MEMS PRESSURE TRANSDUCER WAFER-LEVEL CHIP-SCALE PACKAGE AND METHOD FOR PRODUCING THE SAME

SEAL FOR MICROELECTRONIC ASSEMBLY

MEMS DEVICES SINGULATED BY PLASMA ETCH

PACKAGE FOR MULTIPLE LOUDSPEAKERS

DUAL MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF

DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE

DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE

MEMS DEVICE WITH AN IMPROVED CAP AND RELATED MANUFACTURING PROCESS

METHOD AND APPARATUS FOR THE OPTICAL CONTACT BONDING OF COMPONENTS

METHODS FOR ULTRASONIC FABRICATION AND SEALING OF MICROFLUIDICS

MICROMECHANICAL STRUCTURE WITH BONDED COVER

SEAL FOR MICROELECTRONIC ASSEMBLY

MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) DEVICE and fabrication method thereof

PRODUCTION METHOD FOR A MICROMECHANICAL COMPONENT FOR A SENSOR DEVICE OR MICROPHONE DEVICE

WAFER LEVEL PROCESSING FOR MICROELECTRONIC DEVICE PACKAGE WITH CAVITY

Seal for microelectronic assembly

Dual micro-electro mechanical system and manufacturing method thereof

Contact lens, method for detecting a structure-borne sound with the aid of a contact lens, method for producing a contact lens

Method for manufacturing a microelectronic device comprising a membrane suspended above a cavity

MANUFACTURING METHOD FOR BONDED SUBSTRATE

Segmented pedestal for mounting device on chip

Microelectromechanical structure with bonded cover

Vapor cells having one or more optical windows bonded to a dielectric body

Dual micro-electro mechanical system and manufacturing method thereof

Segmented pedestal for mounting device on chip

Semiconductor device with discharge path, and method for producing the same

Method for forming hermetic seals in MEMS devices

Bonded structures

Seal for microelectronic assembly

Seal for microelectronic assembly

3D stack configuration for 6-axis motion sensor

Micro Devices Formed by Flex Circuit Substrates

Encapsulated microelectromechanical structure

Micro-mechanical sensor and method for manufacturing a micro-electro-mechanical sensor

Method for forming hermetic seals in MEMS devices

Micro devices formed by flex circuit substrates

Encapsulated microelectromechanical structure

Heater design for MEMS chamber pressure control

Microelectro-mechanical system device and method for electrostatic bonding the same

Methods of making microfluidic devices

Seal for microelectronic assembly

MEMS manufacturing method and MEMS manufacturing apparatus

Capacitive micromachined ultrasonic transducers (CMUTs) and related apparatus and methods

Bonded structures

Methods of achieving universal interfacing using suspended and/or freestanding structures

Electrolytic seal

Electrolytic seal

Systems and methods for a MEMS actuation systems device with one or more slidable connection assemblies

MEMS actuation systems and methods

MEMS actuation systems and methods

METHOD OF FABRICATION OF Al/GE BONDING IN A WAFER PACKAGING ENVIRONMENT AND A PRODUCT PRODUCED THEREFROM

Micromechanical component and method for producing same

System with an increased surface density of microelectromechanical or nanoelectromechanical devices

Heater design for MEMS chamber pressure control

Method for providing a MEMS device with a plurality of sealed enclosures having uneven standoff structures and MEMS device thereof

Method of fabrication of Al/Ge bonding in a wafer packaging environment and a product produced therefrom

Membrane bonding with photoresist

Bonded wafer structure having cavities with low pressure and method for forming

MEMS silicone microphone and manufacturing method thereof

MEMS PRESSURE SENSOR AND METHOD FOR FORMING THE SAME

Method for manufacturing microcantilever

Encapsulated microelectromechanical structure

Metal-based microchannel heat exchangers made by molding replication and assembly

Microelectromechanical systems devices with improved reliability

Method of fabrication of Al/Ge bonding in a wafer packaging environment and a product produced therefrom

Bonding method and method of manufacturing microchannel device

Method of fabricating electromechanical microchips with a burst ultrafast laser pulses

Wafer bonding method for use in making a MEMS gyroscope

Method of fabrication of Al/Ge bonding in a wafer packaging environment and a product produced therefrom

Using millisecond pulsed laser welding in MEMS packaging

Method of adhering hard silicone resin, method of adhering substrate having fine structure, and preparation method of micro fluidic device utilizing adhesion method

Microchip and method of manufacturing the same

Compression and cold weld sealing method for an electrical via connection

Contact Arrangement For Establishing A Spaced, Electrically Conducting Connection Between Microstructured Components

AIRTIGHT ASSEMBLY OF TWO COMPONENTS AND METHOD FOR PRODUCING SUCH AN ASSEMBLY

Simplified copper-copper bonding

Method of fabrication of Al/GE bonding in a wafer packaging environment and a product produced therefrom

METHOD FOR SEALING TWO ELEMENTS BY LOW TEMPERATURE THERMOCOMPRESSION

Arrangement of two substrates having an SLID bond and method for producing such an arrangement

Method of fabricating a micro-mechanical component

LOW TEMPERATURE METHOD OF BONDING SUBSTRATES HAVING AT LEAST ONE SURFACE THAT INCLUDES A LAYER OF SU8

COMPOSITE OF AT LEAST TWO SEMICONDUCTOR SUBSTRATES AND A PRODUCTION METHOD

Metal-Based Microchannel Heat Exchangers Made by Molding Replication and Assembly

Method of manufacturing multi-level, silicon, micromechanical parts and parts thereby obtained

Systems and methods for fabricating an out-of-plane MEMS structure

Manufacturing method of three-dimensional structure

Wafer level package structure, and sensor device obtained from the same package structure

Microwave Cure of Semiconductor Devices

Sensor device and production method therefor

Wafer level package structure and production method therefor

Sensor device and production method therefor

ULTRASONIC WELDING-BASED MICROFLUIDIC DEVICE AND METHOD OF MANUFACTURING THE SAME

Method for fabricating a microfluidic component comprising at least one microchannel filled with nanostructures

Method of fabrication of AI/GE bonding in a wafer packaging environment and a product produced therefrom

Method of wafer-to-wafer bonding

Wafer encapsulated microelectromechanical structure and method of manufacturing same

Wafer encapsulated microelectromechanical structure and method of manufacturing same

Wafer encapsulated microelectromechanical structure and method of manufacturing same

Wafer encapsulated microelectromechanical structure and method of manufacturing same

Wafer encapsulated microelectromechanical structure and method of manufacturing same

Wafer encapsulated microelectromechanical structure and method of manufacturing same

Wafer encapsulated microelectromechanical structure and method of manufacturing same

Wafer encapsulated microelectromechanical structure and method of manufacturing same

Wafer encapsulated microelectromechanical structure and method of manufacturing same

Wafer encapsulated microelectromechanical structure and method of manufacturing same

Flash welding of conducting polymer nanofibers

Imprint lithographic method for making a polymeric structure

Method of fabrication of a AL/GE bonding in a wafer packaging environment and a product produced therefrom

Hermetically sealing using a cold welded tongue and groove structure

Hermetically sealed product and related methods of manufacture

Decal transfer lithography

Hermetically sealing a container with crushable material and reactive multilayer material

Microwave bonding of MEMS component

Bonding method, bonding apparatus and sealing means

Method of imprinting shadow mask nanostructures for display pixel segregation

Imprinting of supported and free-standing 3-D micro- or nano-structures

Polymerization welding and application to microfluidics

Method for producing and testing a corrosion-resistant channel in a silicon device

Vapor cells having one or more optical windows bonded to a dielectric body

Thin MEMS die