ClassID:

90081

C04B2237/54 - CPC Classification

Classification description:

Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating; Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating Oxidising the surface before joining

Recent Application in this class:
#1
20200361828
2020-11-19

Method for producing a semi-finished metal product, method for producing a metal-ceramic substrate, and metal-ceramic substrate

#2
20200199029
2020-06-25

LOGIC POWER MODULE WITH A THICK-FILM PASTE MEDIATED SUBSTRATE BONDED WITH METAL OR METAL HYBRID FOILS

#3
20190202743
2019-07-04

SILICON CARBIDE-NATURED REFRACTORY BLOCK

#4
20190055167
2019-02-21

Copper-ceramic composite

#5
20190002359
2019-01-03

THICK-FILM PASTE MEDIATED CERAMICS BONDED WITH METAL OR METAL HYBRID FOILS

#6
20190002358
2019-01-03

Copper-ceramic substrate, copper precursor for producing a copper-ceramic substrate and process for producing a copper-ceramic substrate

#7
20190002337
2019-01-03

APPARATUS INCLUDING A CERAMIC COMPONENT, A METAL COMPONENT, AND A GLASS SEALING MATERIAL AND A PROCESS OF FORMING THE APPARATUS

#8
20160304405
2016-10-20

Method for producing a metal-ceramic substrate

#9
20150140276
2015-05-21

Solid body joining of a carrier body and a cover layer, particularly by anodic bonding

#10
20150034367
2015-02-05

Power module substrate, power module substrate with heat sink, and power module

#11
20140345914
2014-11-27

Metal-ceramic substrate

#12
20140192486
2014-07-10

Power module substrate, power module substrate with heat sink, power module, and method of manufacturing power module substrate

#13
20130042763
2013-02-21

Method for potting ceramic capillary membranes

#14
20120264596
2012-10-18

HONEYCOMB STRUCTURE AND METHOD OF MANUFACTURING HONEYCOMB STRUCTURE

#15
20120114966
2012-05-10

Ceramic/metal composite structure

#16
20120093695
2012-04-19

HONEYCOMB STRUCTURE AND EXHAUST GAS PURIFYING APPARATUS

#17
20120077023
2012-03-29

SINTERED CERAMIC AND SUBSTRATE COMPRISING SAME FOR SEMICONDUCTOR DEVICE

#18
20110303348
2011-12-15

Method for the manufacture of double-sided metalized ceramic substrates

#19
20110250382
2011-10-13

Honeycomb structure and method for manufacturing honeycomb structure

#20
20110045209
2011-02-24

Continuous or discrete metallization layer on a ceramic substrate

#21
20090232972
2009-09-17

Method for the production of a metal-ceramic substrate

#22
20090226746
2009-09-10

Method for making hybrid metal-ceramic matrix composite structures and structures made thereby

#23
20090152237
2009-06-18

Ceramic-Copper Foil Bonding Method

#24
20080190542
2008-08-14

Method of manufacturing ceramic/metal composite structure

#25
20070261778
2007-11-15

Method for the production of a metal-ceramic substrate or copper-ceramic substrate, and support to be used in said method

#26
20070231590
2007-10-04

Method of Bonding Metals to Ceramics

#27
20070221326
2007-09-27

Silicon Carbide Bonding

#28
20050271891
2005-12-08

Metal-ceramic joined article and production method