90048 ⎘
Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating; Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating; Metallic interlayers based on noble metals, e.g. silver
METAL-CERAMIC SUBSTRATE WITH CONTACT AREA
#2Multi-Surface Airtight Packaging Ceramic Shell, Multi-Surface Packaging Device and Preparation Method
#3METAL-CERAMIC SUBSTRATE HAVING DOUBLE BRAZING LAYERS AND METHOD FOR MANUFACTURING THE SAME
#4COMPOSITE SUBSTRATE AND METHOD FOR MANUFACTURING SAME
#5Coil component and method for manufacturing coil component
#6CUTTING TOOL
#7Ceramic package for quantum computing and method for preparation
#8HIGH TEMPERATURE BRAZING OF METALS AND CERAMICS TO CARBON SUBSTRATES
#9PREPARATION METHOD FOR COPPER PLATE-COVERED SILICON NITRIDE CERAMIC SUBSTRATE
#10CERAMIC SUBSTRATE, CERAMIC DIVIDED SUBSTRATE, AND METHOD FOR MANUFACTURING CERAMIC SUBSTRATE
#11High optical power light conversion device using a phosphor element with solder attachment
#12Bonded assembly, and ceramic circuit substrate and semiconductor device using the same
#13COMPLIANT SUTURE-BASED JOINERY
#14BRAZING MATERIAL, BONDED BODY, CERAMIC CIRCUIT BOARD, AND METHOD FOR MANUFACTURING BONDED BODY
#15Ceramic-copper composite, ceramic circuit board, power module, and method of producing ceramic-copper composite
#16High optical power light conversion device using a phosphor element with solder attachment
#17Ceramic-copper composite, method of producing ceramic-copper composite, ceramic circuit board, and power module
#18Coil component and method for manufacturing coil component
#19Piezoelectric element with lithium manganate-containing ceramic layers and silver-containing internal electrodes
#20Method for manufacturing active metal-brazed nitride ceramic substrate with excellent joining strength
#21Cover lid with selective and edge metallization and methods of making
#22Manufacturing method for a member for a semiconductor manufacturing device and member for a semiconductor manufacturing device
#23Ceramic circuit board and module using same
#24Ceramic circuit board and method for producing same
#25High optical power light conversion device using a phosphor element with solder attachment
#26Method for manufacturing ceramic circuit board
#27Ceramic circuit board, method for manufacturing ceramic circuit board, and module using ceramic circuit board
#28Method for producing a gas-tight metal-ceramic join and use of the gas-tight metal-ceramic join
#29Method of manufacturing a singulated feedthrough insulator for a hermetic seal of an active implantable medical device incorporating a post conductive paste filled pressing step
#30Light-emitting ceramic and light-emitting device
#31Brazed joint and semiconductor processing chamber component having the same
#32HYDROPHOBIC MATERIALS INCORPORATING RARE EARTH ELEMENTS AND METHODS OF MANUFACTURE
#33Ceramic circuit substrate and method for producing ceramic circuit substrate
#34Copper-ceramic bonded body and insulation circuit substrate
#35Ceramic-metal structure
#36Power module with capacitor configured for improved thermal management
#37CONTAINER AND METHOD FOR CLOSING AN OPENING OF CONTAINER
#38Silica glass member, process for producing the same, and process for bonding ceramic and silica glass
#39COMPOSITION AND METHOD OF PRODUCING BONDED BODY
#40Metal-ceramic base material, metal-ceramic joint structure, method for producing metal-ceramic joint structure, and mixed powder material
#41Ceramic member
#42Producing metal/ceramic circuit board by removing residual silver
#43Synthetic quartz glass lid precursor, synthetic quartz glass lid, and preparation methods thereof
#44Method for producing a composite material
#45Ceramic metal circuit board and semiconductor device using the same
#46Gold wetting on ceramic surfaces upon coating with titanium hydride
#47Ceramic milling cutter
#48Method of Joining Metal-Ceramic Substrates to Metal Bodies
#49High thermal conductive silicon nitride sintered body, and silicon nitride substrate and silicon nitride circuit board and semiconductor apparatus using the same
#50Bonding scheme for diamond components which has low thermal barrier resistance in high power density applications
#51Bonded substrate and method for manufacturing bonded substrate
#52Cover lid with selective and edge metallization
#53PRODUCING METHOD OF POWER-MODULE SUBSTRATE
#54Directly integrated feedthrough to implantable medical device housing
#55Ceramic circuit board and method for producing same
#56Method for joining dissimilar engine components
#57Metal-on-ceramic substrates
#58Cubic boron nitride sintered body cutting tool
#59High optical power light conversion device using a phosphor element with solder attachment
#60Joined body including ceramic member and metallic member and method for manufacturing joined body
#61Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding paste
#62Active metal braze joint with stress relieving layer
#63Cutting insert, cutting tool comprising such an insert and methods for producing and repairing such a tool
