84157 ⎘
Forming microstructural systems Bonding two components
Sub-classes:METHOD OF FORMING MICRO-ELECTROMECHANICAL SYSTEM DEVICE
#2WAFER LEVEL PROXIMITY SENSOR AND METHOD OF MAKING SAME
#3ADAPTIVE CAVITY THICKNESS CONTROL FOR MICROMACHINED ULTRASONIC TRANSDUCER DEVICES
#4METHOD OF FABRICATING MICRO-ELECTROMECHANICAL SYSTEM DEVICE
#5MICRO-ELECTROMECHANICAL SYSTEMS (MEMS) DEVICE AND NOISE CANCELLATION METHOD
#6DIGITAL ASSEMBLY OF SPHERICAL HYDROGEL VOXELS TO FORM 3D LATTICE STRUCTURES
#7MEMS CHIP, MANUFACTURING METHOD THEREOF, MEMS DEVICE, AND ELECTRONIC DEVICE
#8Adaptive cavity thickness control for micromachined ultrasonic transducer devices
#9MICRO-ELECTROMECHANICAL SYSTEM DEVICE AND METHOD OF FORMING THE SAME
#10Micro-electromechanical system device and method of forming the same
#11Method and structure for sensors on glass
#12MEMS device manufacturing method and mems device
#13Microfluidic chip and a method for the manufacture of a microfluidic chip
#14Semiconductor device and method for manufacturing the same
#15Microfluidic device
#16Adaptive cavity thickness control for micromachined ultrasonic transducer devices
#17Actuator layer patterning with topography
#18Actuator layer patterning with topography
#19Plurality of filters
#20Method for producing MEMS transducer, MEMS transducer, ultrasound probe, and ultrasound diagnostic apparatus
#21Two degree of freedom dithering platform for MEMS sensor calibration
#22Two degree of freedom dithering platform for MEMS sensor calibration
#23Systems and methods for an encoder and control scheme
#24Method for forming MEMS cavity structure