ClassID:

90048

C04B2237/125 - CPC Classification

Classification description:

Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating; Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating; Metallic interlayers based on noble metals, e.g. silver

Recent Application in this class:
#1
20260022076
2026-01-22

METAL-CERAMIC SUBSTRATE WITH CONTACT AREA

#2
20250316497
2025-10-09

Multi-Surface Airtight Packaging Ceramic Shell, Multi-Surface Packaging Device and Preparation Method

#3
20250162951
2025-05-22

METAL-CERAMIC SUBSTRATE HAVING DOUBLE BRAZING LAYERS AND METHOD FOR MANUFACTURING THE SAME

#4
20250034051
2025-01-30

COMPOSITE SUBSTRATE AND METHOD FOR MANUFACTURING SAME

#5
20240327307
2024-10-03

Coil component and method for manufacturing coil component

#6
20240307960
2024-09-19

CUTTING TOOL

#7
20240300219
2024-09-12

Ceramic package for quantum computing and method for preparation

#8
20240140881
2024-05-02

HIGH TEMPERATURE BRAZING OF METALS AND CERAMICS TO CARBON SUBSTRATES

#9
20240067577
2024-02-29

PREPARATION METHOD FOR COPPER PLATE-COVERED SILICON NITRIDE CERAMIC SUBSTRATE

#10
20230354514
2023-11-02

CERAMIC SUBSTRATE, CERAMIC DIVIDED SUBSTRATE, AND METHOD FOR MANUFACTURING CERAMIC SUBSTRATE

#11
20230261123
2023-08-17

High optical power light conversion device using a phosphor element with solder attachment

#12
20230202137
2023-06-29

Bonded assembly, and ceramic circuit substrate and semiconductor device using the same

#13
20230037628
2023-02-09

COMPLIANT SUTURE-BASED JOINERY

#14
20220288726
2022-09-15

BRAZING MATERIAL, BONDED BODY, CERAMIC CIRCUIT BOARD, AND METHOD FOR MANUFACTURING BONDED BODY

#15
20220225498
2022-07-14

Ceramic-copper composite, ceramic circuit board, power module, and method of producing ceramic-copper composite

#16
20220140158
2022-05-05

High optical power light conversion device using a phosphor element with solder attachment

#17
20220009842
2022-01-13

Ceramic-copper composite, method of producing ceramic-copper composite, ceramic circuit board, and power module

#18
20210323881
2021-10-21

Coil component and method for manufacturing coil component

#19
20210305490
2021-09-30

Piezoelectric element with lithium manganate-containing ceramic layers and silver-containing internal electrodes

#20
20210269368
2021-09-02

Method for manufacturing active metal-brazed nitride ceramic substrate with excellent joining strength

#21
20210257270
2021-08-19

Cover lid with selective and edge metallization and methods of making

#22
20210253486
2021-08-19

Manufacturing method for a member for a semiconductor manufacturing device and member for a semiconductor manufacturing device

#23
20210176860
2021-06-10

Ceramic circuit board and module using same

#24
20210176859
2021-06-10

Ceramic circuit board and method for producing same

#25
20210013349
2021-01-14

High optical power light conversion device using a phosphor element with solder attachment

#26
20200170118
2020-05-28

Method for manufacturing ceramic circuit board

#27
20200128664
2020-04-23

Ceramic circuit board, method for manufacturing ceramic circuit board, and module using ceramic circuit board

#28
20200122257
2020-04-23

Method for producing a gas-tight metal-ceramic join and use of the gas-tight metal-ceramic join

#29
20200030613
2020-01-30

Method of manufacturing a singulated feedthrough insulator for a hermetic seal of an active implantable medical device incorporating a post conductive paste filled pressing step

#30
20190363507
2019-11-28

Light-emitting ceramic and light-emitting device

#31
20190226512
2019-07-25

Brazed joint and semiconductor processing chamber component having the same

#32
20190177233
2019-06-13

HYDROPHOBIC MATERIALS INCORPORATING RARE EARTH ELEMENTS AND METHODS OF MANUFACTURE

#33
20190150298
2019-05-16

Ceramic circuit substrate and method for producing ceramic circuit substrate

#34
20190135706
2019-05-09

Copper-ceramic bonded body and insulation circuit substrate

#35
20190126373
2019-05-02

Ceramic-metal structure

#36
20190116687
2019-04-18

Power module with capacitor configured for improved thermal management

#37
20190092697
2019-03-28

CONTAINER AND METHOD FOR CLOSING AN OPENING OF CONTAINER

#38
20190074416
2019-03-07

Silica glass member, process for producing the same, and process for bonding ceramic and silica glass

