B81C2203/031 - CPC Classification Index

#1

20250136441

2025-05-01

WAFER-LEVEL FABRICATION PROCESSES FOR FERRIMAGNETIC RESONATORS AND RESONATOR DEVICES

#2

20240409398

2024-12-12

MEMS DEVICE WITH A CAP LAYER HAVING GAPS AND METHOD OF MANUFACTURING A MEMS DEVICE

#3

20240002218

2024-01-04

MICROMECHANICAL STRUCTURE WITH BONDED COVER

#4

20230406698

2023-12-21

MICROELECTROMECHANICAL ELEMENT AND A METHOD FOR MANUFACTURING IT

#5

20230384164

2023-11-30

INFRARED DETECTOR FORMING METHOD AND ASSOCIATED INFRARED DETECTOR

#6

20230127991

2023-04-27

LIGHT SCANNER PACKAGE AND METHOD FOR MANUFACTURING SAME

#7

20230067030

2023-03-02

FABRICATION OF MEMS STRUCTURES FROM FUSED SILICA FOR INERTIAL SENSORS

#8

20220373518

2022-11-24

DEVICES FOR MICRO GAS CHROMATOGRAPHY AND METHODS OF MAKING AND USES THEREOF

#9

20220289567

2022-09-15

Method for bonding wafers, and a wafer

#10

20220041432

2022-02-10

Manufacturing method for a micromechanical component, a corresponding micromechanical component and a corresponding configuration

#11

20210221678

2021-07-22

Microelectromechanical structure with bonded cover

#12

20200406255

2020-12-31

Microfluidic device

#13

20200282424

2020-09-10

OPTICALLY TRANSPARENT MICROMACHINED ULTRASONIC TRANSDUCER (CMUT)

#14

20200095121

2020-03-26

Reversible anodic bonding

#15

20200079646

2020-03-12

Encapsulated microelectromechanical structure

#16

20200055727

2020-02-20

Method for producing a microelectromechanical component and wafer system

#17

20200048077

2020-02-13

Methods for increasing aspect ratios in comb structures

#18

20200002802

2020-01-02

Process for making alkali metal vapor cells

#19

20190382263

2019-12-19

Method for producing a system including a first microelectromechanical element and a second microelectromechanical element, and a system

#20

20190330054

2019-10-31

COATED OPTICAL ELEMENT COMPONENT WITH A COATED OPTICAL ELEMENT AND METHOD TO PRODUCE THE SAME

#21

20190323912

2019-10-24

High temperature capacitive MEMS pressure sensor

#22

20190135619

2019-05-09

Method for producing optical components using functional elements

#23

20190127215

2019-05-02

Semiconductor apparatus having flexible connecting members and method for manufacturing the same

#24

20190074540

2019-03-07

Microelectronic device

#25

20190074240

2019-03-07

Inorganic wafer having through-holes attached to semiconductor wafer

#26

20190064206

2019-02-28

Physical quantity sensor, physical quantity sensor device, portable electronic device, electronic device, and mobile body

#27

20190055121

2019-02-21

Encapsulated microelectromechanical structure

#28

20190010048

2019-01-10

Method for manufacturing gas detector by MEMS process

#29

20180362336

2018-12-20

Microelectro-mechanical system device and method for electrostatic bonding the same

#30

20180212612

2018-07-26

Vapor cell comprising electro-optic function for chip-scale atomic clock, and method for manufacturing sealed container for chip-scale instrument

#31

20180086626

2018-03-29

Method of manufacturing a sensor

#32

20180005922

2018-01-04

Inorganic wafer having through-holes attached to semiconductor wafer

#33

20170362079

2017-12-21

Ceramic substrate, bonded body, module, and method for manufacturing ceramic substrate

#34

20170232474

2017-08-17

Anodically bonded vacuum-sealed capacitive micromachined ultrasonic transducer (CMUT)

#35

20170225950

2017-08-10

Embedded structures for high glass strength and robust packaging

#36

20170166443

2017-06-15

Manufacturing method of micro-electro-mechanical system sensor capable of preventing diffusion phenomenon and reflow phenomenon

