ClassID:

90083

C04B2237/555 - CPC Classification

Classification description:

Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating; Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating; Pre-treatments of a coated or not coated substrate other than oxidation treatment in order to form an active joining layer on a substrate not containing an interlayer coating, leading to the formation of an interlayer coating

Recent Application in this class:
#1
20250243126
2025-07-31

GRAPHITE-MULLITE JOINT FORMATION

#2
20250223235
2025-07-10

LAMINATE, ANTENNA-IN-PACKAGING, AND METHODS OF MAKING THE SAME

#3
20230391055
2023-12-07

COMPOSITE WAFER AND MANUFACTURING METHOD THEREFOR

#4
20190071364
2019-03-07

Ceramic matrix composite component and method of producing the same

#5
20170226019
2017-08-10

Ceramics wringing

#6
20160005639
2016-01-07

Sample holder

#7
20130319762
2013-12-05

Transient liquid phase, pressureless joining of aluminum nitride components

#8
20120264596
2012-10-18

HONEYCOMB STRUCTURE AND METHOD OF MANUFACTURING HONEYCOMB STRUCTURE

#9
20120047814
2012-03-01

Methods of fabricating polycrystalline diamond compacts

#10
20120012401
2012-01-19

Polycrystalline diamond compact including a substrate having a raised interfacial surface bonded to a polycrystalline diamond table, and applications therefor

#11
20110297453
2011-12-08

Polycrystalline diamond compacts and related drill bits

#12
20110120782
2011-05-26

Polycrystalline diamond compact including a substrate having a raised interfacial surface bonded to a leached polycrystalline diamond table, and applications therefor

#13
20110067929
2011-03-24

Polycrystalline diamond compacts, methods of making same, and applications therefor

#14
20100212971
2010-08-26

Polycrystalline diamond compact including a cemented tungsten carbide substrate that is substantially free of tungsten carbide grains exhibiting abnormal grain growth and applications therefor

#15
20070221326
2007-09-27

Silicon Carbide Bonding