B81C2203/05 - CPC Classification Index

ClassID:

84165 ⎘

B81C2203/05 - CPC Classification

Classification description:

Forming microstructural systems Aligning components to be assembled

Sub-classes:

B81C2203/051 » Active alignment, e.g. using internal or external actuators, magnets, sensors, marks or marks detectors 59
B81C2203/052 » Passive alignment, i.e. using only structural arrangements or thermodynamic forces without an internal or external apparatus 1
B81C2203/058 » Aligning components using methods not provided for in to 16

Recent Application in this class:

20210002130

Capping plate for panel scale packaging of MEMS products

20190308874

ASSEMBLY AND PACKAGING OF MEMS DEVICE

20190162578

Self-cleaning liquid level sensor

20190008479

Method for producing MEMS transducer, MEMS transducer, ultrasound probe, and ultrasound diagnostic apparatus

20170044007

Assembly and packaging of MEMS device