99184 ⎘
Polycondensates containing more than one epoxy group per molecule ; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used Curing agents not provided for by the groups -
Sub-classes:COATED LENS AND METHOD FOR MANUFACTURING THE SAME
#2CURABLE, ONE-PART, DUAL-STAGE THIOL-ENE-EPOXY LIQUID ADHESIVES AND METHODS
#3EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF
#4CURING AGENT, METHOD OF PRODUCING CURING AGENT, AND CURABLE COMPOSITION
#5INDUCTION HEATING-CURED ADHESIVES
#6Underfill for chip packaging and chip packaging structure
#7Benzocyclobutene curatives for low thermal expansion thermosets
#8CARBONATE-CONTAINING EPOXY RESIN, MANUFACTURING METHOD THEREOF, EPOXY CURABLE PRODUCT PREPARED THEREBY AND METHOD FOR DEGRADING EPOXY CURABLE PRODUCT
#9LATENT CURING CATALYSTS AND RESIN COMPOSITION CONTAINING THE SAME
#10Green epoxy resin with biobinder from manure
#11Cationically curable composition and method for the joining, casting and coating of substrates using the composition
#12Epoxy resin composition and cured product thereof
#13Photosensitive Resin Composition
#14Resin film for interlayer insulating layer with support, multilayer printed circuit board, and method of manufacturing multilayer printed circuit board
#15Polymer comprising a plurality of phenothiazine groups and methods of making the same
#16CURABLE COMPOSITION AND ITS USE FOR ELECTRIC DEVICE
#17LOW-LOSS INSULATING RESIN COMPOSITION AND INSULATING FILM USING THE SAME
#18Green epoxy resin with biobinder from manure
#19Metal-clad laminate, metal member with resin, and wiring board
#20A Thermosetting Epoxy Resin Composition for the Preparation of Outdoor Articles, and the Articles Obtained Therefrom
#21Adhesive compositions
#22RESIN COMPOSITION AND MULTILAYER SUBSTRATE
#23Polymer comprising a plurality of phenothiazine groups and methods of making the same
#24APCHA as a building block in curing agent formulations for structural adhesives
#25Adhesive composition, adhesive film comprising same, and organic electronic device comprising same
#26Adhesive film and organic electronic device comprising the same
#27Cyclic carbonates
#28Cold curing epoxy resin primer or adhesive
#29Amine for rapid-curing epoxy resin compositions
#30NANOCOMPOSITE MICROCAPSULES FOR SELF-HEALING OF COMPOSITE ARTICLES
#31Polymer comprising a plurality of phenothiazine groups and methods of making the same
#32Photosensitive resin composition for optical waveguide, photocurable film for formation of optical waveguide core layer, optical waveguide produced by using the resin composition or the photocurable film, and hybrid flexible printed wiring board for optical/electrical transmission
#33Polymer comprising a plurality of phenothiazine groups and methods of making the same
#34PROCESSING-FRIENDLY DIANHYDRIDE HARDENER FOR EPOXY RESIN SYSTEMS BASED ON 5,5'-CARBONYLBIS(ISOBENZOFURAN-1,3-DIONE)
#35Aromatic aldehyde, and epoxy resin curing agent and epoxy resin composition comprising the aromatic aldehyde
#36Amine/epoxy curing of benzoxazines
#37Resin composition, prepreg, and laminate
#38Polymer comprising a plurality of phenothiazine groups and methods of making the same
#39Gel time controllable two part epoxy adhesive
#40Curable compositions
#41Curable and cured compositions
#42One liquid type cyanate ester-epoxy composite resin composition
#43Compositions comprising solvated aromatic amines and methods for the preparation thereof
#44Clathrate, curing agent, cure accelerator, epoxy resin composition, and epoxy resin composition for encapsulation of semiconductor
#45Polymer bonded redox molecules and methods of making the same
#46ADHESION PROMOTER COMPOUNDS FOR OILED STEEL
#47High thermal conductivity materials with grafted surface functional groups
#48SILICA-CONTAINING EPOXY CURING AGENT AND CURED EPOXY RESIN PRODUCT
#49Curatives for epoxy compositions
#50One liquid type cyanate-epoxy composite resin composition, its hardened material, manufacturing method thereof, and materials for sealing and adhesive agents using the same
#51Curing agents for epoxy resins
#52Composite materials with improved burn properties
#53Epoxy resins with improved burn properties
#54HIGH-SOLID ANTICORROSIVE COATING COMPOSITION, HIGH-SOLID RAPIDLY-CURABLE ANTICORROSIVE COATING COMPOSITION, METHOD OF COATING SHIP OR THE LIKE, HIGH-SOLID ANTICORROSIVE FILM AND RAPIDLY CURED HIGH- ANTICORROSIVE FILM OBTAINED, AND COATED SHIP AND UNDERWATER STRUCTURE COATED WITH THESE COATING FILMS
#55Method for the synthesis of a polyoxadiazole polymer
#56Halogen-free flameproof epoxy resin formulations
#57Polymerizable composition
#58Radiation curable cycloaliphatic barrier sealants
#59Radiation curable cycloaliphatic barrier sealants
#60Metallic acrylate curing agents and usage thereof in intermediate compositions
#61Metal-acrylate curing agents
#62LCT-epoxy polymers with HTC-oligomers and method for making the same
#63Homogeneous alumoxane-LCT-epoxy polymers and methods for making the same