Epoxy stabilization using substituted barbituric acids

LIQUID EPOXY RESIN COMPOSITION USEFUL FOR MAKING POLYMERS

High chemical resistant coating as protection against aggressive environment

Composition for coating the edge of an optical lens

CONDUCTIVE METAL RESIN MULTILAYER BODY AND MOLDED BODY OF SAME

Waterborne coating compositions

Resin composition for acoustic matching layer

ENCAPSULATING RESIN COMPOSITION FOR POWER DEVICE AND POWER DEVICE

ADHESIVE FOR ENDOSCOPE, CURED PRODUCT THEREOF, ENDOSCOPE, AND METHOD FOR MANUFACTURING THE SAME

Thermoset epoxy resin, its preparing composition and making process thereof

Structural bonding adhesive

Resin composition and article made therefrom

Two-part adhesive composition that undergoes a visual change when cured

RESIN COMPOSITION

Solvent-less ionic liquid epoxy resin

Functionalized graphene and epoxy composite

Recyclable and reworkable epoxy resins

Recyclable and reworkable epoxy resins

UV-curable composition and adhesive film, adhesive tape and bonding member containing the same

Thermosetting epoxy resin composition having low curing temperature and good storage stability

Epoxy resin

CURABLE ADHESIVE, BONDING FILM, AND METHOD OF BONDING THE SAME

ZINC-RICH WATERBORNE EPOXY COATING COMPOSITION AND METHODS

Epoxy resin composition for fiber-reinforced composite materials, epoxy resin cured product, preform and fiber-reinforced composite material

Curing agent composition for an epoxy resin compound, epoxy resin compound and multi-component epoxy resin system

CURABLE EPOXIDE COMPOSITION

Curing composition for an epoxy resin compound, epoxy resin compound and multi-component epoxy resin system

RESIST UNDERLAYER FILM-FORMING COMPOSITION

Resin composition for printed wiring board, prepreg, laminate, metal foil-clad laminate, printed wiring board, and multilayer printed wiring board

Curable two-component mass

Catalyst-doped sizing agent for preparation of high areal weight fiber shelf-stable prepreg or molding compound intermediates

Ductile one-component thermosetting epoxy composition

Adhesive composition

Adhesive composition

Fire-retardant resins and composite materials

THERMALLY CONDUCTIVE MATERIAL-FORMING COMPOSITION, THERMALLY CONDUCTIVE MATERIAL, THERMALLY CONDUCTIVE SHEET, DEVICE WITH THERMALLY CONDUCTIVE LAYER, AND FILM

ADHESIVE COMPOSITION, CURED PRODUCT, AND ARTICLE

AMINE FOR LOW-EMISSION EPOXY RESIN COMPOSITIONS

Photosensitive Resin Composition Cured Product Of Same

Corrosion-indicating materials and methods of making and using the same

Resin composition, cured product, laminate, and electronic member

Epoxy resin composition, prepreg and molded body

Epoxy resin composition for fiber-reinforced composite material, fiber-reinforced composite material, and production method thereof

Dispersant polymer and composition comprising the same

Anti-fatigue cold mixed epoxy resin material, preparation method and application thereof

IMPROVED CURATIVE COMPOSITION

TOUGHENED EPOXY COMPOSITIONS

Curable resin composition, cured product, and sheet-like formed body

Thermoplastic polymer-based composite material and preparation method thereof

COMPOSITION

Epoxy resin formulations

RESIN COMPOSITION, RESIN MEMBER, RESIN SHEET, B-STAGE SHEET, C-STAGE SHEET, METAL FOIL WITH RESIN, METAL SUBSTRATE, AND POWER SEMICONDUCTOR DEVICE

Method for strengthening of metal structures using toughened 2C-epoxy adhesives

Epoxy resin composition and cured object obtained therefrom

Two-part cyanoacrylate curable adhesive system

Composition of alkoxysilyl-functionalized epoxy resin and composite thereof

ONE COMPONENT THERMOSETTING EPOXY RESIN COMPOSITIONS

High temperature epoxy adhesive formulations

Method of preparing a latent hardener with improved storage stability through a dry surface treatment

