ClassID:

99233

C08G59/58 - CPC Classification

Classification description:

Polycondensates containing more than one epoxy group per molecule ; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used; Amines together with other curing agents with polycarboxylic acids or with anhydrides, halides, or low-molecular-weight esters thereof

Recent Application in this class:
#1
20260117017
2026-04-30

CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF

#2
20260109849
2026-04-23

EPOXY RESIN COMPOSITION, RESIN PASTE, FILM-TYPE ADHESIVE, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE

#3
20260098149
2026-04-09

RESIN COMPOSITION FOR MOLDING AND ELECTRONIC COMPONENT DEVICE

#4
20260078214
2026-03-19

CURING AGENT FOR EPOXY RESINS, WHICH CURING AGENT HAS DIPHENOLIC ACID

#5
20250354037
2025-11-20

METHODS, SYSTEMS, DEVICES AND KITS FOR FORMULATING STRUCTURAL ADHESIVES

#6
20250297055
2025-09-25

METHOD FOR PREPARING AN EPOXY-DERIVED COVALENT ADAPTABLE NETWORK

#7
20250223488
2025-07-10

DEGRADABLE LOST CIRCULATION MATERIAL FOR PROTECTION OIL AND GAS RESERVOIRS, AND PREPARATION METHOD AND USE THEREOF

#8
20230067778
2023-03-02

EPOXY-DERIVED COVALENT ADAPTABLE NETWORKS AND METHODS OF THEIR PRODUCTION

#9
20220356298
2022-11-10

Room temperature ionic liquid curing agent

#10
20220135733
2022-05-05

Method of lining a pipeline with a delayed curing resin composition

#11
20210198417
2021-07-01

EPOXY RESIN COMPOSITION, FIBER REINFORCED MATERIAL, MOLDED ARTICLE, AND PRESSURE VESSEL

#12
20200399421
2020-12-24

Electrical device comprising a cross-linked layer

#13
20200154608
2020-05-14

Insulating heat dissipation coating composition and insulating heat dissipation unit formed using the same

#14
20200109233
2020-04-09

Curable epoxy resin composition, fiber-reinforced composite material and molded body using same

#15
20200087446
2020-03-19

Low temperature anhydride epoxy cured systems

#16
20190330413
2019-10-31

CURING AGENT COMPOSITIONS FOR THERMOSETTING EPOXY RESIN COMPOSITIONS

#17
20190330412
2019-10-31

ROOM TEMPERATURE IONIC LIQUID CURING AGENT

#18
20180201722
2018-07-19

Curable compositions

#19
20180105635
2018-04-19

Method of lining a pipeline with a delayed curing resin composition

#20
20180057632
2018-03-01

CONDUCTIVE COMPOSITION FOR FORMING SOLAR CELL COLLECTOR ELECTRODE, SOLAR CELL, AND SOLAR CELL MODULE

#21
20170275416
2017-09-28

Epoxy resin, method for producing epoxy resin, curable resin composition, cured product, fiber reinforced composite material, and molded article

#22
20170226351
2017-08-10

METHOD FOR PROTECTING A SUBSTRATE FROM LIGHTNING STRIKES

#23
20170198135
2017-07-13

Halogen free resin composition and prepreg and laminated board prepared therefrom

#24
20170121451
2017-05-04

Epoxy resin, method for producing epoxy resin, curable resin composition and cured product thereof, fiber-reinforced composite material, and molded article

#25
20160362565
2016-12-15

METHOD FOR PROTECTING A SUBSTRATE FROM LIGHTNING STRIKES

#26
20160208143
2016-07-21

Resin composition for printed circuit board, resin varnish using the same, adhesive film, prepreg and printed wiring board

#27
20150111991
2015-04-23

Aromatic aldehyde, and epoxy resin curing agent and epoxy resin composition comprising the aromatic aldehyde

#28
20120202918
2012-08-09

Curable epoxy resin composition

#29
20110014356
2011-01-20

Method for protecting a substrate from lightning strikes

#30
20100315105
2010-12-16

METHOD FOR SHIELDING A SUBSTRATE FROM ELECTROMAGNETIC INTERFERENCE

#31
20100210793
2010-08-19

One liquid type cyanate-epoxy composite resin composition, its hardened material, manufacturing method thereof, and materials for sealing and adhesive agents using the same

#32
20080139733
2008-06-12

Epoxy and silane group-containing oligomers and polymers and a method for the production and the use thereof

#33
20080114205
2008-05-15

Endoscope Apparatus

#34
20070191556
2007-08-16

Polymeric epoxy resin composition

#35
20070185244
2007-08-09

Moulding composition for producing bipolar plates

#36
20050065317
2005-03-24

Polyepoxy resin compositions