B81C2203/01 - CPC Classification Index

ClassID:

84146 ⎘

B81C2203/01 - CPC Classification

Classification description:

Forming microstructural systems Packaging MEMS

Sub-classes:

B81C2203/0109 » Bonding an individual cap on the substrate 384
B81C2203/0118 » Bonding a wafer on the substrate, i.e. where the cap consists of another wafer 563
B81C2203/0127 » Using a carrier for applying a plurality of packaging lids to the system wafer 35
B81C2203/0136 » Growing or depositing of a covering layer 287
B81C2203/0145 » Hermetically sealing an opening in the lid 349
B81C2203/0154 » Moulding a cap over the MEMS device 144
B81C2203/0163 » Reinforcing a cap, e.g. with ribs 27
B81C2203/0172 » Seals 89

Recent Application in this class:

20250343119

2025-11-06

BOTTOM PACKAGE EXPOSED DIE MEMS PRESSURE SENSOR INTEGRATED CIRCUIT PACKAGE DESIGN

20250313454

2025-10-09

METHODS AND APPARATUS FOR ELECTRONIC DEVICE PACKAGING

20230126914

2023-04-27

METHODS AND APPARATUS FOR ELECTRONIC DEVICE PACKAGING

20220285249

2022-09-08

BOTTOM PACKAGE EXPOSED DIE MEMS PRESSURE SENSOR INTEGRATED CIRCUIT PACKAGE DESIGN

20210323810

2021-10-21

Method for producing damper structures on a micromechanical wafer

20200377364

2020-12-03

MEMS package, MEMS microphone, method of manufacturing the MEMS package and method of manufacturing the MEMS microphone

20200307991

2020-10-01

Electronic device and corresponding manufacturing method

20200048076

2020-02-13

MEMS chip and electrical packaging method for MEMS chip

20190375630

2019-12-12

MEMS device stress-reducing structure

#10

20180134546

2018-05-17

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

#11

20170260045

2017-09-14

Transfer method, manufacturing method, device and electronic apparatus of MEMS

#12

20170166436

2017-06-15

Manufacturing method for a micromechanical pressure sensor device and corresponding micromechanical pressure sensor device

#13

20170113925

2017-04-27

Method of encapsulating a microelectronic component

#14

20160311679

2016-10-27

Chip package and a method of producing the same

#15

20150274507

2015-10-01

MEMS device and formation method thereof

#16

13969052

2015-10-20

Metal mesh lid MEMS package and method