C04B2237/56 - CPC Classification Index

ClassID:

90084 ⎘

C04B2237/56 - CPC Classification

Classification description:

Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating; Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating Using constraining layers before or during sintering

Sub-classes:

C04B2237/561 » Constraining layers not covering the whole surface of the layers to be sintered, e.g. constraining layers with holes 9
C04B2237/562 » made of alumina or aluminates 42
C04B2237/564 » made of glass 6
C04B2237/565 » made of refractory metal oxides, e.g. zirconia 17
C04B2237/567 » made of metal 8
C04B2237/568 » made of non-oxide ceramics 8

Recent Application in this class:

20250214324

CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING CERAMIC SUBSTRATE

20180072627

Multilayer ceramic substrate and method for manufacturing multilayer ceramic substrate

20170151755

Metal-on-ceramic substrates

20140290828

Method for manufacturing liquid ejecting head

20140083597

Method for joining substrates

20130264723

Metal base substrate and manufacturing method thereof

20120114966

Ceramic/metal composite structure

20110303348

Method for the manufacture of double-sided metalized ceramic substrates

20110277912

Ceramic laminate and method of manufacturing ceramic sintered body

20110088831

Method for producing ceramic body

20110027539

IMPROVED PROCESS FOR PRESSURELESS CONSTRAINED SINTERING OF LOW TEMPERATURE CO-FIRED CERAMIC WITH SURFACE CIRCUIT PATTERNS

20100116413

Methods of manufacturing ceramic board and electronic device

20100104835

Ceramic laminate and method of manufacturing ceramic sintered body

20100092742

Ceramic multilayer substrate and method for manufacturing the same

20100059252

Method for manufacturing multilayer ceramic substrate and composite sheet

20090107616

MANUFACTURING METHOD OF MULTI-LAYER CERAMIC SUBSTRATE

20090053487

CERAMIC CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

20080308976

Ceramic substrate production process and ceramic substrate produced using the process

20070261778

Method for the production of a metal-ceramic substrate or copper-ceramic substrate, and support to be used in said method

20070184251

Ceramic multilayer substrate and method for manufacturing the same

20070151090

Ceramic substrate

20060061019

Method of producing ceramic multilayer substrates, and green composite laminate

20050263877

Laminated radiation member, power semiconductor apparatus, and method for producing the same

20050206050

Method of manufacturing ceramic body and firing jig

20050194085

Method for producing ceramic multilayer substrate

20050145319

Unfired, adhesive ceramic film

20050126682

Monolithic ceramic substrate and method for making the same

20050051253

Method for producing ceramic substrate, and ceramic substrate