B81C2203/051 - CPC Classification Index

#1

20260075366

2026-03-12

FORMING METHODS OF PACKAGE STRUCTURE AND APPARATUS

#2

20260075327

2026-03-12

LENSLESS NEAR-CONTACT IMAGING SYSTEM FOR MICRO ASSEMBLY

#3

20250184623

2025-06-05

LENSLESS NEAR-CONTACT IMAGING SYSTEM FOR MICRO ASSEMBLY

#4

20250136441

2025-05-01

WAFER-LEVEL FABRICATION PROCESSES FOR FERRIMAGNETIC RESONATORS AND RESONATOR DEVICES

#5

20250136437

2025-05-01

Membrane Device Fabrication

#6

20240031740

2024-01-25

Sound producing cell

#7

20240022859

2024-01-18

PACKAGE STRUCTURE, APPARATUS AND FORMING METHODS THEREOF

#8

20230199392

2023-06-22

Sound producing cell and manufacturing method thereof

#9

20220340416

2022-10-27

A PROCESS AND APPARATUS FOR THE PREPARATION OF A BONDED SUBSTRATE

#10

20220324703

2022-10-13

METHOD AND ARRANGEMENT FOR ASSEMBLY OF MICROCHIPS INTO A SEPARATE SUBSTRATE

#11

20220002148

2022-01-06

Device and method for monitoring surface condition of contact surface of detected object

#12

20210323815

2021-10-21

System and methods for microfabrication

#13

20210139322

2021-05-13

Micro-electromechanical (MEM) power relay

#14

20200084892

2020-03-12

Micro Devices Formed by Flex Circuit Substrates

#15

20190104616

2019-04-04

Micro devices formed by flex circuit substrates

#16

20190088493

2019-03-21

Method of manufacturing a semiconductor device, and a semiconductor substrate

#17

20190008479

2019-01-10

Method for producing MEMS transducer, MEMS transducer, ultrasound probe, and ultrasound diagnostic apparatus

#18

20170305739

2017-10-26

Method for manufacturing an electromechanical device and corresponding device

#19

20170225945

2017-08-10

Micro-transfer-printed compound sensor device

#20

20150077172

2015-03-19

Externally induced charge patterning using rectifying devices

#21

20140037121

2014-02-06

Microphone and method to position a membrane between two backplates

#22

20130320803

2013-12-05

Electronic device, electronic apparatus, and method of manufacturing electronic device

#23

20130241012

2013-09-19

Eutectic bonding of thin chips on a carrier substrate

#24

20130010341

2013-01-10

Alignment methods in fluid-filled MEMS displays

#25

20120275972

2012-11-01

Joining method and joint for microfluidic components

#26

20120273455

2012-11-01

METHODS FOR ALIGNED TRANSFER OF THIN MEMBRANES TO SUBSTRATES

#27

20120145572

2012-06-14

CONTAINERS ASSEMBLED IN FLUID AND CORRESPONDING PRODUCTION

#28

20110299969

2011-12-08

Device for grasping and active release of micro and nano objects

#29

20110002109

2011-01-06

Device for self-aligning and affixing of a microchannel plate in a micro-system and method the same

#30

20100258951

2010-10-14

Assembling substrates that can form 3-D structures

#31

20100219496

2010-09-02

Wafer arrangement and a method for manufacturing the wafer arrangement

#32

20100105167

2010-04-29

MEMS devices and methods of assembling micro electromechanical systems (MEMS)

#33

20100097776

2010-04-22

Assembling stacked substrates that can form 3-D structures

#34

20100075482

2010-03-25

Bonded wafer assembly system and method

#35

20100064808

2010-03-18

Acceleration sensor and method of manufacturing acceleration sensor

#36

20100054092

2010-03-04

Method of manufacturing multi-level, silicon, micromechanical parts and parts thereby obtained

#37

20100049467

2010-02-25

Device for measuring alignment of adjoining structures

#38

20100020517

2010-01-28

MEMS BUMP PATTERN DIE ALIGNMENT SYSTEMS AND METHODS

#39

20090323165

2009-12-31

Method for packing a display device and the device obtained thereof

#40

20090215207

2009-08-27

Alignment method of two substrates by microcoils

#41

20090191661

2009-07-30

Placing a MEMS part on an application platform using a guide mask

#42

20090147431

2009-06-11

Assembling stacked substrates that can form cylindrical inductors and adjustable transformers

#43

20090007413

2009-01-08

Method of manufacturing vibrating micromechanical structures

#44

20080261372

2008-10-23

Method of manufacturing vibrating micromechanical structures

#45

20080261344

2008-10-23

Vacuum packaged single crystal silicon device

#46

20080261343

2008-10-23

Vacuum packaged single crystal silicon device

#47

20080248600

2008-10-09

Method and device for wafer backside alignment overlay accuracy

#48

20080138957

2008-06-12

Triple alignment substrate method and structure for packaging devices

#49

20080062638

2008-03-13

Monolithic structures including alignment and/or retention fixtures for accepting components

#50

20080037104

2008-02-14

Alignment methods in fluid-filled MEMS displays

#51

20070126075

2007-06-07

Method for packaging semiconductor device and package structure thereof

#52

20060292828

2006-12-28

Wafer and method of cutting the same

#53

20060270179

2006-11-30

Triple alignment substrate method and structure for packaging devices

#54

20060237810

2006-10-26

Bonding interface for micro-device packaging

#55

20060211234

2006-09-21

Re-assembly process for MEMS structures

#56

20060211169

2006-09-21

Vacuum packaged single crystal silicon device

#57

20060207087

2006-09-21

Method of manufacturing vibrating micromechanical structures

#58

20060157839

2006-07-20

Re-assembly process for MEMS structures

#59

20060139643

2006-06-29

Alignment method of using alignment marks on wafer edge

#60

20060130955

2006-06-22

Methods and systems for aligning and coupling devices

#61

20050255666

2005-11-17

Method and structure for aligning mechanical based device to integrated circuits

#62

20050255412

2005-11-17

Method and structure for fabricating mechanical mirror structures using backside alignment techniques

#63

20050160816

2005-07-28

Vibrating beam accelerometer

#64

20050091843

2005-05-05

Vibrating beam accelerometer two-wafer fabrication process