ALUMINUM/CERAMIC BONDING SUBSTRATE AND METHOD FOR PRODUCING SAME

COMPOSITE SUBSTRATE AND METHOD FOR MANUFACTURING SAME

HEAT DISSIPATING LAMINATE

SUSCEPTOR AND METHOD OF MANUFACTURING THE SAME

ELECTROSTATIC CHUCK AND METHOD OF MANUFACTURING THE SAME

CERAMIC SUBSTRATE, CERAMIC DIVIDED SUBSTRATE, AND METHOD FOR MANUFACTURING CERAMIC SUBSTRATE

Joined body, holding device, and electrostatic chuck

High optical power light conversion device using a phosphor element with solder attachment

Method for producing a metal-ceramic substrate with electrically conductive vias

SUBSTRATE STRUCTURES AND METHODS OF MANUFACTURE

SUBSTRATE STRUCTURES AND METHODS OF MANUFACTURE

COATING COMPOSITIONS

High optical power light conversion device using a phosphor element with solder attachment

Method for fabricating perfectly wetting surfaces

Aluminum/ceramic bonding substrate and method for producing same

Metal/ceramic bonding substrate and method for producing same

Termination feedthrough unit with ceramic insulator for vacuum and corrosive applications

Ceramic sintered body and substrate for semiconductor device

Metal-ceramic substrate and method for producing a metal-ceramic substrate

Method for producing insulating circuit substrate with heat sink

High optical power light conversion device using a phosphor element with solder attachment

Method for producing a metal-ceramic substrate with at least one via

Composite green sheet and ceramic member

METHOD FOR PRODUCING CERAMIC-ALUMINUM BONDED BODY, METHOD FOR PRODUCING POWER MODULE SUBSTRATE, CERAMIC-ALUMINUM BONDED BODY, AND POWER MODULE SUBSTRATE

Methods of three-dimensional electrophoretic deposition for ceramic and cermet applications and systems thereof

Methods of three-dimensional electrophoretic deposition for ceramic and cermet applications and systems thereof

Bond protection around porous plugs

Termination feedthrough unit with ceramic insulator suitable for vacuum and corrosive applications

Manufacturing method of sample table

Method for producing a composite material

Ceramic metal circuit board and semiconductor device using the same

Substrate structures and methods of manufacture

Method for producing a metal-ceramic substrate

Bonded body, substrate for power module with heat sink, heat sink, method for producing bonded body, method for producing substrate for power module with heat sink, and method for producing heat sink

Method for manufacturing substrate for power module with heat sink

Minimizing tin loss during thermal processing of kesterite films

Method for creating ceramic-containing transaction cards

Method for producing a metal-ceramic substrate with at least one via

Bonded body, substrate for power module with heat sink, heat sink, method for producing bonded body, method for producing substrate for power module with heat sink, and method for producing heat sink

Method of Joining Metal-Ceramic Substrates to Metal Bodies

Method for creating ceramic-containing transaction cards

Joined body and method for producing joined body

PRODUCING METHOD OF POWER-MODULE SUBSTRATE

Ceramic tile fan blade containment

Method for joining dissimilar engine components

Substrate structures and methods of manufacture

Metal-on-ceramic substrates

Joined body manufacturing method, multilayer joined body manufacturing method, power-module substrate manufacturing method, heat sink equipped power-module substrate manufacturing method, and laminated body manufacturing device

Method for producing ceramic-aluminum bonded body, method for producing power module substrate, ceramic-aluminum bonded body, and power module substrate

Target material for sputtering and method for manufacturing same

MANUFACTURING METHOD FOR THREE-DIMENSIONAL FORMED OBJECT AND MANUFACTURING APPARATUS FOR THREE-DIMENSIONAL FORMED OBJECT

High optical power light conversion device using a phosphor element with solder attachment

Bonded body, power module substrate, power module and method for producing bonded body

Nanoparticle-reinforced composites and methods of manufacture and use

Power-module substrate unit and power module

Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding paste

METHOD FOR SINTERING WORKPIECES TO BE SINTERED, AND SYSTEM FOR THIS PURPOSE

Methods of three-dimensional electrophoretic deposition for ceramic and cermet applications and systems thereof

Methods of three-dimensional electrophoretic deposition for ceramic and cermet applications and systems thereof

Substrate structures and methods of manufacture

Method for producing a metal-ceramic substrate

3D infiltration method

Power module substrate, power module substrate with metal part, power module with metal part, method for producing power module substrate, and method for producing power module substrate with metal part

Wafer holder and method for manufacturing the same

Method of producing bonded body and method of producing power module substrate

Li-containing oxide target assembly

Apparatus and method for producing (metal plate)-(ceramic board) laminated assembly, and apparatus and method for producing power-module substrate

Method for manufacturing power module substrate

Sample holder

Manufacturing method of power-module substrate

Power-module substrate and manufacturing method thereof

Manufacturing method of power-module substrate

Semiconductor device and ceramic circuit substrate, and producing method of semiconductor device

Metal-ceramic substrate and method for producing a metal-ceramic substrate

Ceramic circuit substrate and its production method

Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding paste

Production method of electroconductive mayenite compound having high electron density, and target

Apparatus and method for materials processing utilizing a rotating magnetic field

Electrostatic chuck and showerhead with enhanced thermal properties and methods of making thereof