#39
20190047046
2019-02-14

COMPOSITION AND METHOD OF PRODUCING BONDED BODY

#40
20190003059
2019-01-03

Metal-ceramic base material, metal-ceramic joint structure, method for producing metal-ceramic joint structure, and mixed powder material

#41
20180310362
2018-10-25

Ceramic member

#42
20180255645
2018-09-06

Producing metal/ceramic circuit board by removing residual silver

#43
20180215662
2018-08-02

Synthetic quartz glass lid precursor, synthetic quartz glass lid, and preparation methods thereof

#44
20180213639
2018-07-26

Method for producing a composite material

#45
20180190568
2018-07-05

Ceramic metal circuit board and semiconductor device using the same

#46
20180085591
2018-03-29

Gold wetting on ceramic surfaces upon coating with titanium hydride

#47
20180009043
2018-01-11

Ceramic milling cutter

#48
20180002239
2018-01-04

Method of Joining Metal-Ceramic Substrates to Metal Bodies

#49
20180002237
2018-01-04

High thermal conductive silicon nitride sintered body, and silicon nitride substrate and silicon nitride circuit board and semiconductor apparatus using the same

#50
20170330816
2017-11-16

Bonding scheme for diamond components which has low thermal barrier resistance in high power density applications

#51
20170323842
2017-11-09

Bonded substrate and method for manufacturing bonded substrate

#52
20170229361
2017-08-10

Cover lid with selective and edge metallization

#53
20170229320
2017-08-10

PRODUCING METHOD OF POWER-MODULE SUBSTRATE

#54
20170203107
2017-07-20

Directly integrated feedthrough to implantable medical device housing

#55
20170181272
2017-06-22

Ceramic circuit board and method for producing same

#56
20170173729
2017-06-22

Method for joining dissimilar engine components

#57
20170151755
2017-06-01

Metal-on-ceramic substrates

#58
20170101346
2017-04-13

Cubic boron nitride sintered body cutting tool

#59
20170092786
2017-03-30

High optical power light conversion device using a phosphor element with solder attachment

#60
20170036961
2017-02-09

Joined body including ceramic member and metallic member and method for manufacturing joined body

#61
20170034905
2017-02-02

Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding paste

#62
20170014930
2017-01-19

Active metal braze joint with stress relieving layer

#63
20170001267
2017-01-05

Cutting insert, cutting tool comprising such an insert and methods for producing and repairing such a tool

#64
20160358840
2016-12-08

Ceramic circuit board

#65
20160334552
2016-11-17

Ceramic wavelength converter having a high reflectivity reflector

#66
20160312540
2016-10-27

Thermally stable polycrystalline diamond with enhanced attachment joint

#67
20160303762
2016-10-20

3D infiltration method

#68
20160273846
2016-09-22

Ceramic member and joint structure of metal members

#69
20160245494
2016-08-25

Converter-cooling element assembly with metallic solder connection

#70
20160236992
2016-08-18

Method for joining dissimilar engine components

#71
20160221305
2016-08-04

Cu/ceramic bonded body, method for manufacturing Cu/ceramic bonded body, and power module substrate

#72
20160202596
2016-07-14

Optical component

#73
20160192503
2016-06-30

Method for producing ceramic circuit board

#74
20160186583
2016-06-30

Gas turbine engine CMC airfoil assembly

#75
20160184913
2016-06-30

Method of manufacturing a ceramic metallization for ceramic metal transition

#76
20160163617
2016-06-09

Ceramic circuit board and electronic device

#77
20160052830
2016-02-25

Apparatus and method for producing (metal plate)-(ceramic board) laminated assembly, and apparatus and method for producing power-module substrate

