CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF

POROSITY-FREE PHENOLIC EPOXIES

Curable Resin Composition and Adhesive Composition

RENEWABLE BIO-BASED, NON-TOXIC AROMATIC-FURANIC MONOMERS FOR USE IN THERMOSETTING AND THERMOPLASTIC POLYMERS

GLYCIDYL ETHER GROUP-CONTAINING COMPOUND, CURABLE RESIN COMPOSITION, CURED OBJECT, AND LAMINATE

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, PHOTOSENSITIVE DRY FILM, AND PATTERN FORMATION METHOD

PROTECTIVE-FILM FORMING COMPOSITION

PROTECTIVE FILM FORMING COMPOSITION

RESIST UNDERLAYER FILM-FORMING COMPOSITION CONTAINING TERMINATED POLYMER

CHEMICAL-RESISTANT PROTECTIVE FILM FORMING COMPOSITION CONTAINING HYDROXYARYL-TERMINATED POLYMER

BIOMASS EPOXY RESIN COMPOSITION AND METHOD OF FORMING THE SAME AND OLIGOMER

CURED PRODUCT OF RESIN COMPOSITION, LAMINATE, AND RESIN COMPOSITION

NEW USE OF ISOSORBIDE

Cryogenic Elastomer from Ionic Liquid Epoxy

EPOXY COMPOUND, COMPOSITION PREPARED THEREFROM, SEMICONDUCTOR DEVICE PREPARED THEREFROM, ELECTRONIC DEVICE PREPARED THEREFROM, ARTICLE PREPARED THEREFROM, AND METHOD OF PREPARING ARTICLE

HEM FLANGE BONDING METHOD

OLIGOMERIC EPOXY PRE-POLYMERS COMPRISING ISOSORBIDE UNITS

AROMATIC DIOL COMPOUNDS, DIEPOXIDE COMPOUNDS, POLYMERS PREPARED FROM SUCH COMPOUNDS, AND METHODS FOR MAKING THE SAME

PREPREG, MOLDED ARTICLE AND EPOXY RESIN COMPOSITION

DIMERS FROM BIOREACHABLE MOLECULES AS COPOLYMERS

Safe, Environmentally Friendly and Controllable Method for Preparing Cycloaliphatic Diepoxides

METHOD FOR PRODUCING POLYMER

COMPOSITION FOR FORMING RESIST UNDERLAYER FILM

WATER-BASED HYDROGEL, AND REACTION PRODUCT OF ISOSORBIDE EPOXIDE AND AMINES

Bio-based diols from sustainable raw materials, uses thereof to make diglycidyl ethers, and their coatings

RESIST UNDERLAYER FILM-FORMING COMPOSITION CONTAINING HETEROCYCLIC COMPOUND

PREPREG, PREPREG LAMINATE, AND FIBER-REINFORCED COMPOSITE MATERIAL

Chemical-resistant protective film forming composition containing hydroxyaryl-terminated polymer

Composition for curable resins, cured product of said composition, production method for said composition and said cured product, and semiconductor device

METHOD FOR PRODUCING POLYMER

CHEMICAL SOLUTION-RESISTANT PROTECTIVE FILM FORMING COMPOSITION CONTAINING POLYMERIZATION PRODUCT HAVING DIOL STRUCTURE AT TERMINAL THEREOF

PULTRUSION WITH EXTRUDED GASKET FOAM

Epoxy compound, composition prepared therefrom, semiconductor device prepared therefrom, electronic device prepared therefrom, article prepared therefrom, and method of preparing article

RESIN COMPOSITION, OPTICAL SEMICONDUCTOR ELEMENT, AND OPTICAL SEMICONDUCTOR DEVICE

Epoxy composition

Resist underlayer film-forming composition and method for forming resist pattern using the same

RENEWABLE BIO-BASED NON-TOXIC AROMATIC-FURANIC MONOMERS FOR USE IN THERMOSETTING AND THERMOPLASTIC POLYMERS

RESIN COMPOSITIONS AND RESIN INFUSION PROCESS

CURABLE ADHESIVE, BONDING FILM, AND METHOD OF BONDING THE SAME

RESIST UNDERLYING FILM-FORMING COMPOSITION COMPRISING A REACTION PRODUCT WITH A GLYCIDYL ESTER COMPOUND

TOUGHENED EPOXY COMPOSITIONS

Epoxy resin composition and cured object obtained therefrom

Epoxy-fiber reinforced composites, method to form the composites and epoxy resin composition used therefor

High-thermal conductive epoxy compound and composition, material for semiconductor package, molded product, electric and electronic device, and semiconductor package including the same

Cured product of resin composition, laminate, and resin composition

Composition for curable resin, cured product of said composition, production method for said composition and said cured product, and semiconductor device

POLYETHERS CONTAINING NON-BISPHENOLIC CYCLIC GROUPS

Use of isosorbide

COMPOSITION, THERMALLY CONDUCTIVE MATERIAL, DEVICE WITH THERMALLY CONDUCTIVE LAYER, AND METHOD FOR MANUFACTURING THERMALLY CONDUCTIVE MATERIAL