#64Ceramic circuit board
#65Ceramic wavelength converter having a high reflectivity reflector
#66Thermally stable polycrystalline diamond with enhanced attachment joint
#673D infiltration method
#68Ceramic member and joint structure of metal members
#69Converter-cooling element assembly with metallic solder connection
#70Method for joining dissimilar engine components
#71Cu/ceramic bonded body, method for manufacturing Cu/ceramic bonded body, and power module substrate
#72Optical component
#73Method for producing ceramic circuit board
#74Gas turbine engine CMC airfoil assembly
#75Method of manufacturing a ceramic metallization for ceramic metal transition
#76Ceramic circuit board and electronic device
#77Apparatus and method for producing (metal plate)-(ceramic board) laminated assembly, and apparatus and method for producing power-module substrate
#78Method for manufacturing power module substrate
#79Sample holder
#80Manufacturing method of power-module substrate
#81Metal/ceramic bonding substrate and method for producing same
#82Voltage nonlinear resistive element and method for manufacturing the same
#83Voltage nonlinear resistive element and method for manufacturing the same
#84Semiconductor circuit board, semiconductor device using the same, and method for manufacturing semiconductor circuit board
#85Semiconductor device and ceramic circuit substrate, and producing method of semiconductor device
#86Ceramic circuit substrate and its production method
#87Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding paste
#88METHOD FOR ASSEMBLING, BY BRAZING, A SUBSTRATE COMPRISING PYROCARBON WITH PARTS COMPRISING PYROCARBON
#89Direct integration of feedthrough to implantable medical device housing by sintering
#90Cutting tool made of cubic boron nitride-based sintered material
#91Ceramic circuit board and electronic device
#92Power module substrate, power module substrate with heat sink, and power module
#93Bonded body and semiconductor module
#94Cutting tool made of cubic boron nitride-based sintered material
#95Ceramic/copper circuit board and semiconductor device
#96Joint material, and jointed body
#97Metal-ceramic joined body
#98Silicon nitride substrate and method for producing silicon nitride substrate
#99Power module substrate, power module substrate with heat sink, power module, and method of manufacturing power module substrate
#100Seal between metal and ceramic conduits
#101Brazing material, brazing material paste, ceramic circuit substrate, ceramic master circuit substrate, and power semiconductor module
#102Shock absorbing member
#103Active braze techniques on beta-alumina
#104Infiltration compositions for PCD by using coated carbide substrates
#105Active metal brazing material
#106Substrate for power module, substrate with heat sink for power module, power module, method for producing substrate for power module, and method for producing substrate with heat sink for power module
#107Hydrophobic Materials Incorporating Rare Earth Elements and Methods of Manufacture
#108Boron carbide-containing ceramic bonded body and method for producing the bonded body
#109Method for Selective Metallization on a Ceramic Substrate
#110BRAZED COATED DIAMOND-CONTAINING MATERIALS
#111MULTILAYER CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
#112Method for assembling parts made of SiC materials by non-reactive brazing, brazing compositions, and joint and assembly obtained by said method
#113Method of joining metal-ceramic substrates to metal bodies
#114Silicon nitride substrate, circuit substrate and electronic device using the same
#115Ceramic sheet product for ceramic electronic component, multilayer ceramic electronic component using the same and method of manufacturing multilayer ceramic electronic component
#116Method of manufacturing power module substrate and power module substrate
#117Multilayered structures and methods of making multilayered structures
#118CONSTRAINED METAL FLANGES AND METHODS FOR MAKING THE SAME
#119Ceramic circuit board and process for producing same
#120Ceramic/metal composite structure
#121Metal-Ceramic Substrate
#122Y-Doped Barium Strontium Titanate For Stoichiometric Thin Film Growth
#123Aluminum nitride substrate, aluminum nitride circuit board, semiconductor apparatus, and method for manufacturing aluminum nitride substrate
#124METHOD FOR PRODUCING A CONNECTION OF GRAPHITE AND CARRIER METAL AND COMPOSITION ELEMENT
#125Coated ceramic part
#126Flush joint
#127Joining device
#128Compliant material
#129Low loss visible-IR transmitting glass-aluminum oxynitride composites and process
#130Methods of making multilayered structures
#131Liquid barrier and method for making a liquid barrier
#132NON-SHRINKING CERAMIC SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
#133Hermetic sealing assembly and electrical device including the same
#134Diamond bonded construction with improved braze joint
#135Multilayer ceramic board and manufacturing method thereof
