99142 ⎘
Polycondensates containing more than one epoxy group per molecule ; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups; Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen Compounds containing one epoxy group
GLYCIDYL ETHER GROUP-CONTAINING COMPOUND, CURABLE RESIN COMPOSITION, CURED PRODUCT, AND LAMINATE
#2EPOXY RESIN COMPOSITION, LIQUID COMPRESSION MOLD MATERIAL, GLOB-TOP MATERIAL, AND SEMICONDUCTOR DEVICE
#3HARDENER FOR EPOXY RESINS
#4NOVEL COMPOUND, AND CURABLE RESIN COMPOSITION CONTAINING SAID COMPOUND
#5Encapsulating or filling composition for electronic devices and electronic apparatus
#6Coating composition
#7Preparation of modified epoxy acrylates and solder resist containing modified epoxy acrylates
#8Process of manufacturing polyols
#9Use of a composition of low-viscosity bis-anhydrohexitol ethers as a reactive diluent for crosslinkable resin, adhesive, coating and matrix compositions for composites
#10Anion exchange stationary phases based on crosslinked hydroxyalkylamine layer and glycidol
#11Base generator, reagent, organic salt, composition, method for manufacturing device, cured film and device
#12Waterborne damping composition
#13Toughening of epoxy thermosets
#14Cyclic siloxane compounds and compositions comprising the same
#15HARDENERS FOR COLD CURING EPOXY SYSTEMS
#16Epoxy resin compositions
#17Disulfide stabilized DVD-Ig molecules
#18COMPOSITION FOR FORMING SUBSTRATE, AND PREPREG AND SUBSTRATE USING THE SAME
#19Process for producing high-purity epoxy resin and epoxy resin composition