B81C1/00857 - CPC Classification Index

ClassID:

84016 ⎘

B81C1/00857 - CPC Classification

Classification description:

Manufacture or treatment of devices or systems in or on a substrate; Cleaning during or after manufacture after manufacture, e.g. back-end of the line process

Recent Application in this class:

20260043148

2026-02-12

CLEANING COMPOSITION WITH MOLYBDENUM ETCHING INHIBITOR

20230399754

2023-12-14

CLEANING COMPOSITION WITH MOLYBDENUM ETCHING INHIBITOR

20220363535

2022-11-17

MIRROR DEVICE MANUFACTURING METHOD AND MIRROR UNIT MANUFACTURING METHOD

20220315418

2022-10-06

METHOD FOR TRANSFERRING MICROSTRUCTURES, AND METHOD FOR MOUNTING MICROSTRUCTURES

20180315594

2018-11-01

Method of cleaning and drying semiconductor substrate

20150368099

2015-12-24

Etch release residue removal using anhydrous solution

20150191348

2015-07-09

Method of forming MEMS device

20150140717

2015-05-21

Method for manufacturing a structured surface

20110076853

2011-03-31

Novel process method for post plasma etch treatment