#78
20160016245
2016-01-21

Method for manufacturing power module substrate

#79
20160005639
2016-01-07

Sample holder

#80
20160001388
2016-01-07

Manufacturing method of power-module substrate

#81
20150284296
2015-10-08

Metal/ceramic bonding substrate and method for producing same

#82
20150270037
2015-09-24

Voltage nonlinear resistive element and method for manufacturing the same

#83
20150270036
2015-09-24

Voltage nonlinear resistive element and method for manufacturing the same

#84
20150257252
2015-09-10

Semiconductor circuit board, semiconductor device using the same, and method for manufacturing semiconductor circuit board

#85
20150255419
2015-09-10

Semiconductor device and ceramic circuit substrate, and producing method of semiconductor device

#86
20150216056
2015-07-30

Ceramic circuit substrate and its production method

#87
20150208496
2015-07-23

Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding paste

#88
20150165536
2015-06-18

METHOD FOR ASSEMBLING, BY BRAZING, A SUBSTRATE COMPRISING PYROCARBON WITH PARTS COMPRISING PYROCARBON

#89
20150165220
2015-06-18

Direct integration of feedthrough to implantable medical device housing by sintering

#90
20150132076
2015-05-14

Cutting tool made of cubic boron nitride-based sintered material

#91
20150049442
2015-02-19

Ceramic circuit board and electronic device

#92
20150034367
2015-02-05

Power module substrate, power module substrate with heat sink, and power module

#93
20150008573
2015-01-08

Bonded body and semiconductor module

#94
20150003926
2015-01-01

Cutting tool made of cubic boron nitride-based sintered material

#95
20140291699
2014-10-02

Ceramic/copper circuit board and semiconductor device

#96
20140287227
2014-09-25

Joint material, and jointed body

#97
20140272457
2014-09-18

Metal-ceramic joined body

#98
20140220302
2014-08-07

Silicon nitride substrate and method for producing silicon nitride substrate

#99
20140192486
2014-07-10

Power module substrate, power module substrate with heat sink, power module, and method of manufacturing power module substrate

#100
20140138921
2014-05-22

Seal between metal and ceramic conduits

#101
20140126155
2014-05-08

Brazing material, brazing material paste, ceramic circuit substrate, ceramic master circuit substrate, and power semiconductor module

#102
20140123844
2014-05-08

Shock absorbing member

#103
20140110460
2014-04-24

Active braze techniques on beta-alumina

#104
20140059943
2014-03-06

Infiltration compositions for PCD by using coated carbide substrates

#105
20140037492
2014-02-06

Active metal brazing material

#106
20130335921
2013-12-19

Substrate for power module, substrate with heat sink for power module, power module, method for producing substrate for power module, and method for producing substrate with heat sink for power module

#107
20130251942
2013-09-26

Hydrophobic Materials Incorporating Rare Earth Elements and Methods of Manufacture

#108
20130157835
2013-06-20

Boron carbide-containing ceramic bonded body and method for producing the bonded body

#109
20130098867
2013-04-25

Method for Selective Metallization on a Ceramic Substrate

#110
20130022836
2013-01-24

BRAZED COATED DIAMOND-CONTAINING MATERIALS

#111
20130000958
2013-01-03

MULTILAYER CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

#112
20120308839
2012-12-06

Method for assembling parts made of SiC materials by non-reactive brazing, brazing compositions, and joint and assembly obtained by said method

#113
20120305281
2012-12-06

Method of joining metal-ceramic substrates to metal bodies

#114
20120281362
2012-11-08

Silicon nitride substrate, circuit substrate and electronic device using the same

#115
20120268861
2012-10-25

Ceramic sheet product for ceramic electronic component, multilayer ceramic electronic component using the same and method of manufacturing multilayer ceramic electronic component

#116
20120267149
2012-10-25

Method of manufacturing power module substrate and power module substrate

#117
20120231216
2012-09-13

Multilayered structures and methods of making multilayered structures

#118
20120214016
2012-08-23

CONSTRAINED METAL FLANGES AND METHODS FOR MAKING THE SAME

#119
20120168209
2012-07-05

Ceramic circuit board and process for producing same

#120
20120114966
2012-05-10

Ceramic/metal composite structure

#121
20120045657
2012-02-23

Metal-Ceramic Substrate

#122
20120044610
2012-02-23

Y-Doped Barium Strontium Titanate For Stoichiometric Thin Film Growth

#123
20120038038
2012-02-16

Aluminum nitride substrate, aluminum nitride circuit board, semiconductor apparatus, and method for manufacturing aluminum nitride substrate

