84038 ⎘
Assembling of devices or systems from individually processed components; Aligning microparts Passive alignment, i.e. without a detection of the position of the elements or using only structural arrangements or thermodynamic forces
BONDING PROCESS FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE
#2METHOD FOR FABRICATING A MICROELECTRONICS H-FRAME DEVICE
#3DIE STACKING WITH CONTROLLED ANGULAR ALIGNMENT
#4Bonding process for forming semiconductor device structure
#5Microelectronics H-frame device
#6Modular 3-D printed devices for sample delivery and method
#7Bonding process for forming semiconductor device structure
#8MEMS package with roughend interface
#9Watch component, watch movement and watch
#10Bonding process for forming semiconductor device structure
#11Automatic registration between circuit dies and interconnects
#12Transfer head and method for transferring micro devices
#13Bonding process for forming semiconductor device structure
#14Method for self-aligning solder-attached mems die to a mounting surface
#15Method For Self-Aligning Solder-Attached Mems Die To A Mounting Surface
#16Method for producing MEMS transducer, MEMS transducer, ultrasound probe, and ultrasound diagnostic apparatus
#17Plurality of electrodes on a substrate having different range of spacing
#18METHOD OF ASSEMBLING NANOSCALE AND MICROSCALE OBJECTS INTO THREE-DIMENSIONAL STRUCTURES
#19MEMS package with roughend interface
#20Method for self-aligning solder-attached MEMS die to a mounting surface
#21Method for producing a structure with spatial encoded functionality
#22Method of manufacturing a sensor
#23MEMS MICRO-MIRROR ASSEMBLY
#24Spatial light modulation element module, photolithographing apparatus, exposure apparatus, method of manufacturing spatial light modulation element module and method of manufacturing device
#25Environment-resistant module, micropackage and methods of manufacturing same
#26Etching method for forming a carrier having inward side walls in particular for confining a droplet for capillary self-assembly
#27Barium titanate nanowire their arrays and array based devices
#28Die bond design for medium pressure sensor
#29Method of manufacturing a MEMS micro-mirror assembly
#30MEMS micro-mirror assembly
#31Method of manufacturing pattern substrate and method of locating component
#32Method and device for producing a microfluidic analysis cartridge
#33Monolithic Package for Housing Microelectromechanical Systems
#34Three dimensional assembly of diamagnetic materials using magnetic levitation
#35METHOD AND SYSTEM FOR WAFER AND STRIP LEVEL BATCH DIE ATTACH ASSEMBLY
#36Method and system for improving alignment precision of parts in MEMS
#37Angle control of multi-cavity molded components for MEMS and NEMS group assembly
#38Method for disposing a component
#39Method for mounting a three-axis MEMS device with precise orientation
#40METHOD FOR THE SELF-ASSEMBLY OF ELECTRICAL, ELECTRONIC OR MICROMECHANICAL COMPONENTS ON A SUBSTRATE
#41STRUCTURE INCLUDING HOLDER UNIT AND DEVICE UNIT AND FIXING METHOD FOR THE SAME
#42Method of fabricating a micro-mechanical component
#43THREE-DIMENSIONAL MAGNETIC STRUCTURE FOR MICROASSEMBLY
#44Semiconductor device and manufacturing method thereof
#45Massively parallel assembly of composite structures using depletion attraction
#46Method and system for improving alignment precision of parts in MEMS
#47Methods of Making, Positioning and Orienting Nanostructures, Nanostructure Arrays and Nanostructure Devices
#48Methods of positioning and/or orienting nanostructures
#49ANGLE CONTROL OF MULTI-CAVITY MOLDED COMPONENTS FOR MEMS AND NEMS GROUP ASSEMBLY
#50Methods of positioning and/or orienting nanostructures
#51Semiconductor device and manufacturing method thereof
#52Methods of making, positioning and orienting nanostructures, nanostructure arrays and nanostructure devices
#53Edge construction on optical devices