Power module substrate with heat sink, and method for producing power module substrate with heat sink

Power module substrate, power module substrate with heatsink, power module, and method for producing power module substrate

Manufacturing method of radiator-integrated substrate and radiator-integrated substrate

Cooling plate, method for manufacturing the same, and member for semiconductor manufacturing apparatus

Soldering method and method of manufacturing semiconductor device

Sealing assembly, method for preparing sealing assembly, and battery comprising the sealing assembly

Metal-ceramic substrate

Dense composite material, method for manufacturing the same, joined body, and member for semiconductor manufacturing apparatuses

Ceramic matrix composite repair by reactive processing and mechanical interlocking

Method for making gas turbine engine composite structure

Power module substrate, power module substrate with heat sink, power module, and method of manufacturing power module substrate

Substrate for power module, substrate with heat sink for power module, power module, method for producing substrate for power module, and method for producing substrate with heat sink for power module

Ceramic substrate, method of manufacturing ceramic substrate, and method of manufacturing power module substrate

Vitroceramic glass compositions for gaskets of apparatuses operating at high temperatures and assembling method using said compositions

Method for Selective Metallization on a Ceramic Substrate

Method for producing substrate for power module with heat sink, substrate for power module with heat sink, and power module

Method for producing a layered material

Method of joining metal-ceramic substrates to metal bodies

Elastomer Bonded Item and Method for Debonding

Method of manufacturing power module substrate and power module substrate

Transparent laminate structures

CONSTRAINED METAL FLANGES AND METHODS FOR MAKING THE SAME

Double-sided substrate, semiconductor device and method for the same

Method for metallizing ceramic surface and method for connecting ceramic with aluminum

Metal-ceramic substrate and method for manufacturing such a substrate

Electrostatic chuck and showerhead with enhanced thermal properties and methods of making thereof

SINTERED CERAMIC AND SUBSTRATE COMPRISING SAME FOR SEMICONDUCTOR DEVICE

Self-supporting CVD diamond film and method for producing a self-supporting CVD diamond film

METHOD FOR PRODUCING A CONNECTION OF GRAPHITE AND CARRIER METAL AND COMPOSITION ELEMENT

Ceramic-metal bonded body and method of producing the same

Ceramic metallic interlocked components and methods of making and using the same

Composite Material, Method for Producing a Composite Material and Adhesive or Binding Material

Methods of three-dimensional electrophoretic deposition for ceramic and cermet applications and systems thereof

Methods of making and using ceramic metallic interlocked components

Power module substrate, power module, and method for manufacturing power module substrate

Power module substrate, power module, and method for manufacturing power module substrate

Double transition joint for the joining of ceramics to metals

INSULATING SUBSTRATE AND METHOD FOR PRODUCING THE SAME

CERAMIC SUBSTRATE, METHOD OF MANUFACTURING CERAMIC SUBSTRATE, AND METHOD OF MANUFACTURING POWER MODULE SUBSTRATE

Al/AlN joint material, base plate for power module, power module, and manufacturing method of Al/AlN joint material

Power module package having excellent heat sink emission capability and method for manufacturing the same

METHOD FOR PRODUCING A METALIZED COMPONENT, CORRESPONDING COMPONENT, AND A SUBSTRATE FOR SUPPORTING THE COMPONENT DURING METALIZATION

METHOD FOR CONTROLLING AND LIMITING ADHESIVE MIGRATION USING ANTI WETTING AGENT

MODULE INCLUDING A STABLE SOLDER JOINT

POWER MODULE PACKAGE HAVING EXCELLENT HEAT SINK EMISSION CAPABILITY AND METHOD FOR MANUFACTURING THE SAME

Silicon nitride substrate, silicon nitride circuit board utilizing the same, and use thereof

Skidproof sports mat

Power semiconductor module

Silicon nitride substrate, a manufacturing method of the silicon nitride substrate, a silicon nitride wiring board using the silicon nitride substrate, and semiconductor module

LOW TEMPERATURE REACTIVE COMPOSITE JOINING

AI/AIN JOINT MATERIAL, BASE PLATE FOR POWER MODULE, POWER MODULE, AND MANUFACTURING METHOD OF AI/AIN JOINT MATERIAL

CERAMIC ARMOR, METHODS OF JOINING A CARBIDE WITH A METAL-COMPRISING PIECE, AND METHODS OF METALLIZING CARBIDE-COMPRISING SURFACES

Method of joining members having different thermal expansion coefficients

Al/AlN joint material, base plate for power module, power module, and manufacturing method of Al/AlN joint material

Diamond Bonding

Joining of advanced materials by plastic deformation

Ceramic circuit board, method for making the same, and power module

Aluminum/ceramic bonding substrate and method for producing same

Apparatus, mold, and method for manufacturing metal-ceramic composite member

Method of manufacturing a metal-ceramic circuit board

Power module package having excellent heat sink emission capability and method for manufacturing the same

Aluminum/ceramic bonding substrate

Molded element that consists of brittle-fracture material

Method of manufacturing a metal-ceramic circuit board

Method of fabricating substrate placing stage

Module structure and module comprising it

Composite material, wafer holding member and method for manufacturing the same

Aluminum/ceramic bonding substrate and method for producing same

Production of oriented material or composite material through centrifugal burning

Method of bonding and resulting product