99170 ⎘
Polycondensates containing more than one epoxy group per molecule ; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used; Epoxy compounds containing three or more epoxy groups obtained by polymerisation of unsaturated mono-epoxy compounds
EPOXY RESIN COMPOSITION FOR RESIN TRANSFER MOLDING, CURED RESIN PRODUCT, FIBER-REINFORCED COMPOSITE MATERIAL, AND METHOD FOR MANUFACTURING SAME
#2STRETCHABLE RESIN COMPOSITION, AND RESIN SHEET MATERIAL, METAL FOIL WITH RESIN, METAL-CLAD LAMINATE, AND WIRING BOARD EACH INCLUDING OR OBTAINED USING SAME
#3Encapsulant composition for use with electrical components in hard disk drives, and related electrical components and hard disk drives
#4Pendant epoxide polymers and methods of treating subterranean formations
#5Method for synthesis of polymer containing multiple epoxy groups
#6Flexible wiring board and use thereof
#7Epoxy resin composition, fiber-reinforced composite material, and method for producing the same
#8Curable composition for hard disk drive
#9Pressure-sensitive adhesives with acid-epoxy crosslinking systems
#10ONE-PACK TYPE RESIN COMPOSITION FOR USE IN BACKING
#11RESIN COMPOSITION, POLYMER, CURED FILM AND ELECTRONIC PART
#12DIE-BONDING FILM AND USE THEREOF
#13Inkjet composition for forming transparent film and preparation method thereof
#14PHOTOSENSITIVE ADHESIVE COMPOSITION HAVING ALKALI SOLUBLE EPOXY RESIN, AND PATTERNABLE ADHESIVE FILM USING THE SAME
#15Sheet for forming hard coating
#16Cationically polymerizable resin composition and cured object obtained therefrom
#17EPOXY RESIN COMPOSITION, FIBER-REINFORCED COMPOSITE MATERIAL, AND METHOD FOR PRODUCING THE SAME
#18ADHESIVE COMPOSITION, BONDING MEMBER USING THE ADHESIVE COMPOSITION, SUPPORT MEMBER FOR SEMICONDUCTOR MOUNTING, SEMICONDUCTOR DEVICE, AND PROCESSES FOR PRODUCING THESE
#19POLYFUNCTIONAL EPOXY OLIGOMERS
#20LIQUID ACRYLIC ELASTOMER
#21Adhesive Sheet for Dicing and Die Bonding
#22Graphitic-carbon-nanofiber/polymer brushes as gas sensors
#23Adhesive Sheet For Both Dicing And Die Bonding And Semiconductor Device Manufacturing Method Using The Adhesive Sheet
#24Thermoplastic resin composition having improved impact resistance, color development and good flame-retardance
#25Paint compositions and coating film forming method
#26Two Packages Type Thermosetting Resin Composition, Film Forming Method and Coated Article
#27Copolymer and Medical Device with the Copolymer
#28Polymers comprising polyhydric alcohols, medical devices modified with same, and method of making
#29Composition of carboxyl acryl resin and epoxy acryl resin
#30Conductive adhesive composition
#31Curable composition
#32Resin composition for encapsulating semiconductor chip and semiconductor device therewith