84175 ⎘
Forming microstructural systems; Integrating an electronic processing unit with a micromechanical structure; Monolithic integration, i.e. the electronic processing unit is formed on or in the same substrate as the micromechanical structure Forming the micromechanical structure with a low-temperature process
Heterogenous integration of complementary metal-oxide-semiconductor and MEMS sensors
#2Display device, method of manufacturing the same, display method, and wearable device
#3Low temperature ceramic Microelectromechanical structures
#4Planar microshells for vacuum encapsulated devices and damascene method of manufacture
#5Planar microshells for vacuum encapsulated devices and damascene method of manufacture
#6Microshells with integrated getter layer
#7Low temperature ceramic microelectromechanical structures
#8Low temperature fabrication of conductive micro structures