B81C1/00865 - CPC Classification

Manufacture or treatment of devices or systems in or on a substrate Multistep processes for the separation of wafers into individual elements

• B81C1/00873 » {characterised by special arrangements of the devices, allowing an easier separation} 61
• B81C1/0088 » {Separation allowing recovery of the substrate or a part of the substrate, e.g. epitaxial lift-off} 11
• B81C1/00888 » {Multistep processes involving only mechanical separation, e.g. grooving followed by cleaving} 49
• B81C1/00896 » {Temporary protection during separation into individual elements} 82
• B81C1/00904 » {Multistep processes for the separation of wafers into individual elements not provided for in groups to } 59

Recent Application in this class: