POLYURETHANE-ACETOACETATE COMPOUNDS

ELECTROCONDUCTIVE RESIN COMPOSITION AND CURED PRODUCT THEREOF

CHEMICAL-RESISTANT PROTECTIVE FILM-FORMING COMPOSITION HAVING CATECHOL GROUP

CURING AGENT CAPABLE OF IMPROVING STORAGE LIFE, METHOD FOR PRODUCING THE SAME, AND CURABLE RESIN COMPOSITION USING THE SAME

EMULSION-TYPE EPOXY RESIN COMPOSITION, METHOD FOR PRODUCING SAME, AND COATING MATERIAL

CLATHRATE COMPOUND, EPOXY RESIN CURING AGENT, AND CURABLE RESIN COMPOSITION

THERMOSETTING MATERIAL FOR USE IN A 3D PRINTING PROCESS

COPOLYMER, RESIN, AND COMPOSITE MATERIAL

CURABLE COMPOSITIONS CONTAINING ISOCYANATE-BASED TOUGHENERS

THERMOSETTING MATERIAL FOR USE IN ADDITIVE MANUFACTURING

Curing agent composition based on diaminomethylcyclohexane and 1,3-cyclohexanebis(methylamine) for an epoxy resin composition, epoxy resin composition, and multi-component epoxy resin system

CURING CATALYST, RESIN COMPOSITION, SEALING MATERIAL, ADHESIVE AND CURED PRODUCT

CURABLE COMPOSITION, CURED PRODUCT, FIBER REINFORCED COMPOSITE MATERIAL, AND MOLDED ARTICLE AND METHOD FOR PRODUCING SAME

BORON NITRIDE POWDER AND RESIN COMPOSITION

Resin composition for printed wiring board, prepreg, laminate, metal foil-clad laminate, printed wiring board, and multilayer printed wiring board

ADHESIVE COMPOSITION, CURED PRODUCT, AND ARTICLE

Anti-fatigue cold mixed epoxy resin material, preparation method and application thereof

Adhesion promoters for curable compositions

Multicomponent epoxide resin composition and curing agent component therefor

Or relating to curing agents

Liquid compression molding or encapsulant compositions

Phenalkamine epoxy curing agents from methylene bridged poly(cyclohexyl-aromatic) amines and epoxy resin compositions containing the same

Curing agent composition and curing agent coating formula thereof

CURABLE COMPOSITIONS CONTAINING ISOCYANATE-BASED TOUGHENERS

Resin spacer for chip stacking and packaging and preparation method thereof

High temperature protective coating

Impregnation resin mixture

Epoxy resin composition, prepreg, and fiber-reinforced composite material

Thermally conductive material, device with thermally conductive layer, composition for forming thermally conductive material, and disk-like liquid crystal compound

Epoxy resin composition, molding material, and fiber-reinforced composite material

RESIN COMPOSITION, PREPREG, METAL FOIL-CLAD LAMINATE, RESIN SHEET, AND PRINTED WIRING BOARD

Resin composition, method for producing resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board

Resin composition, and pre-preg, metal-clad laminate and printed circuit board prepared using the same

Chemically decomposable epoxide resin system

Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed circuit board

Thermosetting resin composition, and prepreg and substrate using same

Repositionable, moisture-curing adhesive tape

Two-component epoxy resin paint

Reactive epoxy compounds and method for producing the same, core-shell type epoxy resin particles, waterborne epoxy resin composition, and coating composition containing the reactive epoxy compounds

Anisotropic conductive film

FLAME-RETARDANT, HIGH TEMPERATURE RESISTANT THERMOSETS ON THE BASIS OF NAPHTHALENE-BASED EPOXY RESINS AND CYANATE ESTERS

EPOXY CURATIVE COMPOSITION AND COMPOSITIONS THEREFROM

Fluxing underfill compositions

Resin composition, prepreg, metal foil-clad laminate, and printed circuit board

Curable benzoxazine compositions

MONOMERIC AND OLIGOMERIC RESINS FOR ONE DROP FILL SEALANT APPLICATION

Halogen-free thermosetting resin composition, prepreg, laminate and printed circuit board comprising the same

