84152 ⎘
Forming microstructural systems; Packaging MEMS Moulding a cap over the MEMS device
Embedded Digital Sensor Structure
#2SEMICONDUCTOR DEVICE WITH A MICROMECHANICAL COMPONENT
#3Stacked-die MEMS resonator
#4SEMICONDUCTOR PACKAGE WITH METAL COLUMN MOLD BARRIER
#5OVERMOULDED PRESSURE SENSOR WITH ENCAPSULATING GEL AND METAL COVER ON SUBSTRATE
#6PACKAGING FOR MICRO-ELECTROMECHANICAL SYSTEM (MEMS) DEVICE
#7MEMS ACOUSTIC ELEMENT
#8STACKED-DIE MEMS RESONATOR
#9MEMS DEVICE WITH AN IMPROVED CAP AND RELATED MANUFACTURING PROCESS
#10MEMS resonator system
#11Method of manufacturing a sensor device and moulding support structure
#12Method of manufacturing electronic devices and corresponding electronic device
#13Semiconductor package with metal column mold barrier
#14Stacked-die MEMS resonator
#15Sensing device and method for manufacturing sensing device
#16Hollow package and method for manufacturing same
#17Three-dimensional features formed in molded panel
#18Microelectromechanical system (MEMS) sensor packages and methods for producing microelectromechanical system sensor packages having a plurality of MEMS sensor chips
#19Stacked-die MEMS resonator
#20Integrated MEMS cavity seal
#21Semiconductor device packages and methods of manufacturing the same
#22Packaged pressure sensor device
#23Chip packages and methods for forming the same
#24Manufacturing of integrated circuit resonator
#25Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip
#26MEMS devices including MEMS dies and connectors thereto
#27Chip packages and methods for forming the same
#28Method of manufacturing electronic devices and corresponding electronic device
#29Method of manufacturing a sensor device and moulding support structure
#30Encapsulation of sensing device
#31Molded lead frame sensor package
#32Thin-film type package
#33Shielded semiconductor device and lead frame therefor
#34Sensor device with flip-chip die and interposer
#353D-printed protective shell structures with support columns for stress sensitive circuits
#36Wafer-level fan-out package with enhanced performance
#37Wafer-level fan-out package with enhanced performance
#38MEMS devices including MEMS dies and connectors thereto
#39Micromechanical pressure sensor and method for producing said micromechanical pressure sensor
#40Wafer level package for a mems sensor device and corresponding manufacturing process
#41Overmolded lead frame assembly for pressure sensing applications
#42Package structure for micromechanical resonator
#43Bulk acoustic wave resonator on a stress isolated platform
#44Semiconductor package with air cavity
#45Chip packages and methods for forming the same
#46Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip
#47Gas sensor packages
#48Packaged pressure sensor device
#49System and method for maintaining a smoothed and anti-stiction surface on a MEMS device
#50Method for packaging at least one semiconductor component and semiconductor device
#51Three-dimensional features formed in molded panel
#52MEMS devices including MEMS dies and connectors thereto
#53Low-profile stacked-die MEMS resonator system
#54Semiconductor package with a through port for sensor applications
#55MEMS sensor package systems and methods
#56Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip
#57Method and apparatus for using universal cavity wafer in wafer level packaging
#58Wafer level package for a MEMS sensor device and corresponding manufacturing process
#59Wafer-level package with enhanced performance
#60MEMS component having a high integration density
#61Process for manufacturing a packaged device, in particular a packaged micro-electro-mechanical sensor, having an accessible structure, such as a mems microphone and packaged device obtained thereby
#62Integrated circuit package with sensor and method of making
#63Micromechanical pressure sensor
#64Method for encapsulating a microelectronic device with a release hole of variable dimension
#65Stacked-die MEMS resonator system
#66Micromechanical semiconductor sensing device
#67MEMS devices including MEMS dies and connectors thereto
#68Method and apparatus for using universal cavity wafer in wafer level packaging
#69Integrated circuit package with sensor and method of making
#70Semiconductor device including a cavity lid
#71Thin Film Encapsulation of Electrodes
#72Wafer level package for a MEMS sensor device and corresponding manufacturing process
#73Stress isolated differential pressure sensor
#74Method and apparatus of making MEMS packages
#75Stacked MEMS microphone packaging method
#76Method to package multiple mems sensors and actuators at different gases and cavity pressures
#77Method to package multiple MEMS sensors and actuators at different gases and cavity pressures
#78Semiconductor device with through molding vias and method of making the same
#79Fabrication method of wafer level package having a pressure sensor
#80ELECTRONIC COMPONENT AND MANUFACTURING METHOD OF THE SAME