Highly thermally conductive epoxy compound, and composition, material for semiconductor package, molded product, electric and electronic device and semiconductor package including the same

High-thermal conductive epoxy compound and composition, material for semiconductor package, molded product, electric and electronic device, and semiconductor package including the same

RESIN COMPOSITION, HYDROGEN GAS BARRIER MATERIAL, CURED PRODUCT, COMPOSITE MATERIAL, AND STRUCTURE

Epoxy resin, epoxy resin composition, epoxy resin cured product, and composite material

Methods of preparing compositions for containers and other articles and methods of using same

CONDUCTIVE COMPOSITION AND METHOD FOR FABRICATING MICRO LIGHT-EMITTING DIODE DISPLAY

Curable compositions and related methods

CURABLE COMPOSITION AND FIBER REINFORCED COMPOSITE MATERIAL

Thermally conductive resin composition

Epoxy resin system for structural composites

Quasicrystalline structures and uses thereof

Epoxy polymer, epoxy resin, epoxy resin composition, resin sheet, b-stage sheet, cured product, c-stage sheet, metal foil with resin, metal substrate and method for manufacturing

Cured epoxy resin material, epoxy resin composition, molded article, and composite material

Fast-cure resin formulations with consistent handling characteristics

Epoxy resin material, preparation method therefor and application thereof

MULTIFUNCTIONAL COATINGS FOR USE IN WET ENVIRONMENTS

Thermoplastic polyester resin composition and molded article

Coating compositions

Curable resin composition, adhesive agent, adhesive film, circuit substrate, interlayer insulating material, and printed wiring board

RESIN COMPOSITION AND CURED PRODUCT OF SAME, ADHESIVE FOR ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT

Epoxy resin, epoxy resin composition, epoxy resin cured product, and composite material

Photosensitizer and active energy ray-curable composition

EPOXY RESIN COMPOSITION

Light-fixable and heat-curing compounds based on epoxy resins and thiols

Epoxy resin, epoxy resin composition, epoxy resin cured product and method of producing epoxy resin cured product, composite material, insulating member, electronic appliance, structural material, and vehicle

Shape memory-based self-healing polymer composite reinforced with graphene foam

High temperature protective coating

COMPOSITIONS FOR CONTAINERS AND OTHER ARTICLES AND METHODS OF USING SAME

Thermal cycling resistant low density composition

CURABLE EPOXY COMPOSITIONS

Prepreg, fiber-reinforced composite material, and molded article

Heat-curing epoxy resin composition having high storage stability

Resin composition for reinforcement and electronic component device

Composition for curable resin, cured product of said composition, production method for said composition and said cured product, and semiconductor device

POLYETHERS CONTAINING NON-BISPHENOLIC CYCLIC GROUPS

THIOL-EPOXY BASED AEROGELS

Chemical products for adhesive applications

Hardener composition for epoxy resin based coating compositions, process for their preparation and use thereof

CURABLE COMPOSITION AND FIBER-REINFORCED COMPOSITE MATERIAL

Organofluorine modified epoxy resins for increasing surface flashover voltage, and preparation methods and applications thereof

COMPOSITION, THERMALLY CONDUCTIVE MATERIAL, DEVICE WITH THERMALLY CONDUCTIVE LAYER, AND METHOD FOR MANUFACTURING THERMALLY CONDUCTIVE MATERIAL

Thermoplastic polyoxazolidones from diisocyanates and diglycidyl ether of 2-phenyl- 1,3-propanediol derivaitives

RESIN COMPOSITION

Epoxy resin, epoxy resin composition, epoxy resin cured product, and composite material

Impregnation resin mixture

HARDENER COMPOSITION

EPOXY RESIN, EPOXY RESIN COMPOSITION, EPOXY RESIN CURED PRODUCT, AND COMPOSITE MATERIAL

Resin composition for acoustic matching layer, cured product, acoustic matching sheet, acoustic probe, acoustic measuring apparatus, method for producing acoustic probe, and acoustic matching layer material set

