ENCAPSULATED MEMS DEVICES

Hermetically sealed, toughened glass package and method for producing same

Method for producing a plurality of sensor devices, and sensor device

Electronic component and module including the same

Corrugated package for microelectromechanical system (MEMS) device

Covering for a component and method for producing a covering for a component

Getter device for a micromechanical component

Semiconductor device package including a wall and a grounding ring exposed from the wall

Semiconductor device including a cavity lid

SYSTEMS AND METHODS FOR FORMING MEMS ASSEMBLIES INCORPORATING GETTERS

MEMS device

Encapsulation structure including a mechanically reinforced cap and with a getter effect

Electronic device with an interlocking mold package

Electronic device, method of manufacturing the same, and oscillator

METAL THIN SHIELD ON ELECTRICAL DEVICE

FUNCTIONAL DEVICE AND MANUFACTURING METHOD THEREOF

Method for encapsulating a microcomponent using a mechanically reinforced cap

Thin film wafer level package

System and method for display device with reinforcing substance

MEMS package having formed metal lid

Microcomponent provided with a cavity delimited by a cap with enhanced mechanical resistance

Functional device with functional structure of a microelectromechanical system disposed in a cavity of a substrate, and manufacturing method thereof

REINFORCED MICRO-ELECTROMECHANICAL SYSTEM PACKAGE STRUCTURE

Method and apparatus for reducing back-glass deflection in an interferometric modulator display device

System and method for protecting microelectromechanical systems array using structurally reinforced back-plate

System and method for display device with reinforcing substance

Integrated lid formed on MEMS device

System and method for protecting microelectromechanical systems array using back-plate with non-flat portion

Metal mesh lid MEMS package and method