Resin composition, and prepreg, metal-clad laminate, and printed circuit board prepared using the same

Adhesive material, and method of use thereof

Heat curable resin composition, and circuit board with electronic component mounted thereon

Resin composition for printed wiring board, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board

Carbon fibre-containing prepregs

Halogen-free epoxy resin composition, prepreg, laminate and printed circuit board containing the same

Optical semiconductor element mounting substrate and optical semiconductor device using thermosetting resin composition for light reflection

Storage stable heat activated quaternary ammonium catalysts for epoxy cure

Flame-retardant, high temperature resistant thermosets on the basis of naphthalene-based epoxy resins and cyanate esters

Chemically Decomposable Epoxide Resin System

Pyridiniuivi-based compound, epoxy resin composition comprising same, and apparatus manufactured using same

Method of preparing accelerator, curing agent and diluent and applying the same to eliminate amine blushing and amine blooming

DEGRADABLE HYDRAZONE CURING AGENTS AND APPLICATIONS THEREOF

Degradable hydrazone curing agents and applications thereof

Thermosetting resin composition, prepreg, metal clad laminate plate, and printed wiring board

Semicarbazide composition, method for producing semicarbazide composition, aqueous polymer composition and composite

Resin composition, prepreg, metal foil-clad laminate and printed wiring board

Curable resin composition, resin composition, resin sheet formed by using said curable resin composition and resin composition, and cured materials thereof

Liquid hardeners for hardening epoxide resins (I)

Liquid hardeners for hardening epoxide resins (II)

Halogen free benzoxazine based curable compositions for high Tapplications

Oxazolidone ring containing adducts

Fiber-reinforced composite material

Formulated benzoxazine based system for transportation applications

Resin composition for printed wiring board material, and prepreg, resin sheet, metal foil clad laminate, and printed wiring board using same

Epoxy-vinyl copolymerization type liquid resin composition, cured product of the same, electronic/electric apparatus using the cured product, and method of producing the cured product

EPOXY CURATIVE COMPOSITION AND COMPOSITIONS THEREFROM

Alkyl or dialkyl-semicarbazone as a hardener for epoxy resin

Resin composition, prepreg, and laminate

Resin composition, prepreg and resin sheet and metal foil-clad laminate

Resin composition, and prepreg as well as laminate using the same

Curable resin composition and cured product thereof

Cyanate ester compound, curable resin composition containing cyanate ester compound, and cured product thereof

Resin composition, and prepreg and laminated sheet using the same

Preliminary-cured material, roughened preliminary-cured material, and laminated body

SOLDER RESIST COMPOSITION, BOARD FOR PACKAGE COMPRISING SOLDER RESIST OPENING USING THE COMPOSITION, AND METHOD FOR PREPARING THE BOARD FOR PACKAGE

Semicarbazones as accelerators for curing epoxy resins

RESIN COMPOSITION, PREPREG, AND LAMINATED SHEET

Curable compositions, processes for using such compositions to prepare composites and processes for preparing composites having superior surface finish and high fiber consolidation

Epoxy resin curing agent, epoxy resin composition, and adhesive agent for laminate

MOLDING MATERIAL HAVING VIBRATION-DAMPING PROPERTY AND MOLDED ARTICLE

Thermoplastic-toughened cyanate ester resin composites with low heat release properties

Compositions having phosphorus-containing compounds

Solventless one liquid type cyanate ester-epdxy composite resin composition

Curable compositions

Adhesive for semiconductor bonding, adhesive film for semiconductor bonding, method for mounting semiconductor chip, and semiconductor device

Oxazolidone ring containing adducts

Composition for formation of cured epoxy resin, and cured products thereof

Resin composition and organic-electrolyte battery

PLASTIC MOLDING MATERIAL AND METHOD FOR PRODUCING IT

Aqueous cross-linking compositions and methods

One liquid type cyanate ester-epoxy composite resin composition

Resin Composition, and Prepreg and Printed Circuit Board Prepared Using the Same

Liquid monobenzoxazine based resin system

Catalysis of epoxy resin formulations

Clathrate, curing agent, cure accelerator, epoxy resin composition, and epoxy resin composition for encapsulation of semiconductor

