99203 ⎘
Polycondensates containing more than one epoxy group per molecule ; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used; Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof polymers with carboxylic terminal groups
Sub-classes:Transparent conductive substrate and method for producing same
#2Thermosetting epoxy resin compositions useful as structural reinforcement or structural foam
#3COMPOSITION FOR FORMING LIGHT SCATTERING COMPOSITE BODY, LIGHT SCATTERING COMPOSITE BODY AND METHOD FOR PRODUCING SAME
#4Adduct Thermosetting Surfacing Film and Method of Forming the Same
#5Epoxy resin composition for transparent sheets and cured product thereof
#6Epoxy resin composition for transparent sheets and cured product thereof
#7Resin composition, pre-preg, laminate, metal foil-clad laminate, and printed wiring board
#8Epoxy resins for waterborne dispersions
#9Heat-curing powder-lacquer compositions yielding a matte surface after curing of the coating, as well as a simple method for production of same
#10Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate
#11Epoxy resin composition for transparent sheets and cured product thereof
#12Epoxy resin composition for fiber-reinforced composite material, prepreg, and fiber-reinforced composite material
#13Shape memory material based on a structural adhesive
#14HEAT-CURABLE POWDER COATING COMPOSITIONS, WHICH AFTER THE COATING HAS CURED RESULT IN A MATT SURFACE AND SIMPLE METHOD FOR PRODUCING SAME
#15Liquid epoxy resin composition for semiconductor encapsulation
#16Resin composition and uses of the same
#17Copolymer of styrene and maleic anhydride comprising an epoxy resin composition and a co-cross-linking agent
#18Adduct thermosetting surfacing film and method of forming the same
#19Heat curable epoxy resin composition with water as foaming agent
#20PAINT COMPOSITION AND COATING FILM FORMATION METHOD
#21Heat-curing powder-lacquer compositions yielding a matte surface after curing of the coating, as well as a simple method for production of same
#22Curable composition comprising a thermolatent base
#23Heat-curing powder-lacquer compositions yielding a matte surface after curing of the coating, as well as a simple method for production of same
#24Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate
#25Thermosetting resin composition
#26THERMAL CURABLE POWDER COATING COMPOSITION
#27Heat sealable coating compositions
#28Photo- and/or thermo-curable copolymer, curable resin compositions, and cured articles
#29Protective sealable coating compositions
#30Non-aqueous, liquid coating compositions
#31Powder clear coating composition
#32Laminate made from epoxy resin, styrene-maleic anhydride copolymer and crosslinkers
#33Paint compositions and coating film forming method
#34Two Packages Type Thermosetting Resin Composition, Film Forming Method and Coated Article
#35Epoxy resin, styrene-maleic anhydride copolymer and crosslinking agent
#36Low odor binders curable at room temperature
#37Catalyst for curing epoxy resins, epoxy resin composition, and powder coating composition
#38Copolymer of styrene and maleic anhydride comprising an epoxy resin composition and a co-cross linking agent