B81C2203/0707 - CPC Classification Index

ClassID:

84173 ⎘

B81C2203/0707 - CPC Classification

Classification description:

Forming microstructural systems; Integrating an electronic processing unit with a micromechanical structure Monolithic integration, i.e. the electronic processing unit is formed on or in the same substrate as the micromechanical structure

Sub-classes:

B81C2203/0714 » Forming the micromechanical structure with a CMOS process 145
B81C2203/0721 » Forming the micromechanical structure with a low-temperature process 8
B81C2203/0728 » Pre-CMOS, i.e. forming the micromechanical structure before the CMOS circuit 38
B81C2203/0735 » Post-CMOS, i.e. forming the micromechanical structure after the CMOS circuit 197
B81C2203/0742 » Interleave, i.e. simultaneously forming the micromechanical structure and the CMOS circuit 64
B81C2203/075 » the electronic processing unit being integrated into an element of the micromechanical structure 24
B81C2203/0757 » Topology for facilitating the monolithic integration 2

Recent Application in this class:

20240010490

2024-01-11

DETECTION STRUCTURE FOR A MEMS ACCELEROMETER HAVING IMPROVED PERFORMANCES AND MANUFACTURING PROCESS THEREOF

20230242394

2023-08-03

COMPACT, EASY-TO-PRODUCE MEMS PACKAGE WITH IMPROVED PROTECTIVE PROPERTIES

20230064645

2023-03-02

PROTECTIVE BONDLINE CONTROL STRUCTURE

20210347636

2021-11-11

PROCESS FOR MANUFACTURING A DEVICE FOR DETECTING ELECTROMAGNETIC RADIATION, COMPRISING A SUSPENDED DETECTION ELEMENT

20200216306

2020-07-09

Apparatus having a bondline structure and a diffusion barrier with a deformable aperture

20190202684

2019-07-04

PROTECTIVE BONDLINE CONTROL STRUCTURE

20170313577

2017-11-02

Integrated circuits having shielded MEMS devices and methods for fabricating shielded MEMS devices

20170271446

2017-09-21

Method of manufacturing semiconductor devices with transistor cells and semiconductor device

20170217755

2017-08-03

Pressure sensor, manufacturing method of pressure sensor, altimeter, electronic apparatus, and moving object

#10

20170057808

2017-03-02

MEMS CHIP PACKAGE AND METHOD FOR MANUFACTURING THE SAME

#11

20160297675

2016-10-13

SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING DEVICE

#12

20150353344

2015-12-10

Cavity structures for MEMS devices

#13

20140252422

2014-09-11

Cavity structures for MEMS devices

#14

20120211805

2012-08-23

CAVITY STRUCTURES FOR MEMS DEVICES