BENZOXAZINE RESIN COMPOSITION

HOMOGENEOUS BISMALEIMIDE - TRIAZINE - EPOXY COMPOSITIONS USEFUL FOR THE MANUFACTURE OF ELECTRICAL LAMINATES

Thermoplastic-toughened cyanate ester resin composites with low heat release properties

THERMOSETTING COMPOSITION

Curable resin compositions useful as underfill sealants for use with low-k dielectric-containing semiconductor devices

Curing agents and process for their manufacture

Curable reaction resin system

Varnish, prepreg, and substrate thereof

One liquid type cyanate-epoxy composite resin composition

Epoxy resin composition, prepreg, metal-clad laminate, printed wiring board and semiconductor device

Thickeners

Filling foam composition and foam filling member

Halogen-free benzoxazine based curable compositions for high TG applications

Curing composition and cured product prepared by using the same

Fast curable epoxy compositions containing imidazole- and 1-(aminoalkyl) imidazole-isocyanate adducts

Fast Curable Epoxy Compositions Containing Imidazole- And 1-(Aminoalkyl) Imidazole-Isocyanate Adducts

DIMETHYLFORMAMIDE-FREE FORMULATIONS USING DICYANADIAMIDE AS CURING AGENT FOR THERMOSETTING EPOXY RESINS

Curable compositions for advanced processes, and products made therefrom

Epoxy-amine composition modified with hydroxyalkyl urethane

EPOXY RESIN COMPOSITION, PREPREG USING THE EPOXY RESIN COMPOSITION, METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD

Epoxy resin composition, prepreg, fiber-reinforced composite material

CURABLE COMPOSITIONS CONTAINING ISOCYANATE-BASED TOUGHENERS

Inclusion complex containing epoxy resin composition for semiconductor encapsulation

Process for preparing a self-healing composite material

Thermosetting resin composition for light reflection, method for manufacturing the resin composition and optical semiconductor element mounting substrate and optical semiconductor device using the resin composition

CURATIVES FOR EPOXY ADHESIVE COMPOSITIONS

Hot-curing epoxy resin compositions that can be used as bodyshell adhesive or structural foam

Resin composition, prepreg, laminated board, multilayer printed wiring board and semiconductor device

METHODS FOR PREPARING TOUGHENED EPOXY POLYMER COMPOSITE SYSTEMS

Epoxy resin curing composition

Epoxy resin composition and semiconductor device

TOUGHENED BINDER COMPOSITIONS FOR USE IN ADVANCED PROCESSES

CURABLE EPOXY RESIN COMPOSITION AND LAMINATES MADE THEREFROM

Hardenable resin composition

Resin composition, prepreg and laminate using the same

Thermosetting Resin Composition, And Laminate and Circuit Substrate Using Same

Method of stabilizing metal pigments against gassing

Coating powder of epoxy resin, styrene-maleimide curing agent and a second curing agent

Resin composition, resin-attached metal foil, base material-attached insulating sheet and multiple-layered printed wiring board

Epoxy resin with dibasic acid (methyl ester)/ethyleneurea modifier

Two-component adhesive for producing semi-finished products and composite sandwich materials

WELDABLE COATING COMPOSITIONS, SUBSTRATES AND RELATED METHODS

Resin composition, prepreg and metal-foil-clad laminate

Thermosetting resin composition and its article

Solid thermally expansible material

Curable compositions for advanced processes, and products made therefrom

Highly elastic epoxy resin composition

Composition of polycyanate ester and biphenyl epoxy resin

Method of stabilizing metal pigments against gassing

Self-dispersing, hardenable epoxy resins, processes for producing the same and methods of using the same

Moisture resistant, flexible epoxy/cyanate ester formulation

Epoxy adhesive composition method of preparing and using

Thermosetting resin composition and laminates and circuit board substrates made by using the same

Thermosetting resin composition for high speed transmission circuit board

Curable compositions for advanced processes, and products made therefrom

Binder combinations for highly resistant plastic paints

Bismaleimide-thiol-epoxy polymer compositions, and methods of making and using the same