Two-Component Rapid Cure Adhesive

EPOXY-GEOPOLYMER HYBRID FOAM

Underwater Curable Thermoset Composition

Reaction Induced Color-Change Composition

RAPID-CURING, LOW-TEMPERATURE COMPOSITION FOR THE PRODUCTION OF PRESSURISED TANKS MADE OF A COMPOSITE MATERIAL FOR THE ON-BOARD STORAGE OF HYDROGEN GAS

EPOXY RESIN COMPOSITIONS COMPRISING DICYANDIAMID CURING AGENT

PHOTOCURABLE COMPOSITION AND METHOD FOR FORMING PATTERN

RAPID-CURING COMPOSITION FOR THE PRODUCTION OF SEMI-FINISHED PRODUCTS ENABLING THE PRODUCTION OF COMPOSITE TYPE IV PRESSURE TANKS FOR THE ON-BOARD STORAGE OF HYDROGEN GAS

Esterified Acids for Use in Polymeric Materials

EPOXY RESIN PRODUCTION METHOD, EPOXY RESIN COMPOSITION, CURED PRODUCT, AND ELECTRIC/ELECTRONIC COMPONENT

Environment-friendly and flame-retardant abradable seal coating material with ultra-low density and use method thereof

Esterified acids for use in polymeric materials

ADHESIVE FOR ENDOSCOPE, CURED PRODUCT THEREOF, ENDOSCOPE, AND METHOD FOR PRODUCING THE SAME

Epoxy resin systems

Solvent-less ionic liquid epoxy resin

PULTRUSION WITH EXTRUDED GASKET FOAM

Two-Part Phosphate Ester Elastomeric Epoxy Composition and Method of Use Thereof

COMPOSITION FOR FORMING THERMALLY CONDUCTIVE MATERIAL, AND THERMALLY CONDUCTIVE MATERIAL

ACTIVE ESTER COMPOSITION AND SEMICONDUCTOR SEALING MATERIAL

RESIN COMPOSITION, RESIN SHEET, CURED RESIN PRODUCT, RESIN SUBSTRATE, AND LAMINATE SUBSTRATE

Esterified acids for use in polymeric materials

THERMOSETTING RESIN COMPOSITION

Method for preparing fluorine-silicon-containing polyphosphate ester and flame retardant epoxy resin

Low DK phosphorous containing hardener useful for halogen free, flame retardant polymers and use

Epoxy resin systems

DCPD-derived polyether and method of producing the same

FLAME-RETARDANT, HIGH TEMPERATURE RESISTANT THERMOSETS ON THE BASIS OF NAPHTHALENE-BASED EPOXY RESINS AND CYANATE ESTERS

Active ester curing agent compound for thermosetting resins, flame retardant composition comprising same, and articles made therefrom

CURABLE COMPOSITION, ADHESIVE, ARTICLE HAVING COATING LAYER, FIBER-REINFORCED COMPOSITE MATERIAL, POTTING AGENT AND CURABLE COMPOSITION KIT

Halogen-free epoxy resin composition having low dielectric loss

Curing of epoxy resins with phosphonate oligomers

Resin composition, and prepreg, metal-clad laminate, and printed circuit board prepared using the same

Esterified acids for use in polymeric materials

Method of manufacturing cured phosphorus-containing flame-retardant epoxy composite

LOW DK PHOSPHOROUS CONTAINING HARDENER USEFUL FOR HALOGEN FREE, FLAME RETARDANT POLYMERS AND USE

Flame-retardant, high temperature resistant thermosets on the basis of naphthalene-based epoxy resins and cyanate esters

HALOGEN FREE EPOXY FORMULATIONS WITH LOW DIELECTRIC CONSTANT

FLAME RETARDANT COMPOUNDS, HARDENERS AND POLYPHENOL-BASED EPOXY RESINS

Flame retardant for epoxy resin containing phosphonate and phosphinate functionality

Phosphorus-containing compound and curing epoxy resin composition containing same

Halogen-free thermosetting resin composition, prepreg and laminate for printed circuit prepared from the same

Halogen-free thermosetting resin composition, and prepreg and laminate for printed circuits using the same

LATENT CATALYTIC CURING AGENT

Polyphosphazenes

Polyphosphazenes

Phosphor-containing phenol formaldehyde resin and flame-retardant epoxy resin hardener containing thereof

Cyclotriphosphazene compound, method of preparing the same, electrolyte for lithium secondary battery including the cyclotriphosphazene compound, and lithium secondary battery including the electrolyte

Resin composition, hardened coating films therefrom, and photosemiconductor device using same

Curable compositions

Epoxy resin composition for sealing, and electronic component device

Prepreg, metal-clad laminate, and printed circuit board

Low-k, flame-retardant, bi-functional benzoxazine and method for making the same

Resin composition and uses of the same

Epoxy resin composition and pre-preg, support-provided resin film, metallic foil clad laminate plate and multilayer printed circuit board utilizing said composition

Stable solution of ring-opened polymer and the use thereof

RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION, AND SEMICONDUCTOR DEVICE USING SAME

Flame-retardant hardner for epoxy resin and flame-retardant resin material comprising the same

Phosphorus-containing phenol novolac resin, hardener comprising the same and epoxy resin composition

Halogen-free flame-retardant epoxy resin composition, and prepreg and printed circuit board using the same

EPOXY RESIN COMPOSITION FOR SEALING PACKING OF SEMICONDUCTOR, SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREOF

LIQUID RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

Curing accelerator for epoxy resin composition, and one-pack type thermosetting epoxy resin composition

Phosphorous-Containing Flame Retardant Epoxy Resin Composition, Prepreg and Laminate Thereof

FLAME RETARDANT EPOXY RESIN COMPOSITION, PREPREG AND LAMINATE THEREOF

Varnish and prepreg, and substrates thereof

Thermoplastic polyhydroxy polyether resin and resin composition comprising the same

Epoxy resin composition for prepreg, prepreg and multilayered printed wiring board

Method of stabilizing metal pigments against gassing

Composition of epoxy resin and epoxy-reactive polyphosphonate

Layer of reaction product of epoxy and phosphorus materials and curing agent on substrate

Composition of epoxy resin, OH-terminated phosphonate oligomer and inorganic filler

1, 4-Hydroquinone functionalized phosphinates and phosphonates

Method of stabilizing metal pigments against gassing

Corrosion and alkali-resistant compositions and methods for using the same

Oligomeric, hydroxy-terminated phosphonates

Corrosion and alkali-resistant compositions and methods for using the same