#81Encapsulated component comprising a MEMS component and method for the production thereof
#82Sensor package having stacked die
#83Stress buffer layer for integrated microelectromechanical systems (MEMS)
#84Micromechanical semiconductor sensing device
#85MEMS devices and methods for forming same
#86Method and structure of MEMS WLCSP fabrication
#87Low-profile stacked-die MEMS resonator system
#88Acoustic Assembly and Method of Manufacturing The Same
#89Flow sensor and method for manufacturing the same
#90Stress buffer layer for integrated microelectromechanical systems (MEMS)
#91Micromechanical sensor system and corresponding manufacturing method
#92Process for manufacturing a packaged device, in particular a packaged micro-electro-mechanical sensor, having an accessible structure, such as a MEMS microphone and packaged device obtained thereby
#93Integrated circuit package and method
#94Micromechanical component, manufacturing method for a micromechanical component and method for mounting a micromechanical component
#95Chip package including a microphone structure and a method of manufacturing the same
#96Microphone
#97Electronic device with an interlocking mold package
#98Distributed MEMS devices time synchronization methods and system
#99MEMS sensor package systems and methods
#100MEMS pressure sensor and manufacturing method therefor
#101Package structure having micro-electro-mechanical system element and method of fabrication the same
#102Packaging compatible wafer level capping of MEMS devices
#103Packaged sensor structure having sensor opening and package opening aligned with sensor element
#104Semiconductor component and corresponding production method
#105Micromechanical semiconductor sensing device
#106Dynamic quantity sensor
#107Method for producing a two-chip assembly and corresponding two-chip assembly
#108Method for fabricating package structure having MEMS elements
#109Semiconductor device and manufacturing method
#110Component support and assembly having a MEMS component on such a component support
#111COMPONENT AND METHOD FOR THE MANUFACTURE THEREOF
#112MEMS device assembly and method of packaging same
#113Method of forming electronic device that includes forming protective package to house substrate and die attached thereto while leaving first and second active surface portions of the die exposed
#114Multi-chip package
#115MEMS device assembly and method of packaging same
#116Pressure sensor package systems and methods
#117Wafer level package having a pressure sensor and fabrication method thereof
#118Semiconductor device and method of manufacture thereof
#119Device and method for producing a device
#120Microfluidic system for purposes of analysis and diagnosis and corresponding method for producing a microfluidic system
#121Stacked die package for MEMS resonator system
#122Semiconductor device with hollow structure
#123Molded differential PRT pressure sensor
#124Packaging for micro electro-mechanical systems and methods of fabricating thereof
#125Manufacturing method of an electronic device including overmolded MEMS devices
#126Chip module and method for producing a chip module having plains of extensions for chip and substrate
#127Sensor device and manufacturing method thereof
#128Integrated Encapsulation for MEMS Devices
#129PACKAGE FOR MICRO-ELECTRO-MECHANICAL SYSTEMS OF THE MEMS TYPE AND CORRESPONDING MANUFACTURING PROCESS
#130METHOD FOR MANUFACTURING A MICROELECTRONIC PACKAGE COMPRISING A SILICON MEMS MICROPHONE
#131Housing for micro-mechanical and micro-optical components used in mobile applications
#132Sensor device including two sensors embedded in a mold material
#133Semiconductor device and manufacturing method
#134Electronic device, system, and method comprising differential sensor MEMS devices and drilled substrates
#135System and method of encapsulation
#136Molded Sensor Package and Assembly Method
#137Electrical device and method
#138MANUFACTURING METHOD OF AN ELECTRONIC DEVICE INCLUDING OVERMOLDED MEMS DEVICES
#139MEMS SWITCH AND METHOD OF FABRICATING THE SAME
#140Device structure with preformed ring and method therefor
#141Semiconductor Sensor
#142Semiconductor device with hollow structure
#143Semiconductor package substrate and methods for forming same, in particular for MEMS devices
#144Semiconductor chip package and method manufacturing method thereof
#145Stacked die package for MEMS resonator system
#146Packaging for micro electro-mechanical systems and methods of fabricating thereof
#147METHOD FOR MANUFACTURING PLASTIC PACKAGING OF MEMS DEVICES AND STRUCTURE THEREOF
#148Semiconductor chip package and manufacturing method thereof
#149Injection-molded package for MEMS inertial sensor
#150Method for packaging semiconductor chips and corresponding semiconductor chip system
#151Embedded digital sensor structure
#152Molded package structure with glue bleed stopper for sealing a MEMs device method of packaging a MEMs device
#153Metal mesh lid MEMS package and method