84015 ⎘
Manufacture or treatment of devices or systems in or on a substrate; Cleaning during or after manufacture during manufacture
MICRO-PARTICLE CLEANING METHOD FOR MICRO-ELECTROMECHANICAL SYSTEMS DEVICES WITH MOVABLE SURFACE STRUCTURES
#2COMPOSITION, ITS USE AND A PROCESS FOR CLEANING SUBSTRATES COMPRISING COBALT AND COPPER
#3MIRROR DEVICE MANUFACTURING METHOD AND MIRROR UNIT MANUFACTURING METHOD
#4VOID REDUCTION ON WAFER BONDING INTERFACE
#5Residue removal during semiconductor device formation
#6Method for Fabricating a Microfluidic Device
#7Freezing a sacrificial material in forming a semiconductor
#8Sublimation in forming a semiconductor
#9MEMS microphone
#10Using sacrificial polymer materials in semiconductor processing
#11METHOD FOR ACHIEVING STICTION-FREE HIGH-ASPECT-RATIO MICROSTRUCTURES AFTER WET CHEMICAL PROCESSING
#12Using sacrificial polymer materials in semiconductor processing
#13Using sacrificial polymer materials in semiconductor processing
#14METHOD FOR PROCESSING SILICON WAFER WITH THROUGH CAVITY STRUCTURE
#15Freezing a sacrificial material in forming a semiconductor
#16Removing a sacrificial material via sublimation in forming a semiconductor
#17Gas residue removal
#18Method of processing nano- and micro-pores
#19Polarization dependent surface enhanced Raman scattering system
#20Method for Performing a Wet Treatment of a Substrate
#21Apparatus for detecting an analyte with surface enhanced raman scattering
#22METHOD OF ADDRESSING FILM LIFTOFF IN MEMS FABRICATION
#23Anisotropic monolayer gold nanoassembly: a highly SERS-active substrate for molecular detection
#24Semiconductor device
#25Composition for treating surface of substrate, method and device
#26MEMS device with over-travel stop structure and method of fabrication
#27Etch release residue removal using anhydrous solution
#28MEMS pressure sensor and method of manufacturing the same
#29Wafer level hermetic bond using metal alloy with raised feature and wetting layer
#30Methods of forming MEMS device
#31Semiconductor device and fabrication method
#32Method to release diaphragm in MEMS device
#33Nonaqueous cleaning liquid and method for etching processing of silicon substrate
#34TREATMENT SOLUTION FOR PREVENTING PATTERN COLLAPSE IN METAL FINE STRUCTURE BODY, AND PROCESS FOR PRODUCTION OF METAL FINE STRUCTURE BODY USING SAME
#35TREATMENT SOLUTION FOR PREVENTING PATTERN COLLAPSE IN METAL FINE STRUCTURE BODY, AND PROCESS FOR PRODUCTION OF METAL FINE STRUCTURE BODY USING SAME
#36Manufacturing method of semiconductor device
#37METHOD OF ETCHING BACKSIDE INK SUPPLY CHANNELS FOR AN INKJET PRINTHEAD
#38Method of forming an ink supply channel
#39Method for manufacturing semiconductor device
#40Preparation of microelectromechanical system device using an anti-stiction material and selective plasma sputtering
#41Method for removing residues formed during the manufacture of MEMS devices
#42Method of removing a polymer coating from an etched trench
#43Method of modifying an etched trench
#44Process for producing structural body and etchant for silicon oxide film
#45Integrated microfluidic system and method of fabrication