99146 ⎘
Polycondensates containing more than one epoxy group per molecule ; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups; Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen; Monocarboxylic acids, anhydrides, halides, or low-molecular-weight esters thereof; Unsaturated monoacids Fatty acids
AMINE ADDUCT
#2Two-Component Curable Composition and Cured Product
#3HYDROPHOBIC POLYOLS WITH ENHANCED HEAT RESISTANCE AND DUST CONTROL FOR FIBROUS MATERIALS
#4Polymerizable thermosetting resins from tall oil
#5Bio-based epoxy resins, compositions, and methods thereof
#6Immobilizing flexible stowage containers
#7MULTIFUNCTIONAL COATINGS FOR USE IN WET ENVIRONMENTS
#8Epoxy acrylic hybrid resins
#9Fiber-reinforced resin, process for producing same, and molded article
#10Adhesive viscoelastomer and its use in stabilized storage containers
#11Fiber-reinforced resin, process for producing same, and molded article
#12Low viscosity polyorganosiloxanes comprising quaternary ammonium groups, methods for the production and the use thereof
#13Cationic alkyd resins
#14Low viscosity polyorganosiloxanes comprising quaternary ammonium groups, methods for the production and the use thereof
#15MODIFIED EPOXIDE PRIMERS
#16Electrically conductive polymeric compositions, contacts, assemblies and methods
#17Composition of diepoxy resin modified with monofunctional organic material and dicarboxylic acid and crosslinker
#18Adhesive Composition for Semiconductor Device and Cover Lay Film, Adhesive Sheet, and Copper-Clad Polymide Film Made With the Same
#19SOLDER-RESISTANT FLEXIBLE THERMOSETTING EPOXY RESIN SYSTEM