ClassID:

90077

C04B2237/408 - CPC Classification

Classification description:

Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating; Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates; Metallic Noble metals, e.g. palladium, platina or silver

Recent Application in this class:
#1
20240279127
2024-08-22

Embedding sensors in 3D-printed silicon carbide

#2
20230311451
2023-10-05

Joined body, holding device, and electrostatic chuck

#3
20220316281
2022-10-06

ELECTRICALLY CONDUCTIVE CERAMIC CONDUCTOR FOR DOWNHOLE APPLICATIONS

#4
20210257270
2021-08-19

Cover lid with selective and edge metallization and methods of making

#5
20210257135
2021-08-19

NTC compound, thermistor and method for producing the thermistor

#6
20210230076
2021-07-29

Embedding sensors in 3D-printed silicon carbide

#7
20190214168
2019-07-11

Multilayer component and process for producing a multilayer component

#8
20190031571
2019-01-31

Brazeable Zirconia Ceramics, Methods Of Brazing Zirconia Ceramics, And Brazed Zirconia Ceramics

#9
20180272137
2018-09-27

Flexible hermetic membranes with electrically conducting vias

#10
20180093927
2018-04-05

Method for producing a metal-ceramic substrate

#11
20180052211
2018-02-22

Customized magnetic susceptibility materials

#12
20170372820
2017-12-28

Multilayer component and process for producing a multilayer component

#13
20170251524
2017-08-31

Ceramic structure, method for manufacturing the same, and member for semiconductor manufacturing apparatus

#14
20170229361
2017-08-10

Cover lid with selective and edge metallization

#15
20170151755
2017-06-01

Metal-on-ceramic substrates

#16
20170036961
2017-02-09

Joined body including ceramic member and metallic member and method for manufacturing joined body

#17
20160369813
2016-12-22

Pump housing of two different sinterable materials

#18
20160334552
2016-11-17

Ceramic wavelength converter having a high reflectivity reflector

#19
20150241527
2015-08-27

Customized magnetic susceptibility materials

#20
20150008573
2015-01-08

Bonded body and semiconductor module

#21
20140290852
2014-10-02

Method for producing bonded body

#22
20130171464
2013-07-04

Composite insulating layer and manufacturing method thereof

#23
20130004791
2013-01-03

Method for producing a layered material

#24
20120268861
2012-10-25

Ceramic sheet product for ceramic electronic component, multilayer ceramic electronic component using the same and method of manufacturing multilayer ceramic electronic component

#25
20120214016
2012-08-23

CONSTRAINED METAL FLANGES AND METHODS FOR MAKING THE SAME

#26
20120038038
2012-02-16

Aluminum nitride substrate, aluminum nitride circuit board, semiconductor apparatus, and method for manufacturing aluminum nitride substrate

#27
20120034473
2012-02-09

METHOD FOR PRODUCING A CONNECTION OF GRAPHITE AND CARRIER METAL AND COMPOSITION ELEMENT

#28
20110268975
2011-11-03

Transient Migrating Phase Low Temperature Joining of Co-Sintered Particulate Materials Including a Chemical Reaction

#29
20110169601
2011-07-14

Method of manufacturing a thermistor element

#30
20110091640
2011-04-21

NON-SHRINKING CERAMIC SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

#31
20110048770
2011-03-03

INJECTION MOLDED FERRULE FOR COFIRED FEEDTHROUGHS

#32
20110005810
2011-01-13

INSULATING SUBSTRATE AND METHOD FOR PRODUCING THE SAME

#33
20100327537
2010-12-30

Hermetic sealing assembly and electrical device including the same

#34
20100214882
2010-08-26

Multi-stage enamelled dial

#35
20100207494
2010-08-19

Piezoelectric ceramic composition and piezoelectric ceramic electronic component

#36
20100132932
2010-06-03

METHOD FOR PRODUCING A METALIZED COMPONENT, CORRESPONDING COMPONENT, AND A SUBSTRATE FOR SUPPORTING THE COMPONENT DURING METALIZATION

#37
20100098905
2010-04-22

NON-SHRINKING CERAMIC SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

#38
20100068552
2010-03-18

MODULE INCLUDING A STABLE SOLDER JOINT

#39
20100035024
2010-02-11

Bonded metal and ceramic plates for thermal management of optical and electronic devices