Epoxy resin composition, prepreg, and fiber-reinforced composite material

Epoxy resin, epoxy resin composition, epoxy resin cured product, and composite material

Photosensitive resin composition having improved adhesiveness or adhesion and light blocking layer using same

Epoxy resin composition, fiber reinforced composite material, molded article and pressure vessel

Epoxy resin composition, fiber reinforced composite material, molded article and pressure vessel

Curable epoxide composition

Electrodeposition system

Resin composition, resin film, semiconductor laminate, method for producing semiconductor laminate and method for producing semiconductor device

Thermadapt shape memory polymer and application method thereof

Latent curing accelerators

Curable composition

CATION-CURABLE RESIN COMPOSITION

FIRE RETARDANT GLASS FILLED POLYCARBONATE COMPOSITIONS

Epoxy resin, epoxy resin composition, epoxy resin cured product and composite material

Liquid resin composition for sealing and electronic component apparatus

Curable composition, curable paste material, curable sheet material, curable modeling material, curing method, and cured product

Liquid crystal aligning agent composition, method for producing liquid crystal alignment film using same, and liquid crystal alignment film using same

Flexible encapsulating material, process for preparing the same and encapsulating method using the same

LIQUID RESIN COMPOSITION FOR COMPRESSION MOLDING AND ELECTRONIC COMPONENT APPARATUS

STABLE EPOXY/INTERNAL MOLD RELEASE AGENT BLENDS FOR THE MANUFACTURE OF COMPOSITE ARTICLES

Renewable furan based amine curing agents for epoxy thermoset

EPOXY/THIOL RESIN COMPOSITIONS, METHODS, AND TAPES

Resin composition and cured resin composition

Epoxy resin composition, prepreg, fiber-reinforced composite material, and method for producing same

Epoxy resin composition

Insulating heat dissipation coating composition and insulating heat dissipation unit formed using the same

Thermally conductive material, device with thermally conductive layer, composition for forming thermally conductive material, and disk-like liquid crystal compound

Curable composition including epoxy resin and curable solid filler

MOLDED ARTICLE AND PRODUCTION METHOD THEREFOR

Epoxy resin composition, thermally-conductive material precursor, B-stage sheet, prepreg, heat dissipation material, laminate, metal substrate, and printed circuit board

Antimony free flame-retarded epoxy compositions

Use of a composition of low-viscosity bis-anhydrohexitol ethers as a reactive diluent for crosslinkable resin, adhesive, coating and matrix compositions for composites

Wave-absorbing impregnation glue liquid, wave-absorbing honeycomb, and preparation methods thereof

Curable epoxy resin composition, fiber-reinforced composite material and molded body using same

ADHESIVE COMPOSITION, COMPONENT, AND METHOD OF FORMING THE COMPONENT

RESIN COMPOSITION FOR VaRTM MOLDING, MOLDING MATERIAL, MOLDED ARTICLE AND METHOD FOR PRODUCING MOLDED ARTICLE

Epoxy resin adhesive with high compressive strength

Thermoset composite having thermoplastic characteristics

CATALYST-FREE CURABLE EPOXY COMPOSITIONS

Molding material and fiber-reinforced composite material

Epoxy stabilization using metal nanoparticles and nitrogen-containing catalysts, and methods

EPOXY RESIN, PRODUCTION METHOD, AND EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF

Epoxy resin, epoxy resin-containing composition and cured product thereof

Durable contamination resistant coatings

Resin composition and method of producing laminate

Photosensitive epoxy resin composition for formation of optical waveguide, curable film for formation of optical waveguide, optical waveguide produced by using the resin composition or the curable film, and hybrid flexible printed wiring board for optical/electrical transmission

