METAL-CERAMIC SUBSTRATE HAVING DOUBLE BRAZING LAYERS AND METHOD FOR MANUFACTURING THE SAME

METHODS OF PREPARING METAL SHEETS FOR A DCB / DAB SUBSTRATE BONDING PROCESS

COMPOSITE SUBSTRATE AND METHOD FOR MANUFACTURING SAME

METAL-CERAMIC SUBSTRATE, METHOD FOR THE PRODUCTION THEREOF, AND MODULE

CUTTING TOOL

Bonding method for copper-copper metal with hydrazine hydrate

Method for producing a metal-ceramic substrate with electrically conductive vias

Ceramic materials and seals for high temperature reactive material devices

Copper/ceramic joined body, insulating circuit substrate, copper/ceramic joined body production method, and insulating circuit substrate production method

Method for manufacturing active metal-brazed nitride ceramic substrate with excellent joining strength

Ceramic materials and seals for high temperature reactive material devices

Method for producing a metal-ceramic substrate with at least one via

Method for brazing titanium alloy components with zirconia-based ceramic components for horology or jewellery

Brazed joint and semiconductor processing chamber component having the same

Copper-ceramic bonded body and insulation circuit substrate

Ceramic-metal structure

System and Method for Producing Chemicals at High Temperature

CONTAINER AND METHOD FOR CLOSING AN OPENING OF CONTAINER

Silica glass member, process for producing the same, and process for bonding ceramic and silica glass

Bonded body, power module substrate, method for manufacturing bonded body, and method for manufacturing power module substrate

Metal-ceramic base material, metal-ceramic joint structure, method for producing metal-ceramic joint structure, and mixed powder material

THICK-FILM PASTE MEDIATED CERAMICS BONDED WITH METAL OR METAL HYBRID FOILS

BRAZE COMPOSITIONS, AND RELATED DEVICES

Producing metal/ceramic circuit board by removing residual silver

Method for producing a composite material

Ceramic metal circuit board and semiconductor device using the same

Ceramic materials and seals for high temperature reactive material devices

Method for producing a metal-ceramic substrate with at least one via

Method for joining dissimilar engine components

Metal-on-ceramic substrates

Bonded body, power module substrate, power module and method for producing bonded body

Process for producing bonded body and process for producing power module substrate

Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding paste

Active metal braze joint with stress relieving layer

Ceramic pressure measuring cell and method for its manufacture

Ceramic circuit board

Method for producing a metal-ceramic substrate

3D infiltration method

Bonded body and power module substrate

Method for joining dissimilar engine components

Method for producing ceramic circuit board

Gas turbine engine CMC airfoil assembly

Method of producing bonded body and method of producing power module substrate

Joined body and method for manufacturing the same

Sintered body comprising a plurality of materials and pressure measuring instrument comprising such a sintered body

Joined body and method for producing the same

Method for manufacturing power module substrate

Method for manufacturing bonded body and method for manufacturing power-module substrate

Sample holder

Joined body and method for producing the same

(Ga) Zn Sn oxide sputtering target

Composite body, honeycomb structural body, and method for manufacturing composite body

System and method for producing chemicals at high temperature

Method for producing a multi-layered structural element, and a multi-layered structural element produced according to said method

Ceramic circuit board and electronic device

Power module substrate, power module substrate with heatsink, power module, and method for producing power module substrate

Power module substrate, power module substrate with heat sink, and power module

Method for attaching a pre-sintered body of polycrystalline diamond material to a substrate

Soldering method and method of manufacturing semiconductor device

Sealing assembly, method for preparing sealing assembly, and battery comprising the sealing assembly

Metal-ceramic substrate

Power module substrate, power module substrate with heat sink, power module, and method of manufacturing power module substrate

Shock absorbing member

Active braze techniques on beta-alumina

METHODS OF USING ACTIVE BRAZE TECHNIQUES FOR MAKING HIGH TEMPERATURE RECHARGEABLE BATTERIES

BRAZE COMPOSITIONS, AND RELATED DEVICES

Braze compositions, and related devices

METALLIC COMPOSITIONS USEFUL FOR BRAZING, AND RELATED PROCESSES AND DEVICES

Boron carbide-containing ceramic bonded body and method for producing the bonded body

BRAZED COATED DIAMOND-CONTAINING MATERIALS

Method for producing substrate for power module with heat sink, substrate for power module with heat sink, and power module

MANUFACTURING METHOD FOR LiCoO2, SINTERED BODY AND SPUTTERING TARGET

MANUFACTURING METHOD FOR LiCoO2 SINTERED BODY AND SPUTTERING TARGET

Ceramic sheet product for ceramic electronic component, multilayer ceramic electronic component using the same and method of manufacturing multilayer ceramic electronic component

