ClassID:

84033

B81C1/00992 - CPC Classification

Classification description:

Manufacture or treatment of devices or systems in or on a substrate; Treatments or methods for avoiding stiction of flexible or moving parts of MEMS Treatments or methods for avoiding stiction of flexible or moving parts of MEMS not provided for in groups  - 

Recent Application in this class:
#1
20260132019
2026-05-14

Anti-Stiction Process for Mems Device

#2
20250376371
2025-12-11

METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE CAP

#3
20250145456
2025-05-08

METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE

#4
20250074766
2025-03-06

METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE

#5
20230045563
2023-02-09

METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE CAP

#6
20230045257
2023-02-09

Method and system for fabricating a MEMS device

#7
20230037849
2023-02-09

Method and system for fabricating a MEMS device

#8
20220242724
2022-08-04

Anti-stiction process for MEMS device

#9
20200123003
2020-04-23

Anti-stiction process for MEMS device

#10
20190241425
2019-08-08

Method and apparatus for reducing in-process and in-use stiction for MEMS devices

#11
20190035611
2019-01-31

Systems and methods for uniform target erosion magnetic assemblies

#12
20190031503
2019-01-31

Anti-stiction process for MEMS device

#13
20180134542
2018-05-17

Method and apparatus for reducing in-process and in-use stiction for MEMS devices

#14
20170096328
2017-04-06

Method and apparatus for reducing in-process and in-use stiction for MEMS devices

#15
20170068215
2017-03-09

Method for manufacturing a micromechanical timepiece part and said micromechanical timepiece part

#16
20160318754
2016-11-03

MEMS structure having rounded edge stopper and method of fabricating the same

#17
20150346391
2015-12-03

METHOD FOR FORMING ANTI STICTION COATING AND ANTI STICTION COATING THEREOF

#18
20080116554
2008-05-22

PACKAGING MICRO DEVICES

#19
17009753
2021-12-07

Method for preparing silicon wafer with rough surface and silicon wafer