#124
20120034473
2012-02-09

METHOD FOR PRODUCING A CONNECTION OF GRAPHITE AND CARRIER METAL AND COMPOSITION ELEMENT

#125
20120003128
2012-01-05

Coated ceramic part

#126
20120001422
2012-01-05

Flush joint

#127
20120001421
2012-01-05

Joining device

#128
20120001417
2012-01-05

Compliant material

#129
20110281122
2011-11-17

Low loss visible-IR transmitting glass-aluminum oxynitride composites and process

#130
20110223321
2011-09-15

Methods of making multilayered structures

#131
20110206912
2011-08-25

Liquid barrier and method for making a liquid barrier

#132
20110091640
2011-04-21

NON-SHRINKING CERAMIC SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

#133
20100327537
2010-12-30

Hermetic sealing assembly and electrical device including the same

#134
20100300767
2010-12-02

Diamond bonded construction with improved braze joint

#135
20100300733
2010-12-02

Multilayer ceramic board and manufacturing method thereof

#136
20100266931
2010-10-21

Sealed flexible link between a metal substrate and a ceramic substrate, method for making such a link, application of the method to sealing high temperature electrolyzers and fuel cells

#137
20100247953
2010-09-30

MULTILAYER THERMAL PROTECTION SYSTEM AND METHOD FOR MAKING SAME

#138
20100231129
2010-09-16

Ceramic discharge lamp including first and second layer of brazing material and method of manufacturing ceramic discharge lamp

#139
20100218875
2010-09-02

Diffusion barriers in modified air brazes

#140
20100216645
2010-08-26

Superconducting connection between MgB2 superconducting wires via a compressed element made from HTS powder

#141
20100203341
2010-08-12

Method for joining SiC-diamond

#142
20100140330
2010-06-10

Conductive Coatings, Sealing Materials and Devices Utilizing Such Materials and Method of Making

#143
20100132932
2010-06-03

METHOD FOR PRODUCING A METALIZED COMPONENT, CORRESPONDING COMPONENT, AND A SUBSTRATE FOR SUPPORTING THE COMPONENT DURING METALIZATION

#144
20100126219
2010-05-27

Process of making low loss visible-IR transmitting glass-ceramic spinel composites

#145
20100112372
2010-05-06

COMPONENT HAVING A CERAMIC BASE THE SURFACE OF WHICH IS METALIZED

#146
20100101950
2010-04-29

Ceramic junction member, ceramic heater and gas sensor

#147
20100098905
2010-04-22

NON-SHRINKING CERAMIC SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

#148
20100089625
2010-04-15

Component having a ceramic base with a metalized surface

#149
20100068552
2010-03-18

MODULE INCLUDING A STABLE SOLDER JOINT

#150
20100047588
2010-02-25

Electronic Component Union, Electronic Circuit Module Utilizing the Same, and Process for Manufacturing the Same

#151
20100035024
2010-02-11

Bonded metal and ceramic plates for thermal management of optical and electronic devices

#152
20100032143
2010-02-11

Microheat exchanger for laser diode cooling

#153
20090283309
2009-11-19

Ceramic metal composite and semiconductor device using the same

#154
20090283307
2009-11-19

Silicon nitride substrate, silicon nitride circuit board utilizing the same, and use thereof

#155
20090244868
2009-10-01

Semiconductor device and bonding material

#156
20090220813
2009-09-03

Braze alloy containing particulate material

#157
20090142615
2009-06-04

Composite structure for microlithography and optical arrangement

#158
20090142608
2009-06-04

Method for bonding refractory ceramic and metal

#159
20090068004
2009-03-12

Brazed joint between a titanium-based metal part and a ceramic part based on silicon carbide (SIC) and/or carbon

#160
20090061252
2009-03-05

Multilayered structures and methods thereof

#161
20090060747
2009-03-05

Oriented fiber ceramic matrix composite abradable thermal barrier coating

#162
20090039477
2009-02-12

Silicon nitride substrate, a manufacturing method of the silicon nitride substrate, a silicon nitride wiring board using the silicon nitride substrate, and semiconductor module

