ClassID:

89045

C04B37/00 - CPC Classification

Classification description:

Joining burned ceramic articles with other burned ceramic articles or other articles by heating

Sub-classes:
Recent Application in this class:
#1
20240124361
2024-04-18

Methods of forming articles having spinel-based oxides containing magnesium, aluminum and titanium

#2
20230365765
2023-11-16

Articles and Methods for Manufacture of Nanostructure Reinforced Composites

#3
20230034636
2023-02-02

CERAMIC JOINT BODY, METHOD FOR MANUFACTURING CERAMIC JOINT BODY, STATOR FOR FLOW CHANNEL SWITCHING VALVE, AND FLOW CHANNEL SWITCHING VALVE

#4
20220234957
2022-07-28

CERAMIC STRUCTURE AND SUPPORTING MECHANISM WHICH IS PROVIDED WITH SAID CERAMIC STRUCTURE

#5
20220098117
2022-03-31

Systems and methods for thermally processing CMC components

#6
20210292246
2021-09-23

Termination feedthrough unit with ceramic insulator for vacuum and corrosive applications

#7
20210230074
2021-07-29

Dense composite material, method for producing the same, joined body, and member for semiconductor manufacturing device

#8
20200373022
2020-11-26

A tubular ceramic component suitable for being used in a nuclear reactor

#9
20200357676
2020-11-12

Electrostatic chuck for clamping in high temperature semiconductor processing and method of making same

#10
20200298155
2020-09-24

Method for producing honeycomb structure

#11
20200258769
2020-08-13

SEMICONDUCTOR MANUFACTURING DEVICE MEMBER, METHOD FOR MANUFACTURING THE SAME, AND FORMING DIE

#12
20200254725
2020-08-13

Polymer matrix-ceramic matrix hybrid composites for high thermal applications

#13
20200185780
2020-06-11

Solid state battery fabrication

#14
20200062658
2020-02-27

Systems and methods for thermally processing CMC components

#15
20200024193
2020-01-23

Spinel-based oxides containing magnesium, aluminum and titanium and methods of forming articles having same

#16
20190284100
2019-09-19

Method for producing semiconductor production device component, and semiconductor production device component

#17
20190263725
2019-08-29

Bonded ceramic assembly

#18
20190263724
2019-08-29

Component for semiconductor production device, and production method of component for semiconductor production device

#19
20190168489
2019-06-06

Ceramic insulator

#20
20190131123
2019-05-02

Polycrystalline ceramic substrate, bonding-layer-including polycrystalline ceramic substrate, and laminated substrate

#21
20190047915
2019-02-14

Ceramic substrate and production method for same

#22
20180301391
2018-10-18

Heat-sink-attached power-module substrate and power module

#23
20180250751
2018-09-06

Copper paste for joining, method for producing joined body, and method for producing semiconductor device

#24
20180237348
2018-08-23

Ceramic bonded body

#25
20180198171
2018-07-12

SOLID STATE BATTERY FABRICATION

#26
20180155247
2018-06-07

Transparent ceramic as a component for fracture-resistant optical units

#27
20180090413
2018-03-29

Bonded body, substrate for power module with heat sink, heat sink, method for producing bonded body, method for producing substrate for power module with heat sink, and method for producing heat sink

#28
20180080144
2018-03-22

Lithium tantalate single crystal substrate, bonded substrate, manufacturing method of the bonded substrate, and surface acoustic wave device using the bonded substrate

#29
20180079690
2018-03-22

Sialon sintered body, method for producing the same, composite substrate, and electronic device

#30
20180069146
2018-03-08

Minimizing tin loss during thermal processing of kesterite films

#31
20180040535
2018-02-08

Bonded body, substrate for power module with heat sink, heat sink, method for producing bonded body, method for producing substrate for power module with heat sink, and method for producing heat sink

#32
20170368803
2017-12-28

Joint surface coatings for ceramic components

#33
20170356872
2017-12-14

Solid electrolyte carbon dioxide sensor and manufacturing method thereof

#34
20170290171
2017-10-05

Method for making a biocompatible hermetic housing including hermetic electrical feedthroughs