#40
20100032143
2010-02-11

Microheat exchanger for laser diode cooling

#41
20090167482
2009-07-02

Surface-mount negative-characteristic thermistor

#42
20090142608
2009-06-04

Method for bonding refractory ceramic and metal

#43
20090033179
2009-02-05

MULTILAYER PIEZOELECTRIC ELEMENT

#44
20090011921
2009-01-08

Dielectric porcelain composition and method for production thereof

#45
20090008784
2009-01-08

Power semiconductor substrates with metal contact layer and method of manufacture thereof

#46
20080292874
2008-11-27

Sintered power semiconductor substrate and method of producing the substrate

#47
20080257472
2008-10-23

METHOD FOR MANUFACTURING CERAMIC PLATES

#48
20080246194
2008-10-09

METHOD OF PRODUCING A CERAMIC SINTERED BODY

#49
20080245467
2008-10-09

LOW LOSS GLASS-CERAMIC MATERIALS, METHOD OF MAKING SAME AND ELECTRONIC PACKAGES INCLUDING SAME

#50
20080230585
2008-09-25

Different materials bonded member and production method thereof

#51
20080048821
2008-02-28

Surface-mount negative-characteristic thermistor

#52
20080045399
2008-02-21

Dielectric ceramic composition and monolithic ceramic capacitor

#53
20070259248
2007-11-08

Multi-layer seal for electrochemical devices

#54
20070248869
2007-10-25

Ceramic thin plate member

#55
20070221399
2007-09-27

Electronic component and its manufacturing method

#56
20070213202
2007-09-13

Dielectric porcelain composition and method for production thereof

#57
20070172652
2007-07-26

Dielectric particle aggregate comprising a surface layer of zinc titanate, low temperature sinterable dielectric ceramic composition using same

#58
20070125977
2007-06-07

Piezoelectric ceramic and laminated piezoelectric element

#59
20070120446
2007-05-31

Piezoelectric ceramic composition and piezoelectric element comprising the composition

#60
20070087931
2007-04-19

Dielectric ceramic composition and multilayer electronic component

#61
20070054098
2007-03-08

Multi-layer ceramic substrate and manufacturing method thereof

#62
20070001553
2007-01-04

Piezoelectric ceramic composition and piezoelectric ceramic electronic component

#63
20060234851
2006-10-19

Dielectric ceramic composition, method of manufacturing the same, and dielectric ceramics and laminated ceramic part using the same

#64
20060148638
2006-07-06

Low-fire high-permittivity dielectric compositions

#65
20060148637
2006-07-06

Low-fire high-permittivity dielectric compositions

#66
20060142141
2006-06-29

Dielectric ceramic composition, dielectric ceramic, and laminated ceramic part including the same

#67
20060116186
2006-06-01

Game program

#68
20060079391
2006-04-13

Dielectric material and the method of preparing the same

#69
20060062971
2006-03-23

Multi-stage enamelled dial

#70
20060043844
2006-03-02

Method for production of PZT-based ceramics having a slow sintering temperature

#71
20060040819
2006-02-23

Ceramic composition and ceramic wiring board

#72
20060012135
2006-01-19

Multi-layer seal for electrochemical devices

#73
20050269749
2005-12-08

Aluminum nitride sintered compact

#74
20050266252
2005-12-01

Low loss glass-ceramic materials, method of making same and electronic packages including same

#75
20050266251
2005-12-01

Glass-ceramic materials and electronic packages including same

#76
20050255239
2005-11-17

Process for producing nanocrystalline composites

#77
20050214516
2005-09-29

Multi-layer ceramic substrate and manufacturing method thereof

#78
20050209090
2005-09-22

Dielectric ceramic composition and multilayer ceramic part using the same

#79
20050186407
2005-08-25

Method of manufacturing ceramic paste and ceramic multi-layer wiring substrate utilizing the same

#80
20050176575
2005-08-11

Method for producing low-loss tunable ceramic composites with improved breakdown strengths

#81
20050126682
2005-06-16

Monolithic ceramic substrate and method for making the same

#82
20050104265
2005-05-19

Method of producing translucent ceramic

#83
20050101082
2005-05-12

Composite material, wafer holding member and method for manufacturing the same

#84
20050095464
2005-05-05

Ultralow firing temperature compensating ceramic composition for pure silver electrode, sintering flux and laminated ceramic element obtained therefrom

#85
20050062582
2005-03-24

Electrical component with a negative temperature coefficient

#86
20050045618
2005-03-03

Ceramic heater and ceramic joined article

#87
20050014031
2005-01-20

Aluminum nitride sintered body, ceramic substrate, ceramic heater and electrostatic chuck