B81C1/00873 - CPC Classification Index

ClassID:

84018 ⎘

B81C1/00873 - CPC Classification

Classification description:

Manufacture or treatment of devices or systems in or on a substrate; Multistep processes for the separation of wafers into individual elements characterised by special arrangements of the devices, allowing an easier separation

Recent Application in this class:

20260116745

2026-04-30

DEEP TRENCHES ON MICROELECTROMECHANICAL SYSTEM WAFERS FOR STEALTH DICING

20220041436

2022-02-10

Method for producing a plurality of sensor devices, and sensor device

20210323816

2021-10-21

THROUGH-SUBSTRATE CONDUCTOR SUPPORT

20190382262

2019-12-19

Through-substrate conductor support

20190330057

2019-10-31

MEMS device and method of manufacturing a MEMS device

20180297834

2018-10-18

MEMS package

20180295453

2018-10-11

MEMS microphone modules and wafer-level techniques for fabricating the same

20180201504

2018-07-19

MEMS device and method of manufacturing a MEMS device

20180186629

2018-07-05

Through-substrate conductor support

#10

20170015548

2017-01-19

Open cavity package using chip-embedding technology

#11

20160347609

2016-12-01

MEMS packages and methods of manufacture thereof

#12

20160318759

2016-11-03

MEMS device and method of manufacturing a MEMS device

#13

20160130135

2016-05-12

Physical quantity sensor, method for manufacturing physical quantity sensor, electronic device, and moving body

#14

20160112808

2016-04-21

MEMS microphone modules and wafer-level techniques for fabricating the same

#15

20160052784

2016-02-25

MEMS DEVICES AND METHOD OF MANUFACTURING

#16

20150293160

2015-10-15

Capacitive sensor

#17

20150022872

2015-01-22

Method of manufacturing a MEMS micro-mirror assembly

#18

20150009549

2015-01-08

MEMS micro-mirror assembly

#19

20140374854

2014-12-25

Vertical mount package and wafer level packaging therefor

#20

20140203424

2014-07-24

Electronic device and manufacturing method thereof

#21

20140103460

2014-04-17

MEMS device and method of manufacturing a MEMS device

#22

20140008779

2014-01-09

Wafer level package, chip size package device and method of manufacturing wafer level package

#23

20140007425

2014-01-09

MANUFACTURING METHOD OF ELECTRONIC PACKAGING

#24

20130323908

2013-12-05

Method for fabricating semiconductor device

#25

20130256896

2013-10-03

Vertical mount package and wafer level packaging therefor

#26

20130084661

2013-04-04

Method for manufacturing optical deflector for forming dicing street with double etching

#27

20120153409

2012-06-21

Thin semiconductor device having embedded die support and methods of making the same

#28

20120149153

2012-06-14

Thin semiconductor device having embedded die support and methods of making the same

#29

20120064647

2012-03-15

METHOD OF FABRICATING MICROELECTROMECHANICAL SYSTEMS DEVICES

#30

20110092046

2011-04-21

Method of forming semiconductor devices in wafer assembly

#31

20110012166

2011-01-20

Method and device for wafer scale packaging of optical devices using a scribe and break process

#32

20100306993

2010-12-09

Method and apparatus for detethering mesoscale, microscale, and nanoscale components and devices

#33

20100301431

2010-12-02

Thin semiconductor device having embedded die support and methods of making the same

#34

20100117221

2010-05-13

Capped wafer method and apparatus

#35

20100109105

2010-05-06

Component and method for its manufacture

#36

20100015781

2010-01-21

Semiconductor substrate, and semiconductor device and method of manufacturing the semiconductor device

#37

20090323170

2009-12-31

GROOVE ON COVER PLATE OR SUBSTRATE

#38

20090321867

2009-12-31

Method for production of packaged electronic components, and a packaged electronic component

#39

20090194828

2009-08-06

Method for MEMS threshold sensor packaging

#40

20090098711

2009-04-16

Micromachine device processing method

#41

20090061598

2009-03-05

Wafer-level packaging cutting method capable of protecting contact pads

#42

20090061562

2009-03-05

Method of fabricating microelectromechanical systems devices

#43

20090050990

2009-02-26

Semiconductor sensor device and method for manufacturing same

#44

20080227234

2008-09-18

Method of manufacturing a semiconductor device

#45

20080217709

2008-09-11

MEMS PACKAGE HAVING AT LEAST ONE PORT AND MANUFACTURING METHOD THEREOF

#46

20080191221

2008-08-14

Method and device for wafer scale packaging of optical devices using a scribe and break process

#47

20080150160

2008-06-26

Dicing technique for flip-chip USP wafers

#48

20080116533

2008-05-22

Semiconductor device in wafer assembly

#49

20070264803

2007-11-15

Semiconductor substrate, and semiconductor device and method of manufacturing the semiconductor device

#50

20070166958

2007-07-19

METHOD OF WAFER LEVEL PACKAGING AND CUTTING

#51

20070017639

2007-01-25

Method of cutting laminate, apparatus for manufacturing laminate, method of manufacturing laminate, and laminate

#52

20070012398

2007-01-18

Method of cutting laminate, apparatus for manufacturing laminate, method of manufacturing laminate, and laminate

#53

20060292828

2006-12-28

Wafer and method of cutting the same

#54

20060261423

2006-11-23

Method of fabricating printheads having multiple nozzle assemblies

#55

20060141760

2006-06-29

Method for producing an electrical component

#56

20060128064

2006-06-15

Wafer packaging and singulation method

#57

20060121693

2006-06-08

Method and device for wafer scale packaging of optical devices using a scribe and break process

#58

20060076105

2006-04-13

Method of cutting laminate, apparatus for manufacturing laminate, method of manufacturing laminate, and laminate

#59

20060046437

2006-03-02

Method for forming individual semi-conductor devices

#60

20050269731

2005-12-08

Method of fabricating element having microstructure

#61

20050191791

2005-09-01

Methods for dicing wafer stacks to provide access to interior structures

#62

20050176166

2005-08-11

Wafer packaging and singulation method