84022 ⎘
Manufacture or treatment of devices or systems in or on a substrate; Multistep processes for the separation of wafers into individual elements Multistep processes for the separation of wafers into individual elements not provided for in groups -
METHODS FOR POST-PROCESSING AND FOR HANDLING OF MEMS CHIPS
#2METHOD FOR MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE
#3SENSOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
#4INTEGRATED DICING DIE BONDING SHEET AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
#5Semiconductor device and method of forming microelectromechanical systems (MEMS) package
#6Method with stealth dicing process for fabricating MEMS semiconductor chips
#7SENSOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
#8MEMS device manufacturing method and mems device
#9Laser-assisted material phase-change and expulsion micro-machining process
#10Semiconductor device and method of forming microelectromechanical systems (MEMS) package
#11Device chip manufacturing method
#12Deposition of protective material at wafer level in front end for early stage particle and moisture protection
#13Techniques for fabricating waveguide facets and die separation
#14Deposition of protective material at wafer level in front end for early stage particle and moisture protection
#15Wafer processing method
#16Semiconductor device and method of forming microelectromechanical systems (MEMS) package
#17Semiconductor element and methods for manufacturing the same
#18Method of strain gauge fabrication using a transfer substrate
#19Semiconductor device and method of forming microelectromechanical systems (MEMS) package
#20Leak detection using cavity surface quality factor
#21Method for simultaneous structuring and chip singulation
#22Silicon-on-sapphire device with minimal thermal strain preload and enhanced stability at high temperature
#23Semiconductor element and methods for manufacturing the same
#24SEMICONDUCTOR CAVITY PACKAGE USING PHOTOSENSITIVE RESIN
#25Production of micro-mechanical devices
#26Microelectronic packages having axially-partitioned hermetic cavities and methods for the fabrication thereof
#27Semiconductor device and method of forming microelectromechanical systems (MEMS) package
#28Microelectronic packages having stacked accelerometer and magnetometer die and methods for the production thereof
#29MEMS device chip manufacturing method
#30Method for simultaneous structuring and chip singulation
#31Method for wafer-level manufacturing of objects and corresponding semi-finished products
#32Bonded microelectromechanical assemblies
#33Micromachined transducers and method of fabrication
#34Methods and systems for metal-assisted chemical etching of substrates
#35Bonded Microelectromechanical Assemblies
#36MEMS device
#37Methods for Depositing, Releasing and Packaging Micro-Electromechanical Devices on Wafer Substrates
#38Dual laser separation of bonded wafers
#39Dry etch release method for micro-electro-mechanical systems (MEMS)
#40Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#41Method of separating MEMS devices from a composite structure
#42Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#43Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#44Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#45Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#46Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#47Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#48Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#49Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#50Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#51Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#52Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#53Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#54Method for making a micromechanical device by using a sacrificial substrate
#55Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#56Method for forming at least one protective cap
#57Moulding assembly for forming at least one protective cap
#58Methods for depositing, releasing and packaging microelectromechanical devices on wafer substrates
#59Method of fabricating MEMS devices on a silicon wafer
#60Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#61Semiconductor device