C04B2237/50 - CPC Classification Index

ClassID:

90078 ⎘

C04B2237/50 - CPC Classification

Classification description:

Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating

Sub-classes:

C04B2237/52 » Pre-treatment of the joining surfaces, e.g. cleaning, machining 140
C04B2237/54 » Oxidising the surface before joining 28
C04B2237/55 » Pre-treatments of a coated or not coated substrate other than oxidation treatment in order to form an active joining layer 40
C04B2237/56 » Using constraining layers before or during sintering 27
C04B2237/58 » Forming a gradient in composition or in properties across the laminate or the joined articles 84
C04B2237/59 » Aspects relating to the structure of the interlayer 12
C04B2237/60 » Forming at the joining interface or in the joining layer specific reaction phases or zones, e.g. diffusion of reactive species from the interlayer to the substrate or from a substrate to the joining interface, carbide forming at the joining interface 138
C04B2237/61 » Joining two substrates of which at least one is porous by infiltrating the porous substrate with a liquid, such as a molten metal, causing bonding of the two substrates, e.g. joining two porous carbon substrates by infiltrating with molten silicon 95
C04B2237/62 » Forming laminates or joined articles comprising holes, channels or other types of openings 261
C04B2237/64 » Forming laminates or joined articles comprising grooves or cuts 86
C04B2237/66 » Forming laminates or joined articles showing high dimensional accuracy, e.g. indicated by the warpage 59
C04B2237/68 » Forming laminates or joining articles wherein at least one substrate contains at least two different parts of macro-size, e.g. one ceramic substrate layer containing an embedded conductor or electrode 183
C04B2237/70 » Forming laminates or joined articles comprising layers of a specific, unusual thickness 31
C04B2237/72 » Forming laminates or joined articles comprising at least two interlayers directly next to each other 207
C04B2237/74 » Forming laminates or joined articles comprising at least two different interlayers separated by a substrate 30
C04B2237/76 » Forming laminates or joined articles comprising at least one member in the form other than a sheet or disc, e.g. two tubes or a tube and a sheet or disc 143
C04B2237/78 » Side-way connecting, e.g. connecting two plates through their sides 39
C04B2237/80 » Joining the largest surface of one substrate with a smaller surface of the other substrate, e.g. butt joining or forming a T-joint 58
C04B2237/82 » Two substrates not completely covering each other, e.g. two plates in a staggered position 26
C04B2237/84 » Joining of a first substrate with a second substrate at least partially inside the first substrate, where the bonding area is at the inside of the first substrate, e.g. one tube inside another tube 161
C04B2237/86 » Joining of two substrates at their largest surfaces, one surface being complete joined and covered, the other surface not, e.g. a small plate joined at it's largest surface on top of a larger plate 94
C04B2237/88 » Joining of two substrates, where a substantial part of the joining material is present outside of the joint, leading to an outside joining of the joint 20

Recent Application in this class:

20220406677

2022-12-22

Copper/ceramic joined body and insulating circuit substrate

20210166825

2021-06-03

Joining and sealing pressurized ceramic structures

20210078092

2021-03-18

CERAMIC-ALUMINUM ASSEMBLY WITH BONDING TRENCHES

20200398372

2020-12-24

Laser cutting of metal-ceramic substrates

20200362472

2020-11-19

Method for electrospinning of an ultra-high temperature composite structure

20200357676

2020-11-12

Electrostatic chuck for clamping in high temperature semiconductor processing and method of making same

20200230728

2020-07-23

CERAMIC-ALUMINUM ASSEMBLY WITH BONDING TRENCHES

20190314918

2019-10-17

Ceramic-aluminum assembly with bonding trenches

20190150298

2019-05-16

Ceramic circuit substrate and method for producing ceramic circuit substrate

#10

20190135706

2019-05-09

Copper-ceramic bonded body and insulation circuit substrate

#11

20180148383

2018-05-31

SURFACE TREATMENT METHOD FOR CERAMIC

#12

20170263486

2017-09-14

Electrostatic chuck for clamping in high temperature semiconductor processing and method of making same

#13

20150274601

2015-10-01

PROCESS AND APPARATUS FOR MAKING INORGANIC SHEET

#14

20150136593

2015-05-21

Production method of electroconductive mayenite compound having high electron density, and target

#15

20150000201

2015-01-01

Method for attaching a pre-sintered body of polycrystalline diamond material to a substrate

#16

20140290852

2014-10-02

Method for producing bonded body

#17

20130157868

2013-06-20

Method of joining superconductor materials

#18

20130062000

2013-03-14

Method for modifying composite articles

#19

20120148868

2012-06-14

Composite articles made by process for joining bronze part and silicon carbide ceramic part

#20

20120148867

2012-06-14

Composite articles made by process for joining brass part and silicon carbide ceramic part

#21

20120107640

2012-05-03

PROCESS FOR JOINING CARBON STEEL PART AND SILICON CARBIDE CERAMIC PART AND COMPOSITE ARTICLES MADE BY SAME

#22

20120100388

2012-04-26

Composite articles made by process for joining stainless steel part and titanium carbide ceramic part

#23

20100092742

2010-04-15

Ceramic multilayer substrate and method for manufacturing the same

#24

20080308976

2008-12-18

Ceramic substrate production process and ceramic substrate produced using the process

#25

20070184251

2007-08-09

Ceramic multilayer substrate and method for manufacturing the same

#26

20070172639

2007-07-26

Ceramic matrix laminates

#27

20070095456

2007-05-03

Method for manufacturing multilayer ceramic electronic element

#28

20050104265

2005-05-19

Method of producing translucent ceramic

#29

20050045618

2005-03-03

Ceramic heater and ceramic joined article

#30

20050016661

2005-01-27

Method for manufacturing multilayer ceramic electronic element

#31

20050014031

2005-01-20

Aluminum nitride sintered body, ceramic substrate, ceramic heater and electrostatic chuck