99194 ⎘
Polycondensates containing more than one epoxy group per molecule ; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used; Curing agents not provided for by the groups - boron containing compounds
Reversible Epoxy Polymer with Dynamic Boronic Bond
#2RESIN COMPOSITION FOR OPTICAL WAVEGUIDE, AND DRY FILM AND OPTICAL WAVEGUIDE USING SAME
#3Epoxy resin composition, intermediate substrate, and fiber-reinforced composite material
#4Impregnation resin mixture
#5Carrier Nanoparticles And Related Compositions, Methods And Systems
#6Curable composition, cured film, display panel or OLED light, and method for producing cured product
#7Carrier nanoparticles and related compositions, methods and systems
#8Curable composition, cured product, cured film, display panel, and method for producing cured product
#9Carrier nanoparticles and related compositions, methods and systems
#10Low temperature curing composition, cured film formed therefrom, and electronic device having cured film
#11Carrier nanoparticles and related compositions, methods and systems
#12Carrier nanoparticles and related compositions, methods and systems
#13Carrier nanoparticles and related compositions, methods and systems
#14Epoxy resin composition
#15Carrier nanoparticles and related compositions, methods and systems
#16Carrier nanoparticles and related compositions, methods and systems
#17Low temperature, cationically curable compositions with improved cure speed and toughness
#18Epoxy resin composition and method for producing heat-resistant laminate sheet