#136Sealed flexible link between a metal substrate and a ceramic substrate, method for making such a link, application of the method to sealing high temperature electrolyzers and fuel cells
#137MULTILAYER THERMAL PROTECTION SYSTEM AND METHOD FOR MAKING SAME
#138Ceramic discharge lamp including first and second layer of brazing material and method of manufacturing ceramic discharge lamp
#139Diffusion barriers in modified air brazes
#140Superconducting connection between MgB2 superconducting wires via a compressed element made from HTS powder
#141Method for joining SiC-diamond
#142Conductive Coatings, Sealing Materials and Devices Utilizing Such Materials and Method of Making
#143METHOD FOR PRODUCING A METALIZED COMPONENT, CORRESPONDING COMPONENT, AND A SUBSTRATE FOR SUPPORTING THE COMPONENT DURING METALIZATION
#144Process of making low loss visible-IR transmitting glass-ceramic spinel composites
#145COMPONENT HAVING A CERAMIC BASE THE SURFACE OF WHICH IS METALIZED
#146Ceramic junction member, ceramic heater and gas sensor
#147NON-SHRINKING CERAMIC SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
#148Component having a ceramic base with a metalized surface
#149MODULE INCLUDING A STABLE SOLDER JOINT
#150Electronic Component Union, Electronic Circuit Module Utilizing the Same, and Process for Manufacturing the Same
#151Bonded metal and ceramic plates for thermal management of optical and electronic devices
#152Microheat exchanger for laser diode cooling
#153Ceramic metal composite and semiconductor device using the same
#154Silicon nitride substrate, silicon nitride circuit board utilizing the same, and use thereof
#155Semiconductor device and bonding material
#156Braze alloy containing particulate material
#157Composite structure for microlithography and optical arrangement
#158Method for bonding refractory ceramic and metal
#159Brazed joint between a titanium-based metal part and a ceramic part based on silicon carbide (SIC) and/or carbon
#160Multilayered structures and methods thereof
#161Oriented fiber ceramic matrix composite abradable thermal barrier coating
#162Silicon nitride substrate, a manufacturing method of the silicon nitride substrate, a silicon nitride wiring board using the silicon nitride substrate, and semiconductor module
#163Power semiconductor substrates with metal contact layer and method of manufacture thereof
#164Composite ceramic body, method of manufacturing the same and ceramic filter assembly
#165Diffusion barriers in modified air brazes
#166Joint between a metal part and a ceramic part based SiC and/or C
#167Sintered power semiconductor substrate and method of producing the substrate
#168cBN sintered body for high surface integrity machining, cBN sintered body cutting tool, and cutting method using the same
#169METHOD OF MANUFACTURING HEAT SPREADER MODULE
#170Sealed joint structure for electrochemical device
#171cBN sintered body for high surface integrity machining and cBN sintered body cutting tool
#172LOW LOSS GLASS-CERAMIC MATERIALS, METHOD OF MAKING SAME AND ELECTRONIC PACKAGES INCLUDING SAME
#173Different materials bonded member and production method thereof
#174Metal-ceramic composite air braze with ceramic particulate
#175Method of bonding solid materials
#176CERAMIC ARMOR, METHODS OF JOINING A CARBIDE WITH A METAL-COMPRISING PIECE, AND METHODS OF METALLIZING CARBIDE-COMPRISING SURFACES
#177Braze System With Matched Coefficients Of Thermal Expansion
#178TRANSIENT-LIQUID-PHASE JOINING OF CERAMICS AT LOW TEMPERATURES
#179Method of joining members having different thermal expansion coefficients
#180Electronic component and its manufacturing method
#181HIGH VELOCITY METALLIC POWDER SPRAY FASTENING
#182Process for producing a composite body
#183Method and materials for bonding electrodes to interconnect layers in solid oxide fuel cell stacks
#184Braze alloy containing particulate material
#185Low loss visible-IR transmitting glass-ceramic spinel composites and process
#186Low loss visible-IR transmitting glass-aluminum oxynitride composites and process
#187Part for active silver brazing and active silver brazing product using the part
#188Method of manufacturing a metal-ceramic circuit board
#189Active binder for brazing, part for brazing employing the binder, brazed product obtained with the binder, and silver brazing material
#190Alumina member and manufacturing method thereof
#191Aluminum nitride conjugate body and method of producing the same
#192Metal-ceramic materials
#193Low melting temperature silver braze alloy
#194Braze alloy containing particulate material
#195Low loss glass-ceramic materials, method of making same and electronic packages including same
#196Glass-ceramic materials and electronic packages including same
#197Laminated radiation member, power semiconductor apparatus, and method for producing the same
#198Composite body made of ceramic layers and method for its manufacture
#199Method of manufacturing a metal-ceramic circuit board
#200Bonding methods for microchannel plates
#201Semiconductor device structural body and electronic device
#202Nanodiamond PCD and methods of forming