#37

20170088413

2017-03-30

Physical quantity sensor, manufacturing method of physical quantity sensor, sensor device, electronic apparatus, and moving object

#38

20170073219

2017-03-16

Manufacturing method of electronic device, electronic device, electronic apparatus, and moving body

#39

20170050843

2017-02-23

Method of manufacturing electronic device

#40

20160332873

2016-11-17

DEVICES WITH THINNED WAFER

#41

20160304335

2016-10-20

Anodic bonding of dielectric substrates

#42

20160297675

2016-10-13

SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING DEVICE

#43

20160244322

2016-08-25

Embedded structures for high glass strength and robust packaging

#44

20160221824

2016-08-04

Method of wafer-level hermetic packaging with vertical feedthroughs

#45

20160167950

2016-06-16

Encapsulated microelectromechanical structure

#46

20160159641

2016-06-09

Environment-resistant module, micropackage and methods of manufacturing same

#47

20160130135

2016-05-12

Physical quantity sensor, method for manufacturing physical quantity sensor, electronic device, and moving body

#48

20160107881

2016-04-21

Microelectromechanical system device with internal direct electric coupling

#49

20160061853

2016-03-03

Physical quantity sensor, electronic device, and mobile body

#50

20160047837

2016-02-18

Physical quantity sensor, electronic apparatus, and moving body

#51

20150207101

2015-07-23

Device and method for producing hermetically-sealed cavities

#52

20140273351

2014-09-18

Method of encapsulating a micro-device by anodic bonding

#53

20140246948

2014-09-04

Transducer, and manufacturing method of the transducer

#54

20130146994

2013-06-13

Method for manufacturing a hermetically sealed structure

#55

20130068020

2013-03-21

Combined sensor and method for manufacturing the same

#56

20120322206

2012-12-20

Method for wafer level packaging of electronic devices

#57

20120217638

2012-08-30

Wiring connection method and functional device

#58

20120199736

2012-08-09

Micro-reflectron for time-of-flight mass spectrometer

#59

20120145308

2012-06-14

METHODS FOR ANODIC BONDING MATERIAL LAYERS TO ONE ANOTHER AND RESULTANT APPARATUS

#60

20120142136

2012-06-07

WAFER LEVEL PACKAGING PROCESS FOR MEMS DEVICES

#61

20110215429

2011-09-08

MANUFACTURING METHOD OF ELECTRONIC DEVICE PACKAGE, ELECTRONIC DEVICE PACKAGE, AND OSCILLATOR

#62

20110204745

2011-08-25

Acoustic sensor

#63

20110188104

2011-08-04

MOVING STRUCTURE AND LIGHT SCANNING MIRROR USING THE SAME

#64

20100330332

2010-12-30

Cover for microsystems and method for producing a cover

#65

20100244161

2010-09-30

Wafer level packaging using flip chip mounting

#66

20100203718

2010-08-12

Mitigation of high stress areas in vertically offset structures

#67

20100181652

2010-07-22

SYSTEMS AND METHODS FOR STICTION REDUCTION IN MEMS DEVICES

#68

20100176468

2010-07-15

Microelectromechanical apparatus and method for producing the same

#69

20100127339

2010-05-27

MICROMECHANICAL COMPONENT HAVING AN ANTI-ADHESIVE LAYER

#70

20100089156

2010-04-15

Mechanical quantity sensor and method of manufacturing the same

#71

20090311818

2009-12-17

Anodic bonding method and method of producing acceleration sensor

#72

20090115049

2009-05-07

Semiconductor package

#73

20090095414

2009-04-16

Anodically bonded ultra-high-vacuum cell

#74

20090026559

2009-01-29

Boron doped shell for MEMS device

#75

20090007669

2009-01-08

Capacitive acceleration sensor

#76

20080315400

2008-12-25

MICROELECTROMECHANICAL SYSTEMS DESIGN FEATURE

#77

20080145970

2008-06-19

Stack structure and method of manufacturing the same

#78

20080029863

2008-02-07

Methods of fabrication of wafer-level vacuum packaged devices

#79

20070257357

2007-11-08

Forcing gas trapped between two components into cavities

#80