84149 ⎘
Forming microstructural systems; Packaging MEMS Using a carrier for applying a plurality of packaging lids to the system wafer
MEMS DEVICE HAVING AN IMPROVED CAP AND MANUFACTURING PROCESS THEREOF
#2PACKAGING STRUCTURES AND PACKAGING METHODS FOR ULTRASOUND-ON-CHIP DEVICES
#3Method for producing a plurality of sensor devices, and sensor device
#4Optical electronics device
#5PACKAGING STRUCTURES AND PACKAGING METHODS FOR ULTRASOUND-ON-CHIP DEVICES
#6Eutectic bonding with AlGe
#7Eutectic bonding with ALGe
#8Method for producing optical components using functional elements
#9Eutectic bonding with AlGe
#10Optical electronics device
#11Temporary mechanical stabilization of semiconductor cavities
#12Transfer method, manufacturing method, device and electronic apparatus of MEMS
#13Low cost wafer level process for packaging MEMS three dimensional devices
#14Optical electronic device and method of fabrication
#15Stacked MEMS microphone packaging method
#16Method for processing product wafers using carrier substrates
#17Method for handling a thin substrate and for substrate capping
#18Thin back glass interconnect
#19ENCAPSULATION OF EMS DEVICES ON GLASS
#20Method for handling a thin substrate and for substrate capping
#21Wafer Level Package and Manufacturing Method Using Photodefinable Polymer for Enclosing Acoustic Devices
#22Method and device for encapsulating microstructures
#23DEVICE PACKAGES AND METHODS OF FABRICATING THE SAME
#24Method for manufacturing capped MEMS components
#25MEMS package having formed metal lid
#26Wafer lever fixture and method for packaging micro-electro-mechanical-system devices
#27METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE STRUCTURE HAVING MICRO-ELECTRO-MECHANICAL SYSTEMS
#28Protection capsule for MEMS devices
#29Method for wafer-level package
#30Method of manufacturing semiconductor sensor
#31Wafer level package and method for making the same
#32Method for fabricating protective caps for protecting elements on a wafer surface
#33Method for forming at least one protective cap
#34Moulding assembly for forming at least one protective cap
#35Method of fabricating an array of wafer scale polymeric caps