89045 ⎘
Joining burned ceramic articles with other burned ceramic articles or other articles by heating
Sub-classes:Methods of forming articles having spinel-based oxides containing magnesium, aluminum and titanium
#2Articles and Methods for Manufacture of Nanostructure Reinforced Composites
#3CERAMIC JOINT BODY, METHOD FOR MANUFACTURING CERAMIC JOINT BODY, STATOR FOR FLOW CHANNEL SWITCHING VALVE, AND FLOW CHANNEL SWITCHING VALVE
#4CERAMIC STRUCTURE AND SUPPORTING MECHANISM WHICH IS PROVIDED WITH SAID CERAMIC STRUCTURE
#5Systems and methods for thermally processing CMC components
#6Termination feedthrough unit with ceramic insulator for vacuum and corrosive applications
#7Dense composite material, method for producing the same, joined body, and member for semiconductor manufacturing device
#8A tubular ceramic component suitable for being used in a nuclear reactor
#9Electrostatic chuck for clamping in high temperature semiconductor processing and method of making same
#10Method for producing honeycomb structure
#11SEMICONDUCTOR MANUFACTURING DEVICE MEMBER, METHOD FOR MANUFACTURING THE SAME, AND FORMING DIE
#12Polymer matrix-ceramic matrix hybrid composites for high thermal applications
#13Solid state battery fabrication
#14Systems and methods for thermally processing CMC components
#15Spinel-based oxides containing magnesium, aluminum and titanium and methods of forming articles having same
#16Method for producing semiconductor production device component, and semiconductor production device component
#17Bonded ceramic assembly
#18Component for semiconductor production device, and production method of component for semiconductor production device
#19Ceramic insulator
#20Polycrystalline ceramic substrate, bonding-layer-including polycrystalline ceramic substrate, and laminated substrate
#21Ceramic substrate and production method for same
#22Heat-sink-attached power-module substrate and power module
#23Copper paste for joining, method for producing joined body, and method for producing semiconductor device
#24Ceramic bonded body
#25SOLID STATE BATTERY FABRICATION
#26Transparent ceramic as a component for fracture-resistant optical units
#27Bonded body, substrate for power module with heat sink, heat sink, method for producing bonded body, method for producing substrate for power module with heat sink, and method for producing heat sink
#28Lithium tantalate single crystal substrate, bonded substrate, manufacturing method of the bonded substrate, and surface acoustic wave device using the bonded substrate
#29Sialon sintered body, method for producing the same, composite substrate, and electronic device
#30Minimizing tin loss during thermal processing of kesterite films
#31Bonded body, substrate for power module with heat sink, heat sink, method for producing bonded body, method for producing substrate for power module with heat sink, and method for producing heat sink
#32Joint surface coatings for ceramic components
#33Solid electrolyte carbon dioxide sensor and manufacturing method thereof
#34Method for making a biocompatible hermetic housing including hermetic electrical feedthroughs
#35Cordierite-based sintered body, method for producing the same, and composite substrate
#36Electrostatic chuck for clamping in high temperature semiconductor processing and method of making same
#37SUBSTRATE CERAMIC LAMINATE
#38Method for repairing heaters and chucks used in semiconductor processing
#39Dental glass-ceramics block bonded with abutment and preparation method thereof
#40Ply, method for manufacturing ply, and method for manufacturing article with ply
#41Friction Welded Insert and Processes for Inserting the Insert into a Substrate
#42High temperature seal compositions and methods of using same
#43Articles and Methods for Manufacture of Nanostructure Reinforced Composites
#44Method for producing a circuit carrier arrangement having a carrier which has a surface formed by an aluminum/silicon carbide metal matrix composite material
#45Cordierite sintered body, method for manufacturing the same, composite substrate, and electronic device
#46Super-hard constructions, methods for making same and method for processing same
#47Semiconductor device with metal-bonded heat dissipator and manufacturing method for the same
#48Supporting substrate for composite substrate and composite substrate
#49PROCESS AND APPARATUS FOR MAKING INORGANIC SHEET
#50METHOD OF PREPARING HETEROGENEOUS STACKED CO-FIRED CERAMIC FOR USE IN AN ALUMINUM NITRIDE ELECTROSTATIC CHUCK
#51Process for bonding arrays of ceramic filters
#52Method for applying heat resistant protection components onto a surface of a heat exposed component
#53Wavelength conversion element, light-emitting semiconductor device and display apparatus therewith, and method for producing a wavelength conversion element
#54Manufacturing method for monolithic ceramic electronic component
#55Method for assembling parts made of SiC materials by means of non-reactive brazing in an oxidizing atmosphere, brazing compositions, and gasket and assembly obtained by said method
#56Ceramic matrix composite member and method of manufacturing the same
#57Cement and skinning material based on a water-swellable clay, and method for producing segmented or skinned ceramic honeycomb structures
#58Method of processing a composite body
#59Method for producing electrode assembly
#60Method for manufacturing laminated ceramic electronic component
#61Method for making a biocompatible hermetic housing including hermetic electrical feedthroughs
#62Solid state battery fabrication
#63Method For Hermetically Joining Ceramic Materials Using Brazing Of Pre-Metallized Regions
#64Sinter bonded ceramic articles
#65Hybrid rotor disk assembly with a ceramic matrix composite airfoil for a gas turbine engine
#66Ceramic matrix composite airfoil structures for a gas turbine engine
#67Manufacturing method for monolithic ceramic electronic component
#68Medical device having bonding regions and method of making the same
#69Medical device having bonding regions and method of making the same
#70Method for providing hermetic electrical feedthrough
#71METHOD FOR PROVIDING HERMETIC ELECTRICAL FEEDTHROUGH
#72Method of wafer/substrate bonding