Biomass-based epoxy resin and preparation method thereof

Electrical Insulation System Based on Epoxy Resins for Generators and Motors

RAPID CURING EPOXY-RESIN COMPOSITION FOR FIBER-MATRIX SEMIFINISHED PRODUCTS

Sheet-shaped prepreg

Method for producing a curing agent for low-emission epoxy resin compositions

CURABLE COMPOSITION, CURED PRODUCT THEREOF, AND ROTARY DEVICE

RESIN COMPOSITION, PREPREG, METAL FOIL-CLAD LAMINATE, RESIN SHEET, AND PRINTED WIRING BOARD

Epoxy tannin reaction product compositions

High heat monomers and methods of use thereof

LOW DIELECTRIC CONSTANT POROUS EPOXY-BASED DIELECTRIC

RESIN COMPOSITION, MOLDED ARTICLE, LAMINATE, COATING MATERIAL, AND ADHESIVE

Epoxy resin composition, cured product and composite material

Epoxy Compositions and Methods of Use

Coatings

Production methods for glassy liquid-crystalline epoxy resin and glassy liquid-crystalline epoxy resin composition, storage methods for liquid-crystalline epoxy resin and liquid-crystalline epoxy resin composition, glassy liquid-crystalline epoxy resin and glassy liquid-crystalline epoxy resin composition, liquid-crystalline epoxy resin and liquid-crystalline epoxy resin composition, and production method for cured epoxy resin

Thermosetting epoxy resin composition for the preparation of articles for electrical engineering, and the articles obtained therefrom

REINFORCED DYNAMICALLY CROSSLINKED POLYESTER NETWORK

Curing agent for epoxy resins

Curing agent for epoxy resins

Fast-curing epoxy systems

Fast-curing epoxy systems

Fast-curing epoxy systems

RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD AND INTEGRATED CIRCUIT PACKAGE, AND PRODUCT USING THE SAME

Method for coating boron

Resin composition and method of producing laminate

Epoxy resin, epoxy resin composition, epoxy resin cured product, and composite material

Method for reducing the permeability of a subterranean formation to aqueous-based fluids

Curable resin composition, and film, molded article, prepreg, and fiber-reinforced plastic using said curable resin composition

CURING AGENT COMPOSITIONS FOR THERMOSETTING EPOXY RESIN COMPOSITIONS

ROOM TEMPERATURE IONIC LIQUID CURING AGENT

HIGH HEAT THERMOSET EPOXY COMPOSITIONS

Semiconductor-encapsulating epoxy resin composition and semiconductor device

Process for frontal polymerization of cationically polymerizable monomers

Method for preparing fluorine-silicon-containing polyphosphate ester and flame retardant epoxy resin

Epoxy resin, epoxy resin composition, epoxy resin cured product, and composite material

Curable composition

Solvent-less ionic liquid epoxy resin

Approach to heat expandable materials

Phosphorus-nitrogen-silicon-containing polymeric flame retardant and preparation method and application thereof

Curable composition

HIGH HEAT COMPOSITE COMPOSITIONS, ARTICLES, AND USES THEREOF

Resin composition, sheet-shaped laminated material, printed wiring board, and semiconductor device

HOMOGENEOUS AMORPHOUS HIGH HEAT EPOXY BLEND COMPOSITE COMPOSITIONS, ARTICLES, AND USES THEREOF

Epoxy resin composition and structure

WATER SOLUBLE ALPHA-GLYCOL SULFONATED EPOXY RESIN COMPOSITION AND PROCESS FOR PREPARING THE SAME

Epoxy resin, epoxy resin composition, inorganic filler-containing epoxy resin composition, resin sheet, cured product, and epoxy compound

Prepreg and fiber-reinforced composite material

Epoxy resin

Quasicrystalline structures and uses thereof

Rubber composition comprising an epoxide resin and a specific amine hardener

GAS BARRIER MATERIAL, RESIN COMPOSITION, GAS BARRIER MEMBER, CURED PRODUCT, AND COMPOSITE MATERIAL

Electrical Insulation System Based on Epoxy Resins for Generators and Motors

LIGHT-FIXABLE CASTING COMPOSITION AND METHOD OF SELECTIVELY CASTING SUBSTRATES/COMPONENTS USING THE COMPOSITIONS

BIORENEWABLE EPOXY RESINS DERIVED FROM PHENOLIC ACIDS

Resin composition and method for manufacturing thermally conductive material

Dental composition

Epoxy resin, production method, epoxy resin composition and cured product of same