Method of manufacturing power module substrate and power module substrate

Multilayered structures and methods of making multilayered structures

BORON SUBOXIDE COMPOSITE MATERIAL

CONSTRAINED METAL FLANGES AND METHODS FOR MAKING THE SAME

METHOD FOR THE HIGH-TEMPERATURE-RESISTANT BONDING OF OXYGEN-PERMEABLE OXIDE CERAMICS BASED ON SUBSTITUTED ALKALINE-EARTH COBALTATES BY MEANS OF DOPING-SUPPORTED DIFFUSIVE REACTIVE SINTERING

Double-sided substrate, semiconductor device and method for the same

Bonding structure and bonding method for cemented carbide element and diamond element, cutting tip and cutting element for drilling tool, and drilling tool

Metal-ceramic substrate and method for manufacturing such a substrate

Composite articles made by process for joining stainless steel part and zirconia ceramic part

Metal-Ceramic Substrate

Laminate type semiconductor ceramic capacitor with varistor function

Electrochemical cell with an electrolyte flow, comprising through-electrodes and production method

Methods of making multilayered structures

NON-SHRINKING CERAMIC SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

Power module substrate, power module, and method for manufacturing power module substrate

Double transition joint for the joining of ceramics to metals

Ceramic heater and gas sensor including the same

Continuous or discrete metallization layer on a ceramic substrate

Hermetic sealing assembly and electrical device including the same

Diamond bonded construction with improved braze joint

Metal-ceramic substrate

Superconducting connection between MgB2 superconducting wires via a compressed element made from HTS powder

COMPONENT HAVING A METALIZED CERAMIC BASE

METHOD FOR PRODUCING A METALIZED COMPONENT, CORRESPONDING COMPONENT, AND A SUBSTRATE FOR SUPPORTING THE COMPONENT DURING METALIZATION

COMPONENT HAVING A CERAMIC BASE THE SURFACE OF WHICH IS METALIZED

Ceramic junction member, ceramic heater and gas sensor

NON-SHRINKING CERAMIC SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

Ceramic multilayer substrate and method for manufacturing the same

Component having a ceramic base with a metalized surface

MODULE INCLUDING A STABLE SOLDER JOINT

Method for the refractory assembly of a carbon material and a copper alloy

Electronic Component Union, Electronic Circuit Module Utilizing the Same, and Process for Manufacturing the Same

Bonded metal and ceramic plates for thermal management of optical and electronic devices

Microheat exchanger for laser diode cooling

Bonding structure and bonding method for cemented carbide element and diamond element, cutting tip and cutting element for drilling tool, and drilling tool

Ceramic metal composite and semiconductor device using the same

Silicon nitride substrate, silicon nitride circuit board utilizing the same, and use thereof

Semiconductor device and bonding material

Braze-metal coated articles and process for making same

Multilayered structures and methods thereof

Silicon nitride substrate, a manufacturing method of the silicon nitride substrate, a silicon nitride wiring board using the silicon nitride substrate, and semiconductor module

LOW TEMPERATURE REACTIVE COMPOSITE JOINING

Method for manufacturing a metal-ceramic substrate

Power semiconductor substrates with metal contact layer and method of manufacture thereof

Sintered power semiconductor substrate and method of producing the substrate

cBN sintered body for high surface integrity machining and cBN sintered body cutting tool

Metal-ceramic composite air braze with ceramic particulate

RAPID, REDUCED TEMPERATURE JOINING OF ALUMINA CERAMICS WITH Ni/Nb/Ni INTERLAYERS

TRANSIENT-LIQUID-PHASE JOINING OF CERAMICS AT LOW TEMPERATURES

Method of Bonding Metals to Ceramics

HIGH VELOCITY METALLIC POWDER SPRAY FASTENING

Bonding structure and bonding method for cemented carbide element and diamond element, cutting tip and cutting element for drilling tool, and drilling tool

Ceramic multilayer substrate and method for manufacturing the same

Process for producing a composite body

Method and materials for bonding electrodes to interconnect layers in solid oxide fuel cell stacks

Method of manufacturing a metal-ceramic circuit board

Aluminum nitride conjugate body and method of producing the same

Structures of brittle materials and metals

Oxide sintered body, sputtering target, transparent conductive thin film and manufacturing method therefor

Method of manufacturing a metal-ceramic circuit board

Bonding methods for microchannel plates

Transient eutectic phase process for ceramic-metal bonding metallization and compositing

Semiconductor device structural body and electronic device

Method of bonding and resulting product