEOL element and BEOL element

#3
20210147224
2021-05-20

MEMS device manufacturing method and mems device

#4
20200115223
2020-04-16

Device for protecting FEOL element and BEOL element

#5
20190196333
2019-06-27

Process for the exposure of a region on one face of an electronic device

#6
20190112184
2019-04-18

Device for protecting FEOL element and BEOL element

#7
20180009655
2018-01-11

Vent Attachment System For Micro-Electromechanical Systems

#8
20160368764
2016-12-22

Integration of active devices with passive components and MEMS devices

#9
20160246002
2016-08-25

Micro-optical bench device with highly/selectively-controlled optical surfaces

#10
20160214855
2016-07-28

Device and method for protecting FEOL element and BEOL element

#11
20160167948
2016-06-16

Vent Attachment System For Micro-Electromechanical Systems

#12
20150175405
2015-06-25

Mechanisms for forming micro-electro mechanical system device

#13
20150021723
2015-01-22

Mechanisms for forming micro-electro mechanical system device

#14
20120146452
2012-06-14

MICROELECTROMECHANICAL SYSTEM DEVICE AND SEMI-MANUFACTURE AND MANUFACTURING METHOD THEREOF

#15
20110207335
2011-08-25

Constrained oxidation of suspended micro- and nano-structures

#16
20090263920
2009-10-22

Protection of cavities opening onto a face of a microstructured element

#17
20090159331
2009-06-25

Method for manufacturing an electronic assembly; an electronic assembly, a cover and a substrate

#18
20060030120
2006-02-09

METHOD OF PERFORMING DOUBLE-SIDED PROCESSES UPON A WAFER

#19
20060014312
2006-01-19

Method for stripping sacrificial layer in MEMS assembly

#20
20050101048
2005-05-12

Self-shadowing MEM structures

#21
20050088765
2005-04-28

Self-shadowing MEM structures

#22
20050087826
2005-04-28

Self-shadowing MEM structures