COMPOSITION FOR RECOVERING HYDROCARBON FLUIDS FROM A SUBTERRANEAN RESERVOIR

Wetting agents and dispersants having rheological character

TWO-PACK EPOXY RESIN COMPOSITON FOR FIBER-REINFORCED COMPOSITE MATERIAL, AND FIBER-REINFORCED COMPOSITE MATERIAL

LOW-VISCOSITY EPOXY RESINS AND LOW VOC CURABLE FORMULATIONS THEREFROM

Thermosetting resin composition, prepreg, fiber-reinforced plastic molded body and method for producing same

Epoxy (meth) acrylate compound and curable composition containing same

Outdoor electrical apparatus having an outer housing arranged to selectively encase a main encapsulant

KITS FOR MAKING RECYCLABLE COVALENTLY CROSSLINKED POLYMER NETWORKS, RECYCLABLE COMPOSITES, AND RELATED METHODS OF MAKING RECYCLABLE COMPOSITES AND RECYCLING COMPOSITES

Packaging material and film

Epoxy resin curing agent, epoxy resin composition, and carbon fiber-reinforced composite material

Surface-modified inorganic nitride, composition, thermally conductive material, device with thermally conductive layer, and method for manufacturing surface-modified inorganic nitride

Coating compositions, elastic barrier coatings formed therefrom, and methods of applying such coatings

Process for preparing epoxy resins

A Process for the Preparation of Insulation Systems for Electrical Engineering, the Articles Obtained Therefrom and the Use Thereof

Fiber-containing resin substrate, encapsulated semiconductor devices mounting substrate, encapsulated semiconductor devices forming wafer, encapsulated semiconductor devices mounting sheet, semiconductor equipment, and method for manufacturing semiconductor equipment

Thermosetting epoxy resin sheet for encapsulating semiconductor, semiconductor equipment, and method for manufacturing the same

Epoxy resin molding material, molded product, molded cured product, and method for producing molded cured product

Bisphenol having fluorene skeleton, method for producing same, polyarylate resin, (meth)acrylate compound and epoxy resin which are derived from the bisphenol

Methods of preparing compositions for containers and other articles and methods of using same

Epoxy resin composition, semi-cured epoxy resin composition, cured epoxy resin composition, molded article, and cured molded article

Curable composition, cured film, display panel or OLED light, and method for producing cured product

Liquid epoxy resin composition useful for making polymers

Anisotropic conductive film

Liquid crystal display device and method for manufacturing liquid crystal display device

METHODS FOR COATING INNER SURFACES OF PIPES AND COATD PIPES FORMED THEREBY

Varnish, prepreg, film with resin, metal foil-clad laminate, and printed circuit board

Amine for low-emission epoxy resin compositions

Liquid composition for a waterproofing membrane

Process for producing aluminum-chelate-based latent curing agent, and thermosetting epoxy resin composition

Adhesive compositions

Composition, laminate, method of manufacturing laminate, transistor, and method of manufacturing transistor

Curable composition, cured product, cured film, display panel, and method for producing cured product

Curable composition, cured film, display panel, and method for producing cured product

Curing agent for epoxy resins, and epoxy resin composition obtained using same

Antimony-free radiation curable compositions for additive fabrication, and applications thereof in investment casting processes

Controlled glass transition polymeric material and method

FAST CURE EPOXY COMPOSITION FOR USE IN HIGH THROUGHPUT MANUFACTURING PROCESSES

Epoxy resin composition, epoxy resin cured product, prepreg and fiber-reinforced composite material

Photosensitive and via-forming circuit board

CURABLE COMPOSITION, ADHESIVE, ARTICLE HAVING COATING LAYER, FIBER-REINFORCED COMPOSITE MATERIAL, POTTING AGENT AND CURABLE COMPOSITION KIT