HIGH HEAT AND HIGH TOUGHNESS EPOXY COMPOSITIONS, ARTICLES, AND USES THEREOF

Lactide copolymers and ring-opened lactide copolymers

Thermal-curable resin composition, and pre-preg, metal-clad laminate and printed circuit board manufactured using the same

Prepreg and molding product thereof

Biomass-based epoxy resin and preparation method thereof

CURABLE COMPOSITION, CURED PRODUCT THEREOF, AND ROTARY DEVICE

HIGH HEAT THERMOSET EPOXY COMPOSITIONS

HIGH HEAT COMPOSITE COMPOSITIONS, ARTICLES, AND USES THEREOF

HOMOGENEOUS AMORPHOUS HIGH HEAT EPOXY BLEND COMPOSITE COMPOSITIONS, ARTICLES, AND USES THEREOF

Prepreg, prepreg laminate, and fiber-reinforced composite material

Photosensitive adhesive composition

Curable composition, cured product, optical member, lens, and compound

Lactide copolymers and ring-opened lactide copolymers

Resin compositions and resin infusion process

EPOXY-FIBER REINFORCED COMPOSITES, METHOD TO FORM THE COMPOSITES AND EPOXY RESIN COMPOSITION USED THEREFOR

Molding compound having randomly oriented filaments and methods for making and using same

FAST CURE EPOXY COMPOSITION FOR USE IN HIGH THROUGHPUT MANUFACTURING PROCESSES

Lactide copolymers and ring-opened lactide copolymers

Method of forming of a robust network of epoxy material through Diels-Alder reaction

Highly functional natural material-derived epoxy resin, preparation method therefor, and epoxy resin curing composition using same

Thermal expandability adjuster, use as thermal expandability adjuster, thermoset resin composition, insulating material, sealing material and conductive paste each containing thermoset resin composition, cured products, prepreg and member obtained by curing thermoset resin composition of prepreg, method of adjusting thermal expansion rate, and member manufactured using method of adjusting

Epoxy resin composition, prepreg and laminate prepared therefrom

RESIN COMPOSITION, PREPREG, METAL FOIL-CLAD LAMINATE, RESIN SHEET, AND PRINTED WIRING BOARD

ISOCYANATE-MODIFIED EPOXY RESIN AND USES THEREOF

HIGHLY FUNCTIONAL NATURAL MATERIAL-DERIVED EPOXY RESIN, PREPARATION METHOD THEREFOR, AND EPOXY RESIN CURING COMPOSITION USING SAME

Composition for antifogging coating and coating film including the antifogging coating

METHOD FOR PRODUCING COMPOSITIONS OF FURAN GLYCIDYL ETHERS, COMPOSITIONS PRODUCED AND USES OF SAME

Polyethers containing non-bisphenolic cyclic groups

Process for producing isohexide glycidyl ethers, products thus obtained, and uses thereof

Epoxy compound, epoxy resin, curable compound, cured product thereof, semiconductor sealing material, and printed circuit board

Modified hyaluronate hydrophilic compositions, coatings and methods

Epoxy resin composition, and film, prepreg, and fiber-reinforced plastic using same

Polymer and composition including same, and adhesive composition

Alkali-soluble resin, photosensitive resin composition for color filter containing the same and uses thereof

CURABLE EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF, DIOLEFIN COMPOUND AND PRODUCTION METHOD THEREFOR, AND PRODUCTION METHOD FOR DIEPOXY COMPOUND

Isosorbide-derived epoxy resins and methods of making same

EPOXY COMPOUND, PRODUCTION METHOD THEREFOR, AND CURABLE EPOXY RESIN COMPOSITION

Core shell rubber modified solid epoxy resins

Composites comprising novel RTIL-based polymers, and methods of making and using same

Epoxy-resin composition and film, prepreg, and fiber-reinforced plastic using same

Oxirane-containing bisanhydrohexitol derivatives and uses thereof

Curable composition, cured product, and organic electroluminescent element using same

Curable epoxy resin composition

Furan-based curable compound derived from biomass, solvent-free curable composition, and method for preparing same

Polyoxazolidone resins

FIBER-REINFORCED COMPOSITE MATERIAL

Polymer compositions, method of manufacture, and articles formed therefrom

Light-curing resin composition and optical material

Resin composition and organic-electrolyte battery

Varnish composition, and pre-impregnated manufacture thereof

INPUT DEVICE

Soluble imide skeleton resin, soluble imide skeleton resin solution composition, curable resin composition, and cured product thereof

Ionic liquid epoxy resin monomers

INPUT DEVICE

Ionic liquid epoxy resins

Epoxy resin curing composition

Resin composition, prepreg, laminate, and wiring board

Thermoset epoxy polymers from renewable resources

Sulfonate-containing anti-reflective coating forming composition for lithography

Polymers, polymer compositions, and method of preparation

Epoxy compound and cured epoxy resin product

Compound containing epoxide and maleimide groups, cured resin prepared from said compound

Methods of curing ionic liquid epoxy mixtures