#35
20170275207
2017-09-28

Cordierite-based sintered body, method for producing the same, and composite substrate

#36
20170263486
2017-09-14

Electrostatic chuck for clamping in high temperature semiconductor processing and method of making same

#37
20170182749
2017-06-29

SUBSTRATE CERAMIC LAMINATE

#38
20170072516
2017-03-16

Method for repairing heaters and chucks used in semiconductor processing

#39
20170057865
2017-03-02

Dental glass-ceramics block bonded with abutment and preparation method thereof

#40
20170030207
2017-02-02

Ply, method for manufacturing ply, and method for manufacturing article with ply

#41
20170016323
2017-01-19

Friction Welded Insert and Processes for Inserting the Insert into a Substrate

#42
20160347972
2016-12-01

High temperature seal compositions and methods of using same

#43
20160340482
2016-11-24

Articles and Methods for Manufacture of Nanostructure Reinforced Composites

#44
20160284664
2016-09-29

Method for producing a circuit carrier arrangement having a carrier which has a surface formed by an aluminum/silicon carbide metal matrix composite material

#45
20160264471
2016-09-15

Cordierite sintered body, method for manufacturing the same, composite substrate, and electronic device

#46
20160214904
2016-07-28

Super-hard constructions, methods for making same and method for processing same

#47
20160190417
2016-06-30

Semiconductor device with metal-bonded heat dissipator and manufacturing method for the same

#48
20160049469
2016-02-18

Supporting substrate for composite substrate and composite substrate

#49
20150274601
2015-10-01

PROCESS AND APPARATUS FOR MAKING INORGANIC SHEET

#50
20150155194
2015-06-04

METHOD OF PREPARING HETEROGENEOUS STACKED CO-FIRED CERAMIC FOR USE IN AN ALUMINUM NITRIDE ELECTROSTATIC CHUCK

#51
20150129106
2015-05-14

Process for bonding arrays of ceramic filters

#52
20150083305
2015-03-26

Method for applying heat resistant protection components onto a surface of a heat exposed component

#53
20150048392
2015-02-19

Wavelength conversion element, light-emitting semiconductor device and display apparatus therewith, and method for producing a wavelength conversion element

#54
20140345779
2014-11-27

Manufacturing method for monolithic ceramic electronic component

#55
20140328615
2014-11-06

Method for assembling parts made of SiC materials by means of non-reactive brazing in an oxidizing atmosphere, brazing compositions, and gasket and assembly obtained by said method

#56
20140322024
2014-10-30

Ceramic matrix composite member and method of manufacturing the same

#57
20140319742
2014-10-30

Cement and skinning material based on a water-swellable clay, and method for producing segmented or skinned ceramic honeycomb structures

#58
20140230339
2014-08-21

Method of processing a composite body

#59
20140216631
2014-08-07

Method for producing electrode assembly

#60
20140096890
2014-04-10

Method for manufacturing laminated ceramic electronic component

#61
20140076844
2014-03-20

Method for making a biocompatible hermetic housing including hermetic electrical feedthroughs

#62
20140060723
2014-03-06

Solid state battery fabrication

#63
20140014710
2014-01-16

Method For Hermetically Joining Ceramic Materials Using Brazing Of Pre-Metallized Regions

#64
20130285370
2013-10-31

Sinter bonded ceramic articles

#65
20120301314
2012-11-29

Hybrid rotor disk assembly with a ceramic matrix composite airfoil for a gas turbine engine

#66
20120301312
2012-11-29

Ceramic matrix composite airfoil structures for a gas turbine engine

#67
20120234462
2012-09-20

Manufacturing method for monolithic ceramic electronic component

#68
20110008626
2011-01-13

Medical device having bonding regions and method of making the same

#69
20100078123
2010-04-01

Medical device having bonding regions and method of making the same

#70
20080314865
2008-12-25

Method for providing hermetic electrical feedthrough

#71
20080314502
2008-12-25

METHOD FOR PROVIDING HERMETIC ELECTRICAL FEEDTHROUGH

#72
20050215028
2005-09-29

Method of wafer/substrate bonding