Curable composition and cured product from same

Formulation methodology for distortional thermosets

Resist underlayer composition, and method of forming patterns using the composition

Amine-catalyzed thiol-curing of epoxy resins

Epoxy resin, epoxy resin composition, cured product and electrical or electronic component

Curable composition and cured product from same

Reaction-curable adhesive, adhesive kit, and method of using reaction-curable adhesive

METHODS OF FORMING DYNAMIC CROSS-LINKED POLYMER COMPOSITIONS

Display device and method for manufacturing the same

Use of oligo-N,N-bis(3-aminopropyl)methylamine as curing agent for epoxy resins

Epoxy resin composition, fiber reinforced composite material, molded article, and pressure vessel

APCHA as a building block in curing agent formulations for structural adhesives

Epoxy two-part formulations

Epoxy resin composition, thermally-conductive material precursor, B-stage sheet, prepreg, heat dissipation material, laminate, metal substrate, and printed circuit board

Coating composition and coating panel

Mold resistant formable cork

RESINS AND COMPOSITIONS FOR HIGH TEMPERATURE APPLICATIONS

METHOD FOR THE RUBBER MODIFICATION OF THERMOSETTING RESINS

USE OF DYNAMIC CROSS-LINKED POLYMER COMPOSITIONS IN SOLDERING APPLICATIONS

LIQUID EPOXY RESIN COMPOSITION

Cyclic carbonates

Method of lining a pipeline with a delayed curing resin composition

Use of certain polymers as a charge store

UNIDIRECTIONAL PREPREG, FIBER-REINFORCED THERMOPLASTIC RESIN SHEET, MANUFACTURING METHODS OF UNIDIRECTIONAL PREPREG AND FIBER-REINFORCED THERMOPLASTIC RESIN SHEET, AND MOLDED BODY

Cold curing epoxy resin primer or adhesive

Epoxy resin powder coating material

Amine for rapid-curing epoxy resin compositions

Resin composition, copper clad laminate and printed circuit board using same

Composition for optical stereolithography and method for producing stereolithographic object using the same

HEAT-CURABLE EPOXY RESIN COMPOSITION

Epoxy resin composition, prepreg, and carbon fiber-reinforced composite material

FLAME-RETARDANT RESIN COMPOSITION, THERMOSETTING RESIN COMPOSITION, FLAME-RETARDANT ENGINEERING PLASTIC AND COMPOSITE METAL SUBSTRATE

Treated porous material

Thermosetting resin composition, cured film, substrate with cured film, and electronic component

CATALYTIC SYSTEMS FOR THERMOSETTING RESINS WHICH ARE DEFORMABLE IN THE THERMOSET STATE

Reinforced building block made of autoclaved aerated concrete (AAC)

COMPOSITION COMPRISING A POLYMER BASED ON EPOXIDE COMPOUNDS

EPOXY RESIN COMPOSITION COMPRISING 2-(3,3,5-TRIMETHYLCYCLOHEXYL)PROPANE-1,3-DIAMINE AS HARDENER

Epoxy resin, epoxy resin composition, inorganic filler-containing epoxy resin composition, resin sheet, cured product, and epoxy compound

Fast cure epoxy resins and prepregs obtained therefrom

Electrodeposition system

Heat curable resin composition, and circuit board with electronic component mounted thereon

Epoxy resin composition and fiber reinforced composite material

Degradable resin composition, and prepreg, laminate and copper clad laminate using same, and degrading method thereof

CURABLE EPOXY COMPOSITION AND FILM, LAMINATED FILM, PREPREG, LAMINATE, CURED ARTICLE, AND COMPOSITE ARTICLE OBTAINED USING SAME

Surfactant composition

EPOXY RESIN COMPOSITION, CURED RESIN, PREPREG AND FIBER-REINFORCED COMPOSITE MATERIAL

Suspension polymerization compositions, methods and uses thereof

Preparation of thermoplastic epoxidized polymers and thermosetting materials from triglycerides

Epoxy resin composition for fiber-reinforced composite material, prepreg and fiber-reinforced composite material