ClassID:

84176

B81C2203/0728 - CPC Classification

Classification description:

Forming microstructural systems; Integrating an electronic processing unit with a micromechanical structure; Monolithic integration, i.e. the electronic processing unit is formed on or in the same substrate as the micromechanical structure Pre-CMOS, i.e. forming the micromechanical structure before the CMOS circuit

Recent Application in this class:
#1
20250059023
2025-02-20

FOUNDRY-COMPATIBLE THROUGH SILICON VIA PROCESS FOR INTEGRATED MICRO-SPEAKER AND MICROPHONE

#2
20250030998
2025-01-23

FOUNDRY-COMPATIBLE PROCESS FOR INTEGRATED MICRO-SPEAKER AND MICROPHONE

#3
20220268648
2022-08-25

Integrated digital force sensors and related methods of manufacture

#4
20210291228
2021-09-23

Microfabricated ultrasonic transducer having individual cells with electrically isolated electrode sections

#5
20200070206
2020-03-05

Microfabricated ultrasonic transducer having individual cells with electrically isolated electrode sections

#6
20190383676
2019-12-19

Integrated digital force sensors and related methods of manufacture

#7
20190160490
2019-05-30

Microfabricated ultrasonic transducer having individual cells with electrically isolated electrode sections

#8
20180369862
2018-12-27

Microfabricated ultrasonic transducer having individual cells with electrically isolated electrode sections

#9
20180290883
2018-10-11

Forming a microelectromechanical systems (MEMS) device using silicon-on-nothing and epitaxy

#10
20180111824
2018-04-26

Semiconductor structure and manufacturing method thereof

#11
20170217755
2017-08-03

Pressure sensor, manufacturing method of pressure sensor, altimeter, electronic apparatus, and moving object

#12
20160257561
2016-09-08

Pressure sensor having a bossed diaphragm

#13
20160043108
2016-02-11

Semiconductor Structure with Multiple Active Layers in an SOI Wafer

#14
20140162392
2014-06-12

Method of forming a suspended structure and a transistor co-integrated on a same substrate

#15
20110027941
2011-02-03

Method of forming monolithic CMOS-MEMS hybrid integrated, packaged structures

#16
20110012111
2011-01-20

Manufacturing method of micro-electro-mechanical device

#17
20100317137
2010-12-16

Method for releasing the suspended structure of a NEMS and/or NEMS component

#18
20100314668
2010-12-16

Device with integrated circuit and encapsulated N/MEMS and method for production

#19
20100289097
2010-11-18

Integrated microphone

#20
20100273286
2010-10-28

Method of fabricating an integrated CMOS-MEMS device

#21
20100109121
2010-05-06

MICROELECTROMECHANICAL SYSTEM

#22
20100087048
2010-04-08

Semiconductor device and manufacturing method thereof

#23
20090275162
2009-11-05

CMOS-compatible bulk-micromachining process for single-crystal MEMS/NEMS devices

#24
20090261416
2009-10-22

INTEGRATED MEMS DEVICE AND CONTROL CIRCUIT

#25
20090134513
2009-05-28

Method and structures for fabricating MEMS devices on compliant layers

#26
20090134492
2009-05-28

Devices for fabricating tri-layer beams

#27
20090134459
2009-05-28

Semiconductor device with integrated circuit electrically connected to a MEMS sensor by a through-electrode

#28
20090057817
2009-03-05

Microelectromechanical system and process of making the same

#29
20080217149
2008-09-11

INTEGRATED ARRANGEMENT AND METHOD FOR PRODUCTION

#30
20070087466
2007-04-19

Integrated microphone

#31
20070072331
2007-03-29

Method for manufacturing a micro-electro-mechanical device

#32
20070072327
2007-03-29

Method of forming an integrated MEMS resonator

#33
20070015361
2007-01-18

Manufacturing method of micro-electro-mechanical device

#34
20060284183
2006-12-21

Semiconductor device and manufacturing method thereof

#35
20060260401
2006-11-23

Integrated monolithic tri-axial micromachined accelerometer

#36
20060255901
2006-11-16

Production of microelectromechanical systems (mems) using the high-temperature silicon fusion bonding of wafers

#37
20060027884
2006-02-09

Silicon carbide MEMS structures and methods of forming the same

#38
20050287760
2005-12-29

Method for fabricating high aspect ratio MEMS device with integrated circuit on the same substrate using post-CMOS process