ClassID:

89051

C04B37/02 - CPC Classification

Classification description:

Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles

Sub-classes:
Recent Application in this class:
#1
20260018624
2026-01-15

PRODUCTION OF A COMPONENT WITH A GAS-TIGHT ION-CONDUCTING FUNCTIONAL LAYER, AND COMPONENT

#2
20250263808
2025-08-21

RUHRSTAHL-HERAEUS SNORKEL DESIGN

#3
20240178039
2024-05-30

ELECTROSTATIC CHUCK, ELECTROSTATIC CHUCK HEATER COMPRISING SAME, AND SEMICONDUCTOR HOLDING DEVICE

#4
20230399267
2023-12-14

COPPER-CERAMIC SUBSTRATE

#5
20230339820
2023-10-26

LOW THERMAL STRESS ENGINEERED METAL STRUCTURES

#6
20230272519
2023-08-31

DENSE TARGET

#7
20230260868
2023-08-17

BONDED BODY, CERAMIC-COPPER CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE

#8
20230226630
2023-07-20

JOINED BODY AND ELECTROSTATIC CHUCK

#9
20230115820
2023-04-13

METHOD FOR MANUFACTURING BONDED BODY AND METHOD FOR MANUFACTURING INSULATION CIRCUIT SUBSTRATE

#10
20220375819
2022-11-24

COPPER/CERAMIC ASSEMBLY AND INSULATED CIRCUIT BOARD

#11
20220169575
2022-06-02

Joining Method

#12
20220009841
2022-01-13

Ceramic structure and structure with terminal

#13
20210398928
2021-12-23

Bonded body, circuit board, and semiconductor device

#14
20210178509
2021-06-17

Copper/ceramic bonded body, insulating circuit substrate, copper/ceramic bonded body production method, and insulating circuit substrate production method

#15
20200413534
2020-12-31

INSULATED CIRCUIT BOARD

#16
20200398372
2020-12-24

Laser cutting of metal-ceramic substrates

#17
20200365475
2020-11-19

Bonded body of copper and ceramic, insulating circuit substrate, bonded body of copper and ceramic production method, and insulating circuit substrate production method

#18
20200230752
2020-07-23

Mechanical ceramic matrix composite (CMS) repair

#19
20200178387
2020-06-04

Ceramic circuit board and semiconductor module

#20
20200111722
2020-04-09

METHOD FOR PRODUCING CERAMIC-ALUMINUM BONDED BODY, METHOD FOR PRODUCING POWER MODULE SUBSTRATE, CERAMIC-ALUMINUM BONDED BODY, AND POWER MODULE SUBSTRATE

#21
20200075383
2020-03-05

Ceramic substrate containing aluminum oxide and electrostatic chuck having electrode containing tungsten with oxides

#22
20200058458
2020-02-20

Power contactor and method for producing a housing body for the power contactor

#23
20190351576
2019-11-21

CERAMIC COMPONENT AND THREE-DIMENSIONAL MANUFACTURING METHOD OF CERAMIC COMPONENT

#24
20190263722
2019-08-29

Rare-earth oxide based chamber material

#25
20190232658
2019-08-01

Lead-free piezo printhead using thinned bulk material

#26
20190232526
2019-08-01

Intermediate member

#27
20190210149
2019-07-11

Friction stir welding tool member, friction stir welding apparatus using the same, and friction stir welding method

#28
20190196254
2019-06-27

Image generating device, head-up display comprising such a device and method for manufacturing an image generating device

#29
20190150278
2019-05-16

Ceramic circuit board and semiconductor module

#30
20190126373
2019-05-02

Ceramic-metal structure

#31
20190062224
2019-02-28

Heat-permeable tube containing ceramic matrix composite

#32
20180347383
2018-12-06

Turbine vane assembly with ceramic matrix composite airfoil and friction fit metallic attachment features

#33
20180346387
2018-12-06

Ceramic/aluminum joined body, insulating circuit board, power module, LED module, and thermoelectric module

#34
20180323122
2018-11-08

Ceramic-aluminum conjugate, power module substrate, and power module

#35
20180286740
2018-10-04

Manufacturing method of sample table

#36
20180280872
2018-10-04

Conductive honeycomb structure

#37
20180204747
2018-07-19

SUBSTRATE SUPPORT ASSEMBLY HAVING SURFACE FEATURES TO IMPROVE THERMAL PERFORMANCE

#38
20180093927
2018-04-05

Method for producing a metal-ceramic substrate

#39
20180080144
2018-03-22

Lithium tantalate single crystal substrate, bonded substrate, manufacturing method of the bonded substrate, and surface acoustic wave device using the bonded substrate

#40
20180068212
2018-03-08

Method for creating ceramic-containing transaction cards

#41
20180044247
2018-02-15

Rare-earth oxide based chamber material

#42
20180044246
2018-02-15

Rare-earth oxide based chamber material

#43
20170344870
2017-11-30

Method for creating ceramic-containing transaction cards

#44
20170117175
2017-04-27

Ceramic structure, member for substrate-holding apparatus, and method for producing the ceramic structure

#45
20170044072
2017-02-16

Process for producing bonded body and process for producing power module substrate

#46
20160358673
2016-12-08

SiC matrix fuel cladding tube with spark plasma sintered end plugs

#47
20160326061
2016-11-10

Rare-earth oxide based monolithic chamber material

#48
20160326060
2016-11-10

Rare-earth oxide based monolithic chamber material

#49
20160324218
2016-11-10

Heating module of electronic cigarette atomizer

#50
20160318807
2016-11-03

Rare-earth oxide based coating

#51
20160273846
2016-09-22

Ceramic member and joint structure of metal members

#52
20160249452
2016-08-25

Bonded body and power module substrate

#53
20160185668
2016-06-30

Mullite sintered body, method for producing the same, and composite substrate

#54
20160167170
2016-06-16

Bonded body and power module substrate

#55
20160099164
2016-04-07

Structure for joining ceramic plate to metal cylindrical member

#56
20150284296
2015-10-08

Metal/ceramic bonding substrate and method for producing same

#57
20150133285
2015-05-14

Rare-earth oxide based monolithic chamber material

#58
20150078505
2015-03-19

SiC matrix fuel cladding tube with spark plasma sintered end plugs

#59
20140145558
2014-05-29

Composite substrate with partially planarized irregular surface

#60
20130133808
2013-05-30

Method for manufacturing sputtering target and method for manufacturing semiconductor device

#61
20110252711
2011-10-20

Method of preparing polycrystalline diamond from derivatized nanodiamond

#62
20110061797
2011-03-17

Method for manufacturing honeycomb structure

#63
20100112394
2010-05-06

Reaction apparatus, fuel cell system and electronic device

#64
20100112372
2010-05-06

COMPONENT HAVING A CERAMIC BASE THE SURFACE OF WHICH IS METALIZED

#65
20090194223
2009-08-06

LOW-TEMPERATURE SINTERING OF LANTHANUM STRONTIUM MANGANITE-BASED CONTACT PASTES FOR SOFCS

#66
20080017695
2008-01-24

Method of joining members having different thermal expansion coefficients

#67
20050145066
2005-07-07

Cubic boron nitride base ultra-high pressure sintered material cutting tip