#163
20090008784
2009-01-08

Power semiconductor substrates with metal contact layer and method of manufacture thereof

#164
20090007532
2009-01-08

Composite ceramic body, method of manufacturing the same and ceramic filter assembly

#165
20080305356
2008-12-11

Diffusion barriers in modified air brazes

#166
20080304959
2008-12-11

Joint between a metal part and a ceramic part based SiC and/or C

#167
20080292874
2008-11-27

Sintered power semiconductor substrate and method of producing the substrate

#168
20080286558
2008-11-20

cBN sintered body for high surface integrity machining, cBN sintered body cutting tool, and cutting method using the same

#169
20080272180
2008-11-06

METHOD OF MANUFACTURING HEAT SPREADER MODULE

#170
20080268323
2008-10-30

Sealed joint structure for electrochemical device

#171
20080254282
2008-10-16

cBN sintered body for high surface integrity machining and cBN sintered body cutting tool

#172
20080245467
2008-10-09

LOW LOSS GLASS-CERAMIC MATERIALS, METHOD OF MAKING SAME AND ELECTRONIC PACKAGES INCLUDING SAME

#173
20080230585
2008-09-25

Different materials bonded member and production method thereof

#174
20080217382
2008-09-11

Metal-ceramic composite air braze with ceramic particulate

#175
20080213612
2008-09-04

Method of bonding solid materials

#176
20080131724
2008-06-05

CERAMIC ARMOR, METHODS OF JOINING A CARBIDE WITH A METAL-COMPRISING PIECE, AND METHODS OF METALLIZING CARBIDE-COMPRISING SURFACES

#177
20080131723
2008-06-05

Braze System With Matched Coefficients Of Thermal Expansion

#178
20080035707
2008-02-14

TRANSIENT-LIQUID-PHASE JOINING OF CERAMICS AT LOW TEMPERATURES

#179
20080017695
2008-01-24

Method of joining members having different thermal expansion coefficients

#180
20070221399
2007-09-27

Electronic component and its manufacturing method

#181
20070194085
2007-08-23

HIGH VELOCITY METALLIC POWDER SPRAY FASTENING

#182
20070119907
2007-05-31

Process for producing a composite body

#183
20070111069
2007-05-17

Method and materials for bonding electrodes to interconnect layers in solid oxide fuel cell stacks

#184
20070089563
2007-04-26

Braze alloy containing particulate material

#185
20070087204
2007-04-19

Low loss visible-IR transmitting glass-ceramic spinel composites and process

#186
20070087203
2007-04-19

Low loss visible-IR transmitting glass-aluminum oxynitride composites and process

#187
20060243776
2006-11-02

Part for active silver brazing and active silver brazing product using the part

#188
20060242826
2006-11-02

Method of manufacturing a metal-ceramic circuit board

#189
20060219756
2006-10-05

Active binder for brazing, part for brazing employing the binder, brazed product obtained with the binder, and silver brazing material

#190
20060169688
2006-08-03

Alumina member and manufacturing method thereof

#191
20060156528
2006-07-20

Aluminum nitride conjugate body and method of producing the same

#192
20060141237
2006-06-29

Metal-ceramic materials

#193
20060045791
2006-03-02

Low melting temperature silver braze alloy

#194
20060014055
2006-01-19

Braze alloy containing particulate material

#195
20050266252
2005-12-01

Low loss glass-ceramic materials, method of making same and electronic packages including same

#196
20050266251
2005-12-01

Glass-ceramic materials and electronic packages including same

#197
20050263877
2005-12-01

Laminated radiation member, power semiconductor apparatus, and method for producing the same

#198
20050175853
2005-08-11

Composite body made of ceramic layers and method for its manufacture

#199
20050138799
2005-06-30

Method of manufacturing a metal-ceramic circuit board

#200
20050098614
2005-05-12

Bonding methods for microchannel plates

#201
20050029666
2005-02-10

Semiconductor device structural body and electronic device

#202
20050019114
2005-01-27

Nanodiamond PCD and methods of forming