Patents-Review.com
ClassID:

99205 ⎘

C08G59/4261 - CPC Classification

Classification description:

Polycondensates containing more than one epoxy group per molecule ; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used; Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof polymers with carboxylic terminal groups Macromolecular compounds obtained by reactions involving only unsaturated carbon-to-carbon bindings

Recent Application in this class:
#1
20260015462
2026-01-15

THERMOSETTING BISCITRACONIMIDE RESIN COMPOSITION

 #2
20240327567
2024-10-03

Low Temperature Curable One Component Epoxy Compositions containing Resin-Blocked Urea Curatives

 #3
20240318031
2024-09-26

WATERBORNE ACID-EPOXY COATING COMPOSITION

 #4
20240279506
2024-08-22

COATING COMPOSITIONS, DIELECTRIC COATINGS FORMED THEREFROM, AND METHODS OF PREPARING DIELECTRIC COATINGS

 #5
20230045615
2023-02-09

Thermosetting epoxy resin composition and prepreg, laminated board and printed circuit board using thermosetting epoxy resin composition

 #6
20220356298
2022-11-10

Room temperature ionic liquid curing agent

 #7
20220073781
2022-03-10

Coating compositions, dielectric coatings formed therefrom, and methods of preparing dielectric coatings

 #8
20210301073
2021-09-30

Polyolefin dispersion and epoxy dispersion blends for improved damage tolerance

 #9
20210230356
2021-07-29

SHEET MOLDING COMPOUND AND MOLDED ARTICLE

 #10
20200040216
2020-02-06

Coating compositions, dielectric coatings formed therefrom, and methods of preparing dielectric coatings

 #11
20190330412
2019-10-31

ROOM TEMPERATURE IONIC LIQUID CURING AGENT

 #12
20180304604
2018-10-25

THERMOSET RESIN COMPOSITION, AND PREPREG AND LAMINATED BOARD MADE OF SAME

 #13
20180291242
2018-10-11

Adhesive composition, and method of bonding an adherend and method of producing a stack, each of which uses the same

 #14
20170226275
2017-08-10

CURABLE COMPOSITIONS

 #15
20160340468
2016-11-24

HALOGEN FREE EPOXY FORMULATIONS WITH LOW DIELECTRIC CONSTANT

 #16
20160280845
2016-09-29

Epoxy resin curing agents, epoxy resin compositions, epoxy resin cured products, and methods of producing epoxy resin curing agent

 #17
20160234934
2016-08-11

Resin composition, prepreg, metal foil with resin, metal-clad laminated plate, and printed wiring board

 #18
20160194438
2016-07-07

Curable compositions

 #19
20150111043
2015-04-23

Anti-fogging film-forming material, coating liquid for forming anti-fogging film, anti-fogging article, and methods for producing these

 #20
20120289113
2012-11-15

Thermosetting Resin Compositions For High Performance Laminates

 #21
20120168074
2012-07-05

Sheet for forming hard coating

 #22
20120142817
2012-06-07

One component epoxy structural adhesive composition prepared from renewable resources

 #23
20120083564
2012-04-05

HARDENER COMPOSITION FOR EPOXY RESINS

 #24
20120024580
2012-02-02

EPOXY RESIN COMPOSITION, AND PREPREG AND PRINTED CIRCUIT BOARD USING THE SAME

 #25
20120007259
2012-01-12

Latent hardener with improved barrier properties and compatibility

 #26
20110278052
2011-11-17

Halogen-free flame-retardant epoxy resin composition, and prepreg and printed circuit board using the same

 #27
20110220401
2011-09-15

Latent hardener with improved barrier properties and compatibility

 #28
20110114972
2011-05-19

Optical semiconductor sealing resin composition and optical semiconductor device using same

 #29
20110111662
2011-05-12

Thermosetting resin composition for high performance laminates

 #30
20110092640
2011-04-21

Composition of modified maleic anhydride and epdxy resin

 #31
20110084413
2011-04-14

THERMOSETTING DIE-BONDING FILM

 #32
20110084408
2011-04-14

THERMOSETTING DIE-BONDING FILM

 #33
20100048766
2010-02-25

HALOGEN-FREE PHOSPHOROUS EPOXY RESIN COMPOSITION

 #34
20100009201
2010-01-14

Prepreg and laminate of epoxy resin, styrene-maleic anhydride copolymer and bis-maleimidetriazine

 #35
20090137777
2009-05-28

Polyepoxy compound, method for producing same, thermosetting resin composition containing same, cured product of such composition, and method for removing such cured product

 #36
20090023855
2009-01-22

Curable resin, production method thereof, epoxy resin composition, and electronic device

 #37
20080103224
2008-05-01

Near infrared radiation curable powder coating composition having enhanced flow characteristics

 #38
20070194274
2007-08-23

Low odor binders curable at room temperature

 #39
20070155917
2007-07-05

Composition of carboxyl acryl resin and epoxy acryl resin

 #40
20070116961
2007-05-24

ANISOTROPIC CONDUCTIVE ADHESIVE COMPOSITIONS

 #41
20060154080
2006-07-13

Anhydride polymers for use as curing agents in epoxy resin-based underfill material

 #42
20050250916
2005-11-10

Epoxy resin, SMA copolymer and bis-maleimidetriazine resin

 #43
20050228117
2005-10-13

Near infrared radiation curable powder coating composition having enhanced flow characteristics

 #44
20050215730
2005-09-29

Polycarboxy-functionalized prepolymers

 #45
20050045295
2005-03-03

Low odor binders curable at room temperature

 #46
20050045294
2005-03-03

Low odor binders curable at room temperature

 #47
20050025987
2005-02-03

Powder coating compositions